0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
MC78L08ACD

MC78L08ACD

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOIC8_150MIL

  • 描述:

    IC REG LINEAR 8V 100MA 8SOIC

  • 数据手册
  • 价格&库存
MC78L08ACD 数据手册
DATA SHEET www.onsemi.com Positive Voltage Regulators 100 mA MC78L00A Series, NCV78L00A The MC78L00A Series of positive voltage regulators are inexpensive, easy−to−use devices suitable for a multitude of applications that require a regulated supply of up to 100 mA. Like their higher powered MC7800 and MC78M00 Series cousins, these regulators feature internal current limiting and thermal shutdown making them remarkably rugged. No external components are required with the MC78L00 devices in many applications. These devices offer a substantial performance advantage over the traditional zener diode−resistor combination, as output impedance and quiescent current are substantially reduced. Features • • • • • • • • Wide Range of Available, Fixed Output Voltages Low Cost Internal Short Circuit Current Limiting Internal Thermal Overload Protection No External Components Required Complementary Negative Regulators Offered (MC79L00A Series) NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These are Pb−Free Devices Input Q11 Q5 Q3 15k 1 12 3 STRAIGHT LEAD 2 3 BENT LEAD Pin: 1. Output 2. Ground 3. Input TO−92 P SUFFIX CASE 29−10 SOIC−8* D SUFFIX CASE 751 SOT−89 CASE 528AG *SOIC−8 is an internally modified SO−8 package. Pins 2, 3, 6, and 7 are electrically common to the die attach flag. This internal lead frame modification decreases package thermal resistance and increases power dissipation capability when appropriately mounted on a printed circuit board. SOIC−8 conforms to all external dimensions of the standard SO−8 package. PIN CONNECTIONS VOUT 1 8 VIN GND 2 7 GND GND 3 6 GND NC 4 5 NC (Top View) TAB Q12 Q1 Q10 5.0k 3.8k Q4 1.9k 1.2k Q6 Output 1 2 3 VOUT GND VIN (Top View) 0-25k 19k 2.2k Q9 C ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Q8 Q2 Z1 3.0 2.85k Q7 420 1.0k Ground DEVICE MARKING INFORMATION See general marking information in the device marking section on page 12 of this data sheet. Figure 1. Representative Schematic Diagram © Semiconductor Components Industries, LLC, 1999 August, 2021 − Rev. 20 1 Publication Order Number: MC78L00A/D MC78L00A Series, NCV78L00A Input MC78LXXA Cin* 0.33 mF Output CO** 0.1 mF Figure 2. Standard Application A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output voltage even during the low point on the input ripple voltage. * Cin is required if regulator is located an appreciable distance from power supply filter. ** CO is not needed for stability; however, it does improve transient response. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (5.0 V−9.0 V) Input Voltage (12 V−18 V) Input Voltage (24 V) VI 30 35 40 Vdc Storage Temperature Range Tstg −65 to +150 °C Maximum Junction Temperature TJ 150 °C Moisture Sensitivity Level ESD Capability, Human Body Model (Note 1) MSL 1 − ESDHBM 2000 V ESD Capability, Machine Model (Note 1) ESDMM 200 V ESD Capability, Charged Device Model (Note 1) ESDCDM 2000 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model. THERMAL CHARACTERISTICS Rating Symbol Value Unit PD Internally Limited W Thermal Characteristics, TO−92 Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W Thermal Characteristics, SOIC8 Thermal Resistance, Junction−to−Ambient RqJA Refer to Figure 8 °C/W Thermal Characteristics, SOT−89 Thermal Resistance, Junction−to−Ambient RqJA 55 °C/W Package Dissipation 2. Thermal Resistance, Junction−to−Ambient depends on P.C.B. Copper area. See details