MC78LC00_06

MC78LC00 Series Micropower Voltage Regulator The MC78LC00 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent current. The MC78LC00 series features an ultra−low quiescent current of 1.1 mA. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, and resistors for setting output voltage. The MC78LC00 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 mF. The device is housed in the micro−miniature Thin SOT23−5 surface mount package and SOT−89, 3 pin. Standard voltage versions are 1.5, 1.8, 2.5, 2.7, 2.8, 3.0, 3.3, 4.0, and 5.0 V. Other voltages are available in 100 mV steps. Features http://onsemi.com MARKING DIAGRAMS AND PIN CONNECTIONS THIN SOT23−5 NTR SUFFIX CASE 483 GND Vin 1 xxx AYW G G 2 3 5 N/C 5 Vout 1 • • • • • • • • Low Quiescent Current of 1.1 mA Typical Excellent Line and Load Regulation Maximum Operating Voltage of 12 V Low Output Voltage Option High Accuracy Output Voltage of 2.5% Industrial Temperature Range of −40°C to 85°C Two Surface Mount Packages (SOT−89, 3 Pin, or SOT−23, 5 Pin) Pb−Free Packages are Available 4 N/C (Top View) SOT−89 H SUFFIX CASE 1213 TAB 1 GND 1 Vin 2 Vout 3 xx AYW G G Tab Typical Applications (Top View) (Tab is connected to Pin 2) • Battery Powered Instruments • Hand−Held Instruments • Camcorders and Cameras 2 Vin 3 VO xxx = Version A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Vref 1 GND This device contains 8 active transistors. Figure 1. Representative Block Diagram © Semiconductor Components Industries, LLC, 2006 1 January, 2006 − Rev. 9 Publication Order Number: MC78LC00/D MC78LC00 Series ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION Pin No. 1 2 3 4 5 Pin Name GND Vin Description Power supply ground Positive power supply input voltage Regulated Output Vout N/C N/C No Internal Connection No Internal Connection MAXIMUM RATINGS ÁÁÁÁ Á ÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Input Voltage Vin 12 V V Output Voltage Vout −0.3 to Vin +0.3 Power Dissipation and Thermal Characteristics Case 483−01 (Thin SOT23−5) NTR Suffix Power Dissipation @ TA = 85°C Thermal Resistance, Junction−to−Ambient Case 1213 (SOT−89) H Suffix Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Ambient Operating Junction Temperature Operating Ambient Temperature Storage Temperature PD RqJA PD RqJA TJ 140 280 300 333 +125 mW °C/W mW °C/W °C °C °C Rating Symbol Value Unit ÁÁÁÁ Á ÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ TA −40 to +85 Tstg −55 to +150 10 Lead Soldering Temperature @ 260°C Tsolder sec Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. http://onsemi.com 2 MC78LC00 Series ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) (Note 5) NTR SUFFIX Characteristic Output Voltage (TA = 25°C, Iout = 1.0 mA) 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 4.0 V 5.0 V Output Voltage (TA = −40°C to 85°C) 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 4.0 V 5.0 V Line Regulation (Vin = VO(nom.) + 1.0 V to 12 V, Iout = 1.0 mA) Load Regulation (Iout = 1.0 mA to 10 mA) Output Current (Note 6) 1.5 V, 1.8 V (Vin = 4.0 V) 2.5 V, 2.7 V, 2.8 V, 3.0 V (Vin = 5.0 V) 3.3 V (Vin = 6.0 V) 4.0 V (Vin = 7.0 V) 5.0 V (Vin = 8.0 V) Dropout Voltage (Iout = 1.0 mA, Measured at Vout −3.0%) 1.5 V 1.6 V−3.2 V 3.3 V−3.9 V 4.0 V−5.0 V Quiescent Current (Iout = 1.0 mA to IO(nom.)) Output Voltage Temperature Coefficient Output Noise Voltage (f = 1.0 kHz to 100 kHz) Symbol Vout 1.455 1.746 2.425 2.646 2.744 2.94 3.234 3.9 4.90 Vout 1.455 1.746 2.425 2.619 2.716 2.910 3.201 3.9 4.90 Regline Regload Iout Min Typ 1.5 1.8 2.5 2.7 2.8 3.0 3.3 4.0 5.0 1.5 1.8 2.5 2.7 2.8 3.0 3.3 4.0 5.0 0.05 40 50 80 80 80 100 35 30 30 30 1.1 "100 89 Max 1.545 1.854 2.575 2.754 2.856 3.06 3.366 4.1 5.10 Unit V V 1.545 1.854 2.575 2.781 2.884 3.09 3.399 4.1 5.10 0.2 60 − − − − − mV − − − − 70 60 53 38 3.6 − − mA ppm/°C mVrms %/V mV mA 35 50 50 80 80 − − Vin−Vout IQ Tc − − − Vn 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V 2. Latch up capability (85°C) "100 mA 3. Maximum package power dissipation limits must be observed. TJ(max) * TA PD + RqJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 5. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 6. Output Current is measured when Vout = VO1 − 3% where VO1 = Vout at Iout = 0 mA. http://onsemi.com 3 MC78LC00 Series ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) (Note 11) HT SUFFIX Characteristic Output Voltage 30HT1 Suffix 33HT1 Suffix 40HT1 Suffix 50HT1 Suffix (Vin = 5.0 V) (Vin = 5.0 V) (Vin = 6.0 V) (Vin = 7.0 V) Regline Symbol Min 2.950 3.218 3.900 4.875 − Typ 3.0 3.3 4.0 5.0 0.05 Max 3.075 3.382 4.100 5.125 0.2 %/V mV Unit V ÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁ ÁÁ Á ÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ Á ÁÁ ÁÁÁ ÁÁ ÁÁÁ ÁÁ ÁÁÁ Á ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁ ÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁ ÁÁÁÁÁÁ ÁÁ ÁÁÁ ÁÁ ÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ Á ÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁ ÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁ Line Regulation Vin = [VO + 1.0] V to 10 V, IO = 1.0 mA Load Regulation (IO = 1.0 to 10 mA) 30HT1 Suffix (Vin = 5.0 V) 33HT1 Suffix (Vin = 6.0 V) 40HT1 Suffix (Vin = 7.0 V) 50HT1 Suffix (Vin = 8.0 V) Output Current (Note 12) 30HT1 Suffix (Vin = 5.0 V) 33HT1 Suffix (Vin = 6.0 V) 40HT1 Suffix (Vin = 7.0 V) 50HT1 Suffix (Vin = 8.0 V) Dropout Voltage 30HT1 Suffix 33HT1 Suffix 40HT1 Suffix 50HT1 Suffix Regload − − − − 40 40 50 60 50 50 65 80 40 35 25 25 60 60 70 90 − − − − IO mA 35 35 45 55 − − − − − − − − − Vin − VO mV (IO = 1.0 mA) (IO = 1.0 mA) (IO = 1.0 mA) (IO = 1.0 mA) 60 53 38 38 Quiescent Current 30HT1 Suffix (Vin = 5.0 V) 33HT1 Suffix (Vin = 5.0 V) 40HT1 Suffix (Vin = 6.0 V) 50HT1 Suffix (Vin = 7.0 V) ICC mA 1.1 1.1 1.2 1.3 3.3 3.3 3.6 3.9 − Output Voltage Temperature Coefficient TC ±100 ppm/°C 7. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V 8. Latch up capability (85°C) "100 mA 9. Maximum package power dissipation limits must be observed. TJ(max) * TA PD + RqJA 10. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 11. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 12. Output Current is measured when Vout = VO1 − 3% where VO1 = Vout at Iout = 0 mA. DEFINITIONS Load Regulation The change in output voltage for a change in output current at a constant temperature. Dropout Voltage difference between the input current (measured through the LDO input pin) and the output current. Line Regulation The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Maximum Power Dissipation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Maximum Package Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient power dissipation and thus the maximum available output current. http://onsemi.com 4 MC78LC00 Series 3.2 3.1 VO, OUTPUT VOLTAGE (V) 3 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.5 2.7 2.9 3.1 TA = 25°C 3.3 3.5 2.2 2.5 IO = 5 mA IO = 1 mA IO = 10 mA NTR Series VO, OUTPUT VOLTAGE (V) 3.0 IO = 1.0 mA 3.2 TA = 25°C 2.8 IO = 5.0 mA 2.6 2.4 IO = 10 mA 2.7 MC78LC30HT1 Vin, Input Voltage (V) 2.9 3.1 Vin, Input Voltage (V) 3.3 3.5 Figure 2. Output Voltage versus Input Voltage Figure 3. Output Voltage versus Input Voltage 3.05 3 VO, OUTPUT VOLTAGE (V) 2.95 2.9 2.85 2.8 2.75 2.7 2.65 2.6 0 20 40 60 80 100 120 IO, Output Current (mA) 25°C 80°C NTR Series VO, OUTPUT VOLTAGE (V) −40°C 3.2 3.1 TA = −30°C 3.0 2.9 2.8 2.7 0 0 MC78LC30HT1 TA = 25°C TA = 80°C 100 120 20 40 60 80 IO, Output Current (mA) Figure 4. Output Voltage versus Output Current Figure 5. Output Voltage versus Output Current 2 Vin −VO, DROPOUT VOLTAGE (V) 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 10 20 30 40 50 IO, Output Current (mA) MC78LC30NTR TA = 25°C Vin −VO, DROPOUT VOLTAGE (V) 2.0 1.6 1.2 0.8 MC78LC30HT1 TA = 25°C 0.4 0 0 10 20 30 40 50 IO, Output Current (mA) Figure 6. Dropout Voltage versus Output Current Figure 7. Dropout Voltage versus Output Current http://onsemi.com 5 MC78LC00 Series 3.1 VO, OUTPUT VOLTAGE (V) VO, OUTPUT VOLTAGE (V) MC78LC30NTR Vin = 4.0 V IO = 10 mA 3.10 Vin = 5.0 V IO = 10 mA 3.06 3.06 3.02 3.02 2.98 2.98 MC78LC30HT1 2.94 2.94 2.9 −40 −20 0 20 40 60 80 2.90 −40 −20 0 20 40 60 80 TA, Ambient Temperature (°C) TA, Ambient Temperature (°C) Figure 8. Output Voltage versus Temperature Figure 9. Output Voltage versus Temperature 1.4 IQ, QUIESCENT CURRENT (mA) 1.3 1.2 1.1 1 0.9 0.8 3 4 5 6 7 8 9 10 11 12 Vin, Input Voltage (V) IQ, QUIESCENT CURRENT (mA) MC78LC30NTR TA = 25°C I O = 0 mA 1.4 TA = 25°C 1.3 1.2 1.1 1.0 MC78LC30HT1 0.9 0.8 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 Vin, Input Voltage (V) Figure 10. Quiescent Current versus Input Voltage Figure 11. Quiescent Current versus Input Voltage 1.75 IQ, QUIESCENT CURRENT (mA) IQ, QUIESCENT CURRENT (mA) MC78LC30NTR Vin = 4.0 V I O = 0 mA 1.2 Vin = 5.0 V 1.1 1.0 0.9 0.8 0.7 0.6 −40 MC78LC30HT1 1.5 1.25 1 0.75 0.5 −20 0 20 40 60 80 −20 0 20 40 60 80 TA, Ambient Temperature (°C) TA, Ambient Temperature (°C) Figure 12. Quiescent Current versus Temperature Figure 13. Quiescent Current versus Temperature http://onsemi.com 6 MC78LC00 Series 0.8 Vin − Vout, DROPOUT VOLTAGE (V) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 NTR Series 0.8 Vin − Vout, DROPOUT VOLTAGE (V) 0.7 IO = 10 mA 0.6 0.5 0.4 0.3 0.2 IO = 1.0 mA HT1 Series 0.1 0 0 1.0 2.0 3.0 4.0 5.0 6.0 VO, Set Output Voltage (V) VO, Set Output Voltage (V) Figure 14. Dropout Voltage versus Set Output Voltage Figure 15. Dropout Voltage versus Set Output Voltage INPUT VOLTAGE/OUTPUT VOLTAGE (V) Input Voltage (V) 6.0 NTR Series 5.0 4.0 300 200 100 0 −100 −200 −300 0 0.5 1.0 1.5 2.0 2.5 Vin = 4.5 V to 5.5 V Vout = 3.0 V RL = 3 k Cout = 0.1 mF 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 0 2.0 t, Time (ms) 4.0 CO = 0.1 mF IO = 1.0 mA 6.0 HT1 Series Output Voltage Input Voltage Output Voltage