in Figure 8. Thermal Resistance, Junction−to−Case is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board. www.onsemi.com 2 MC78L00A Series, NCV78L00A ELECTRICAL CHARACTERISTICS (VI = 10 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, − 40°C < TJ < +125°C (for MC78LXXAB, NCV78L05A), 0°C < TJ < +125°C (for MC78LXXAC), unless otherwise noted.) MC78L05AC, AB, NCV78L05A Characteristics Symbol Min Typ Max Unit Output Voltage (TJ = +25°C) VO 4.8 5.0 5.2 Vdc Line Regulation (TJ = +25°C, IO = 40 mA) 7.0 Vdc ≤ VI ≤ 20 Vdc 8.0 Vdc ≤ VI ≤ 20 Vdc Regline Load Regulation (TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA) (TJ = +25°C, 1.0 mA ≤ IO ≤ 40 mA) Regload Output Voltage (7.0 Vdc ≤ VI ≤ 20 Vdc, 1.0 mA ≤ IO ≤ 40 mA) (VI = 10 V, 1.0 mA ≤ IO ≤ 70 mA) VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change (8.0 Vdc ≤ VI ≤ 20 Vdc) (1.0 mA ≤ IO ≤ 40 mA) DIIB mV − − 55 45 150 100 − − 11 5.0 60 30 4.75 4.75 − − 5.25 5.25 − − 3.8 − 6.0 5.5 − − − − 1.5 0.1 mV Vdc mA mA Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 40 − mV Ripple Rejection (IO = 40 mA, f = 120 Hz, 8.0 Vdc ≤ VI ≤ 18 V, TJ = +25°C) RR 41 49 − dB VI − VO − 1.7 − Vdc Dropout Voltage (TJ = +25°C) NOTE: NCV78L05A: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. ELECTRICAL CHARACTERISTICS (VI = 14 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, − 40°C < TJ < +125°C (for MC78LXXAB), 0°C < TJ < +125°C (for MC78LXXAC), unless otherwise noted.) MC78L08AC, AB Characteristics Symbol Min Typ Max Unit Output Voltage (TJ = +25°C) VO 7.7 8.0 8.3 Vdc Line Regulation (TJ = +25°C, IO = 40 mA) 10.5 Vdc ≤ VI ≤ 23 Vdc 11 Vdc ≤ VI ≤ 23 Vdc Regline Load Regulation (TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA) (TJ = +25°C, 1.0 mA ≤ IO ≤ 40 mA) Regload Output Voltage (10.5 Vdc ≤ VI ≤ 23 Vdc, 1.0 mA ≤ IO ≤ 40 mA) (VI = 14 V, 1.0 mA ≤ IO ≤ 70 mA) VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change (11 Vdc ≤ VI ≤ 23 Vdc) (1.0 mA ≤ IO ≤ 40 mA) DIIB mV − − 20 12 175 125 − − 15 8.0 80 40 7.6 7.6 − − 8.4 8.4 − − 3.0 − 6.0 5.5 − − − − 1.5 0.1 mV Vdc mA mA Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 60 − mV Ripple Rejection (IO = 40 mA, f = 120 Hz, 12 V ≤ VI ≤ 23 V, TJ = +25°C) RR 37 57 − dB VI − VO − 1.7 − Vdc Dropout Voltage (TJ = +25°C) www.onsemi.com 3 MC78L00A Series, NCV78L00A ELECTRICAL CHARACTERISTICS (VI = 15 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, − 40°C < TJ < +125°C (for MC78LXXAB), 0°C < TJ < +125°C (for MC78LXXAC), unless otherwise noted.) MC78L09AC, AB Symbol Min Typ Max Unit Output Voltage (TJ = +25°C) Characteristics VO 8.6 9.0 9.4 Vdc Line Regulation (TJ = +25°C, IO = 40 mA) 11.5 Vdc ≤ VI ≤ 24 Vdc 12 Vdc ≤ VI ≤ 24 Vdc Regline Load Regulation (TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA) (TJ = +25°C, 1.0 mA ≤ IO ≤ 40 mA) Regload Output Voltage (11.5 Vdc ≤ VI ≤ 24 Vdc, 1.0 mA ≤ IO ≤ 40 mA) (VI = 15 V, 1.0 mA ≤ IO ≤ 70 mA) VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change (11 Vdc ≤ VI ≤ 23 Vdc) (1.0 mA ≤ IO ≤ 40 mA) DIIB mV − − 20 12 175 125 − − 15 8.0 90 40 8.5 8.5 − − 9.5 9.5 − − 3.0 − 6.0 5.5 − − − − 1.5 0.1 mV Vdc mA mA Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 60 − mV Ripple Rejection (IO = 40 mA, f = 120 Hz, 13 V ≤ VI ≤ 24 V, TJ = +25°C) RR 37 57 − dB VI − VO − 1.7 − Vdc Dropout Voltage (TJ = +25°C) ELECTRICAL CHARACTERISTICS (VI = 19 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, − 40°C < TJ < +125°C (for MC78LXXAB), 0°C < TJ < +125°C (for MC78LXXAC), unless otherwise noted.) MC78L12AC, AB Symbol Min Typ Max Unit Output Voltage (TJ = +25°C) Characteristics VO 11.5 12 12.5 Vdc Line Regulation (TJ = +25°C, IO = 40 Ma) 14.5 Vdc ≤ VI ≤ 27 Vdc 16 Vdc ≤ VI ≤ 27 Vdc Regline Load Regulation (TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA) (TJ = +25°C, 1.0 mA ≤ IO ≤ 40 mA) Regload Output Voltage (14.5 Vdc ≤ VI ≤ 27 Vdc, 1.0 mA ≤ IO ≤ 40 mA) (VI = 19 V, 1.0 mA ≤ IO ≤ 70 mA) VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change (16 Vdc ≤ VI ≤ 27 Vdc) (1.0 mA ≤ IO ≤ 40 mA) DIIB mV − − 120 100 250 200 − − 20 10 100 50 11.4 11.4 − − 12.6 12.6 − − 4.2 − 6.5 6.0 − − − − 1.5 0.1 mV Vdc mA mA Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 80 − mV Ripple Rejection (IO = 40 mA, f = 120 Hz, 15 V ≤ VI ≤ 25 V, TJ = +25°C) RR 37 42 − dB VI − VO − 1.7 − Vdc Dropout Voltage (TJ = +25°C) www.onsemi.com 4 MC78L00A Series, NCV78L00A ELECTRICAL CHARACTERISTICS (VI = 23 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, − 40°C < TJ < +125°C (for MC78LXXAB), 0°C < TJ < +125°C (for MC78LXXAC), unless otherwise noted.) MC78L15AC, AB / NCV78L15A Symbol Min Typ Max Unit Output Voltage (TJ = +25°C) Characteristics VO 14.4 15 15.6 Vdc Line Regulation (TJ = +25°C, IO = 40 mA) 17.5 Vdc ≤ VI ≤ 30 Vdc 20 Vdc ≤ VI ≤ 30 Vdc Regline Load Regulation (TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA) (TJ = +25°C, 1.0 mA ≤ IO ≤ 40 mA) Regload Output Voltage (17.5 Vdc ≤ VI ≤ 30 Vdc, 1.0 mA ≤ IO ≤ 40 mA) (VI = 23 V, 1.0 mA ≤ IO ≤ 70 mA) VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change (20 Vdc ≤ VI ≤ 30 Vdc) (1.0 mA ≤ IO ≤ 40 mA) DIIB mV − − 130 110 300 250 − − 25 12 150 75 14.25 14.25 − − 15.75 15.75 − − 4.4 − 6.5 6.0 − − − − 1.5 0.1 mV Vdc mA mA Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 90 − mV Ripple Rejection (IO = 40 mA, f = 120 Hz, 18.5 V ≤ VI ≤ 28.5 V, TJ = +25°C) RR 34 39 − dB VI − VO − 1.7 − Vdc Dropout Voltage (TJ = +25°C) ELECTRICAL CHARACTERISTICS (VI = 27 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, 0°C < TJ < +125°C, unless otherwise noted.) MC78L18AC Characteristics Symbol Min Typ Max Unit Output Voltage (TJ = +25°C) VO 17.3 18 18.7 Vdc Line Regulation (TJ = +25°C, IO = 40 mA) 21.4 Vdc ≤ VI ≤ 33 Vdc 20.7 Vdc ≤ VI ≤ 33 Vdc 22 Vdc ≤ VI ≤ 33 Vdc 21 Vdc ≤ VI ≤ 33 Vdc Regline Load Regulation (TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA) (TJ = +25°C, 1.0 mA ≤ IO ≤ 40 mA) Regload Output Voltage (21.4 Vdc ≤ VI ≤ 33 Vdc, 1.0 mA ≤ IO ≤ 40 mA) (20.7 Vdc ≤ VI ≤ 33 Vdc, 1.0 mA ≤ IO ≤ 40 mA) (VI = 27 V, 1.0 mA ≤ IO ≤ 70 mA) (VI = 27 V, 1.0 mA ≤ IO ≤ 70 mA) VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change (22 Vdc ≤ VI ≤ 33 Vdc) (21 Vdc ≤ VI ≤ 33 Vdc) (1.0 mA ≤ IO ≤ 40 mA) mV − 45 325 − 35 275 − − 30 15 170 85 mV Vdc 17.1 − 18.9 17.1 − 18.9 − − 3.1 − 6.5 6.0 mA mA DIIB − − − − 1.5 0.1 Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 150 − mV Ripple Rejection (IO = 40 mA, f = 120 Hz, 23 V ≤ VI ≤ 33 V, TJ = +25°C) RR 33 48 − dB VI − VO − 1.7 − Vdc Dropout Voltage (TJ = +25°C) www.onsemi.com 5 MC78L00A Series, NCV78L00A ELECTRICAL CHARACTERISTICS (VI = 33 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, 0°C < TJ < +125°C, unless otherwise noted.) MC78L24AC Characteristics Symbol Min Typ Max Unit Output Voltage (TJ = +25°C) VO 23 24 25 Vdc Line Regulation (TJ = +25°C, IO = 40 mA) 27.5 Vdc ≤ VI ≤ 38 Vdc 28 Vdc ≤ VI ≤ 80 Vdc 27 Vdc ≤ VI ≤ 38 Vdc Regline Load Regulation (TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA) (TJ = +25°C, 1.0 mA ≤ IO ≤ 40 mA) Regload Output Voltage (28 Vdc ≤ VI ≤ 38 Vdc, 1.0 mA ≤ IO ≤ 40 mA) (27 Vdc ≤ VI ≤ 38 Vdc, 1.0 mA ≤ IO ≤ 40 mA) (28 Vdc ≤ VI = 33 Vdc, 1.0 mA ≤ IO ≤ 70 mA) (27 Vdc ≤ VI ≤ 33 Vdc, 1.0 mA ≤ IO ≤ 70 mA) VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change (28 Vdc ≤ VI ≤ 38 Vdc) (1.0 mA ≤ IO ≤ 40 mA) DIIB mV − − − − 50 60 − 300 350 − − 40 20 200 100 mV Vdc 22.8 − 25.2 22.8 − 25.2 − − 3.1 − 6.5 6.0 − − − − 1.5 0.1 mA mA Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 200 − mV Ripple Rejection (IO = 40 mA, f = 120 Hz, 29 V ≤ VI ≤ 35 V, TJ = +25°C) RR 31 45 − dB VI − VO − 1.7 − Vdc Dropout Voltage (TJ = +25°C) Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 6 V I -V O , INPUT/OUTPUT DIFFERENTIAL VOLTAGE (V) MC78L00A Series, NCV78L00A MC78L05AC Vout = 5.0 V TJ = 25°C 6.0 IO = 1.0 mA 4.0 IO = 40 mA IO = 100 mA 2.0 0 0 2.0 4.0 6.0 VI, INPUT VOLTAGE (V) 8.0 10 Figure 3. Dropout Characteristics IO = 70 mA 2.0 1.5 IO = 40 mA 1.0 IO = 1.0 mA Dropout of Regulation is defined as when VO = 2% of VO 0.5 0 0 25 4.0 3.8 3.6 3.4 3.2 MC78L05AC VI = 10 V VO= 5.0 V IO = 40 mA 3.0 125 Figure 4. Dropout Voltage versus Junction Temperature 4.0 MC78L05AC Vout = 5.0 V IO = 40 mA TJ = 25°C 3.0 2.0 1.0 0 0 0 25 50 75 100 TA, AMBIENT TEMPERATURE (°C) 125 0 5.0 10 15 20 25 VI, INPUT VOLTAGE (V) 35 170 10,000 No Heatsink ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ 110 100 RqJA = 200°C/W PD(max) to 25°C = 625 mW 75 100 125 TA, AMBIENT TEMPERATURE (°C) 150 Figure 7. Maximum Average Power Dissipation versus Ambient Temperature − TO−92 Type Package Graph represents symmetrical layout 90 L 70 2.0 oz. Copper L 2.4 2.0 1.6 1.2 3.0 mm 50 0.8 RqJA 30 0 10 20 30 40 0.4 50 L, LENGTH OF COPPER (mm) Figure 8. SOIC−8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length www.onsemi.com 7 2.8 PD(max) for TA = 50°C 130 1000 50 40 3.2 150 10 25 30 Figure 6. Input Bias Current versus Input Voltage R θ JA, THERMAL RESISTANCE JUNCTION‐TO‐AIR (° C/W) Figure 5. Input Bias Current versus Ambient Temperature PD , POWER DISSIPATION (mW) 50 75 100 TJ, JUNCTION TEMPERATURE (°C) 5.0 I IB , INPUT BIAS CURRENT (mA) I IB , INPUT BIAS CURRENT (mA) 4.2 2.5 PD, MAXIMUM POWER DISSIPATION (W) VO, OUTPUT VOLTAGE (V) 8.0 MC78L00A Series, NCV78L00A APPLICATIONS INFORMATION Design Considerations input bypass capacitor should be selected to provide good high−frequency characteristics to insure stable operation under all load conditions. A 0.33 mF or larger tantalum, mylar, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with the shortest possible leads directly across the regulators input terminals. Good construction techniques should be used to minimize ground loops and lead resistance drops since the regulator has no external sense lead. Bypassing the output is also recommended. The MC78L00A Series of fixed voltage regulators are designed with Thermal Overload Protection that shuts down the circuit when subjected to an excessive power overload condition. Internal Short Circuit Protection limits the maximum current the circuit will pass. In many low current applications, compensation capacitors are not required. However, it is recommended that the regulator input be bypassed with a capacitor if the regulator is connected to the power supply filter with long wire lengths, or if the output load capacitance is large. The +20V MC78L15A 0.33mF Input 6 R IO Constant Current to Grounded Load 2 MC1741 3 + 4 0.33mF 6.5 20V The MC78L00 regulators can also be used as a current source when connected as above. In order to minimize dissipation the MC78L05C is chosen in this application. Resistor R determines the current as follows: 5.0 V IO = + IB R 10k 7 MC78L05A 0.33mF +VO 10k MPS A70 -VO MPS U55 Figure 10. +15 V Tracking Voltage Regulator +VI MC78LXXA 0.33mF IIB = 3.8 mA over line and load changes -VI For example, a 100 mA current source would require R to be a 50W, 1/2 W resistor and the output voltage compliance would be the input voltage less 7 V. 0.33mF +VO 0.1mF MC79LXXA 0.1mF -VO Figure 9. Current Regulator Figure 11. Positive and Negative Regulator www.onsemi.com 8 MC78L00A Series, NCV78L00A ORDERING INFORMATION Output Voltage Operating Temperature Range MC78L05ABDG 5.0 V NCV78L05ABDG* Package Shipping† TJ = −40° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail 5.0 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC78L05ABDR2G 5.0 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel NCV78L05ABDR2G* 5.0 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L05ABPG 5.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag NCV78L05ABPG* 5.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L05ABPRAG 5.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel NCV78L05ABPRAG* 5.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L05ABPREG 5.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel NCV78L05ABPREG* 5.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L05ABPRMG 5.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack NCV78L05ABPRMG* 5.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack NCV78L05ABPRPG* 5.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L05ACDG 5.0 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC78L05ACDR2G 5.0 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L05ACPG 5.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L05ACPRAG 5.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L05ACPREG 5.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L05ACPRMG 5.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L05ACPRPG 5.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L05ACHT1G 5.0 V TJ = 0° to +125°C SOT−89 (Pb−Free) 2500 / Tape & Reel MC78L08ABDG 8.0 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail Device *NCV78L05A, NCV78L12A, NCV78L15A: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 9 MC78L00A Series, NCV78L00A ORDERING INFORMATION (continued) Output Voltage Operating Temperature Range MC78L08ABDR2G 8.0 V NCV78L08ABDR2G* Package Shipping† TJ = −40° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel 8.0 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L08ABPG 8.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L08ABPRAG 8.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L08ABPRPG 8.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L08ACDG 8.0 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC78L08ACDR2G 8.0 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L08ACPG 8.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L08ACPRAG 8.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L08ACPREG 8.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L08ACPRPG 8.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L09ABDG 9.0 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC78L09ABDR2G 9.0 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L09ABPRAG 9.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L09ABPRPG 9.0 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L09ACDG 9.0 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC78L09ACDR2G 9.0 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L09ACPG 9.0 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L12ABDG 12 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC78L12ABDR2G 12 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel NCV78L12ABDG* 12 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail NCV78L12ABDR2G* 12 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L12ABPG 12 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag Device *NCV78L05A, NCV78L12A, NCV78L15A: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 10 MC78L00A Series, NCV78L00A ORDERING INFORMATION (continued) Output Voltage Operating Temperature Range MC78L12ABPRPG 12 V NCV78L12ABPG* Package Shipping† TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack 12 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L12ACDG 12 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC78L12ACDR2G 12 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L12ACPG 12 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L12ACPRAG 12 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L12ACPREG 12 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L12ACPRMG 12 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L12ACPRPG 12 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L15ABDG 15 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC78L15ABDR2G 15 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel NCV78L15ABDR2G* 15 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L15ABPG 15 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L15ABPRAG 15 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L15ABPRPG 15 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L15ACDG 15 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC78L15ACDR2G 15 V TJ = 0° to +125°C SOIC−8 (Pb−Free) 2500 / Tape & Reel MC78L15ACPG 15 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L15ACPRAG 15 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L15ACPRPG 15 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L18ABPG 18 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L18ACPG 18 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L18ACPRAG 18 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel Device *NCV78L05A, NCV78L12A, NCV78L15A: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 11 MC78L00A Series, NCV78L00A ORDERING INFORMATION (continued) Output Voltage Operating Temperature Range MC78L18ACPRMG 18 V MC78L18ACPRPG Package Shipping† TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack 18 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack MC78L24ABPG 24 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag NCV78L24ABPRPG* 24 V TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L24ACPG 24 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC78L24ACPRAG 24 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Tape & Reel MC78L24ACPRPG 24 V TJ = 0° to +125°C TO−92 (Pb−Free) 2000 / Ammo Pack Device *NCV78L05A, NCV78L12A, NCV78L15A: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS SOIC−8 D SUFFIX CASE 751 8 1 TO−92 P SUFFIX CASE 029 8 8LxxA ALYWB G xx A L Y W B, C G 1 8LxxA ALYWC G = 05, 08, 09, 12, or 15 = Assembly Location = Wafer Lot = Year = Work Week = Temperature Range = Pb−Free Package MC78L zzABP ALYW MC78L zzACP ALYW 1 2 3 1 2 3 zz A L Y W SOT−89 CASE 528AG Y W X X Y = Year W = Work Week XX = Specific Device Code www.onsemi.com 12 = 05, 08, 09, 12, 15, 18 or 24 = Assembly Location = Wafer Lot = Year = Work Week MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−92 (TO−226) 1 WATT CASE 29−10 ISSUE D SCALE 1:1 12 3 STRAIGHT LEAD 1 DATE 05 MAR 2021 2 3 BENT LEAD STYLES AND MARKING ON PAGE 3 DOCUMENT NUMBER: DESCRIPTION: 98AON52857E TO−92 (TO−226) 1 WATT Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 3 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−92 (TO−226) 1 WATT CASE 29−10 ISSUE D DATE 05 MAR 2021 STYLES AND MARKING ON PAGE 3 DOCUMENT NUMBER: DESCRIPTION: 98AON52857E TO−92 (TO−226) 1 WATT Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 3 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com TO−92 (TO−226) 1 WATT CASE 29−10 ISSUE D DATE 05 MAR 2021 STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR STYLE 2: PIN 1. BASE 2. EMITTER 3. COLLECTOR STYLE 3: PIN 1. ANODE 2. ANODE 3. CATHODE STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE STYLE 5: PIN 1. DRAIN 2. SOURCE 3. GATE STYLE 6: PIN 1. GATE 2. SOURCE & SUBSTRATE 3. DRAIN STYLE 7: PIN 1. SOURCE 2. DRAIN 3. GATE STYLE 8: PIN 1. DRAIN 2. GATE 3. SOURCE & SUBSTRATE STYLE 9: PIN 1. BASE 1 2. EMITTER 3. BASE 2 STYLE 10: PIN 1. CATHODE 2. GATE 3. ANODE STYLE 11: PIN 1. ANODE 2. CATHODE & ANODE 3. CATHODE STYLE 12: PIN 1. MAIN TERMINAL 1 2. GATE 3. MAIN TERMINAL 2 STYLE 13: PIN 1. ANODE 1 2. GATE 3. CATHODE 2 STYLE 14: PIN 1. EMITTER 2. COLLECTOR 3. BASE STYLE 15: PIN 1. ANODE 1 2. CATHODE 3. ANODE 2 STYLE 16: PIN 1. ANODE 2. GATE 3. CATHODE STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER STYLE 18: PIN 1. ANODE 2. CATHODE 3. NOT CONNECTED STYLE 19: PIN 1. GATE 2. ANODE 3. CATHODE STYLE 20: PIN 1. NOT CONNECTED 2. CATHODE 3. ANODE STYLE 21: PIN 1. COLLECTOR 2. EMITTER 3. BASE STYLE 22: PIN 1. SOURCE 2. GATE 3. DRAIN STYLE 23: PIN 1. GATE 2. SOURCE 3. DRAIN STYLE 24: PIN 1. EMITTER 2. COLLECTOR/ANODE 3. CATHODE STYLE 25: PIN 1. MT 1 2. GATE 3. MT 2 STYLE 26: PIN 1. 2. 3. STYLE 27: PIN 1. MT 2. SUBSTRATE 3. MT STYLE 28: PIN 1. CATHODE 2. ANODE 3. GATE STYLE 29: PIN 1. NOT CONNECTED 2. ANODE 3. CATHODE STYLE 30: PIN 1. DRAIN 2. GATE 3. SOURCE STYLE 32: PIN 1. BASE 2. COLLECTOR 3. EMITTER STYLE 33: PIN 1. RETURN 2. INPUT 3. OUTPUT STYLE 34: PIN 1. INPUT 2. GROUND 3. LOGIC STYLE 35: PIN 1. GATE 2. COLLECTOR 3. EMITTER VCC GROUND 2 OUTPUT STYLE 31: PIN 1. GATE 2. DRAIN 3. SOURCE GENERIC MARKING DIAGRAM* XXXXX XXXXX ALYWG G XXXX A L Y W G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON52857E TO−92 (TO−226) 1 WATT Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 3 OF 3 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−89, 3 LEAD CASE 528AG ISSUE O DATE 04 MAR 2014 SCALE 2:1 A D E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS INCLUDES LEAD FINISH. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. DIMENSIONS L, L2, D2, AND H ARE MEASURED AT DATUM PLANE C. 6. CENTER LEAD CONTOUR MAY VARY WITHIN THE REGION DEFINED BY DIMENSION E. 7. DIMENSION D2 IS DEFINED AT ITS WIDEST POINT. H 1 2 3 DIM A b b1 c D D2 E e H L TOP VIEW c A 0.10 C C SIDE VIEW e b1 1 GENERIC MARKING DIAGRAM* e b 2 MILLIMETERS MIN MAX 1.40 1.60 0.38 0.47 0.46 0.55 0.40 0.44 4.40 4.60 1.60 1.90 2.40 2.60 1.50 BSC 4.05 4.25 0.89 1.20 L2 Y W 3 L X X Y = Year W = Work Week XX = Specific Device Code D2 B *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. BOTTOM VIEW RECOMMENDED MOUNTING FOOTPRINT* 2.00 PACKAGE OUTLINE 4.45 1.57 2X 1 0.50 2X 1.50 0.86 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON82692F SOT−89, 3 LEAD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK 8 1 SCALE 1:1 −X− DATE 16 FEB 2011 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N X 45 _ SEATING PLANE −Z− 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S 8 8 1 1 IC 4.0 0.155 XXXXX A L Y W G IC (Pb−Free) = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package XXXXXX AYWW 1 1 Discrete XXXXXX AYWW G Discrete (Pb−Free) XXXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. 1.270 0.050 SCALE 6:1 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 8 8 XXXXX ALYWX G XXXXX ALYWX 1.52 0.060 0.6 0.024 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 7.0 0.275 DIM A B C D G H J K M N S mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. STYLES ON PAGE 2 DOCUMENT NUMBER: DESCRIPTION: 98ASB42564B SOIC−8 NB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com SOIC−8 NB CASE 751−07 ISSUE AK DATE 16 FEB 2011 STYLE 1: PIN 1. EMITTER 2. COLLECTOR 3. COLLECTOR 4. EMITTER 5. EMITTER 6. BASE 7. BASE 8. EMITTER STYLE 2: PIN 1. COLLECTOR, DIE, #1 2. COLLECTOR, #1 3. COLLECTOR, #2 4. COLLECTOR, #2 5. BASE, #2 6. EMITTER, #2 7. BASE, #1 8. EMITTER, #1 STYLE 3: PIN 1. DRAIN, DIE #1 2. DRAIN, #1 3. DRAIN, #2 4. DRAIN, #2 5. GATE, #2 6. SOURCE, #2 7. GATE, #1 8. SOURCE, #1 STYLE 4: PIN 1. ANODE 2. ANODE 3. ANODE 4. ANODE 5. ANODE 6. ANODE 7. ANODE 8. COMMON CATHODE STYLE 5: PIN 1. DRAIN 2. DRAIN 3. DRAIN 4. DRAIN 5. GATE 6. GATE 7. SOURCE 8. SOURCE STYLE 6: PIN 1. SOURCE 2. DRAIN 3. DRAIN 4. SOURCE 5. SOURCE 6. GATE 7. GATE 8. SOURCE STYLE 7: PIN 1. INPUT 2. EXTERNAL BYPASS 3. THIRD STAGE SOURCE 4. GROUND 5. DRAIN 6. GATE 3 7. SECOND STAGE Vd 8. FIRST STAGE Vd STYLE 8: PIN 1. COLLECTOR, DIE #1 2. BASE, #1 3. BASE, #2 4. COLLECTOR, #2 5. COLLECTOR, #2 6. EMITTER, #2 7. EMITTER, #1 8. COLLECTOR, #1 STYLE 9: PIN 1. EMITTER, COMMON 2. COLLECTOR, DIE #1 3. COLLECTOR, DIE #2 4. EMITTER, COMMON 5. EMITTER, COMMON 6. BASE, DIE #2 7. BASE, DIE #1 8. EMITTER, COMMON STYLE 10: PIN 1. GROUND 2. BIAS 1 3. OUTPUT 4. GROUND 5. GROUND 6. BIAS 2 7. INPUT 8. GROUND STYLE 11: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. DRAIN 2 7. DRAIN 1 8. DRAIN 1 STYLE 12: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 13: PIN 1. N.C. 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 14: PIN 1. N−SOURCE 2. N−GATE 3. P−SOURCE 4. P−GATE 5. P−DRAIN 6. P−DRAIN 7. N−DRAIN 8. N−DRAIN STYLE 15: PIN 1. ANODE 1 2. ANODE 1 3. ANODE 1 4. ANODE 1 5. CATHODE, COMMON 6. CATHODE, COMMON 7. CATHODE, COMMON 8. CATHODE, COMMON STYLE 16: PIN 1. EMITTER, DIE #1 2. BASE, DIE #1 3. EMITTER, DIE #2 4. BASE, DIE #2 5. COLLECTOR, DIE #2 6. COLLECTOR, DIE #2 7. COLLECTOR, DIE #1 8. COLLECTOR, DIE #1 STYLE 17: PIN 1. VCC 2. V2OUT 3. V1OUT 4. TXE 5. RXE 6. VEE 7. GND 8. ACC STYLE 18: PIN 1. ANODE 2. ANODE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. CATHODE 8. CATHODE STYLE 19: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. MIRROR 2 7. DRAIN 1 8. MIRROR 1 STYLE 20: PIN 1. SOURCE (N) 2. GATE (N) 3. SOURCE (P) 4. GATE (P) 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 21: PIN 1. CATHODE 1 2. CATHODE 2 3. CATHODE 3 4. CATHODE 4 5. CATHODE 5 6. COMMON ANODE 7. COMMON ANODE 8. CATHODE 6 STYLE 22: PIN 1. I/O LINE 1 2. COMMON CATHODE/VCC 3. COMMON CATHODE/VCC 4. I/O LINE 3 5. COMMON ANODE/GND 6. I/O LINE 4 7. I/O LINE 5 8. COMMON ANODE/GND STYLE 23: PIN 1. LINE 1 IN 2. COMMON ANODE/GND 3. COMMON ANODE/GND 4. LINE 2 IN 5. LINE 2 OUT 6. COMMON ANODE/GND 7. COMMON ANODE/GND 8. LINE 1 OUT STYLE 24: PIN 1. BASE 2. EMITTER 3. COLLECTOR/ANODE 4. COLLECTOR/ANODE 5. CATHODE 6. CATHODE 7. COLLECTOR/ANODE 8. COLLECTOR/ANODE STYLE 25: PIN 1. VIN 2. N/C 3. REXT 4. GND 5. IOUT 6. IOUT 7. IOUT 8. IOUT STYLE 26: PIN 1. GND 2. dv/dt 3. ENABLE 4. ILIMIT 5. SOURCE 6. SOURCE 7. SOURCE 8. VCC STYLE 29: PIN 1. BASE, DIE #1 2. EMITTER, #1 3. BASE, #2 4. EMITTER, #2 5. COLLECTOR, #2 6. COLLECTOR, #2 7. COLLECTOR, #1 8. COLLECTOR, #1 STYLE 30: PIN 1. DRAIN 1 2. DRAIN 1 3. GATE 2 4. SOURCE 2 5. SOURCE 1/DRAIN 2 6. SOURCE 1/DRAIN 2 7. SOURCE 1/DRAIN 2 8. GATE 1 DOCUMENT NUMBER: DESCRIPTION: 98ASB42564B SOIC−8 NB STYLE 27: PIN 1. ILIMIT 2. OVLO 3. UVLO 4. INPUT+ 5. SOURCE 6. SOURCE 7. SOURCE 8. DRAIN STYLE 28: PIN 1. SW_TO_GND 2. DASIC_OFF 3. DASIC_SW_DET 4. GND 5. V_MON 6. VBULK 7. VBULK 8. VIN Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
MC78L08ACD 价格&库存

很抱歉,暂时无法提供与“MC78L08ACD”相匹配的价格&库存,您可以联系我们找货

免费人工找货