Deviation (mV) Time (mS) Figure 16. Line Transient Figure 17. Line Transient Response 3.5 Vout, OUTPUT VOLTAGE (V) Ig GROUND CURRENT (mA) 3.0 2.5 2.0 1.5 1.0 0.5 0 IO = 50 mA 100 mA 200 mA 0 0.5 1.0 1.5 2.0 2.5 TA = 25°C NTR Series 1.5 1.0 0.8 0.6 100 mA 0.4 0.2 0 200 mA 50 mA TA = 25°C I O = 0 mA NTR Series 50 mA 200 mA 0 0.5 1.0 1.5 2.0 2.5 Vin, Input Voltage (V) Vin, Input Voltage (V) Figure 18. Output Voltage versus Input Voltage Figure 19. Ground Current versus Input Voltage http://onsemi.com 7 MC78LC00 Series APPLICATIONS INFORMATION A typical application circuit for the MC78LC00 series is shown in Figure 20. Input Decoupling (C1) Thermal A 0.1 mF capacitor either ceramic or tantalum is recommended and should be connected close to the MC78LC00 package. Higher values and lower ESR will improve the overall line transient response. Output Decoupling (C2) The MC78LC00 is a stable component and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few mW up to 3.0 W can thus safely be used. The minimum decoupling value is 0.1 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. Hints As power across the MC78LC00 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the MC78LC00 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: PD + TJ(max) * TA RqJA Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. If junction temperature is not allowed above the maximum 125°C, then the MC78LC00NTR can dissipate up to 357 mW @ 25°C. The power dissipated by the MC78LC00NTR can be calculated from the following equation: Ptot + [Vin * Ignd (Iout)] ) [Vin * Vout] * Iout or P ) Vout * Iout VinMAX + tot Ignd ) Iout If an 80 mA output current is needed then the ground current from the data sheet is 1.1 mA. For an MC78LC30NTR (3.0 V), the maximum input voltage will then be 7.4 V. Battery or Unregulated Voltage + C1 Vout + C2 Figure 20. Basic Application Circuit for NTR Suffixes http://onsemi.com 8 MC78LC00 Series MJD32C 0.033 mF Vin 100 2 MC78LC00 3 Vin VO 2 MC78LC00 R1 1 0.1 mF GND 1 0.1 mF GND C1 ICC GND R2 C2 3 VO Figure 21. Current Boost Circuit MJD32C Q1 0.033 mF Figure 22. Adjustable VO R2 Q2 MMBT2907 ALT1 R1 Vin 2 MC78LC00 3 VO 0.1 mF GND 1 0.1 mF GND Figure 23. Current Boost Circuit with Overcurrent Limit Circuit V BE1 ) V BE2 R1 V O +V O(Reg) 1 ) R2 R1 )I CC R2 I O(short circuit) [ V BE2 R2 ) http://onsemi.com 9 MC78LC00 Series ORDERING INFORMATION Device MC78LC15NTR MC78LC15NTRG MC78LC18NTR MC78LC18NTRG MC78LC25NTR MC78LC25NTRG MC78LC27NTR MC78LC27NTRG MC78LC28NTR MC78LC28NTRG MC78LC30NTR MC78LC30NTRG MC78LC33NTR MC78LC33NTRG MC78LC40NTR MC78LC40NTRG MC78LC50NTR MC78LC50NTRG MC78LC30HT1 MC78LC30HT1G MC78LC33HT1 MC78LC33HT1G MC78LC40HT1 MC78LC40HT1G MC78LC50HT1 MC78LC50HT1G Nominal Output Voltage 1.5 1.5 1.8 1.8 2.5 2.5 2.7 2.7 2.8 2.8 3.0 3.0 3.3 3.3 4.0 4.0 5.0 5.0 3.0 3.0 3.3 3.3 4.0 4.0 5.0 5.0 Marking LAG LAG LAH LAH LAI LAI LAJ LAJ LAK LAK LAL LAL LAM LAM LEC LEC LAN LAN 0C 0C 3C 3C 0D 0D 0E 0E Package Thin SOT23−5 Thin SOT23−5 (Pb−Free) Thin SOT23−5 Thin SOT23−5 (Pb−Free) Thin SOT23−5 Thin SOT23−5 (Pb−Free) Thin SOT23−5 Thin SOT23−5 (Pb−Free) Thin SOT23−5 Thin SOT23−5 (Pb−Free) Thin SOT23−5 Thin SOT23−5 (Pb−Free) Thin SOT23−5 Thin SOT23−5 (Pb−Free) Thin SOT23−5 Thin SOT23−5 (Pb−Free) Thin SOT23−5 Thin SOT23−5 (Pb−Free) SOT−89 SOT−89 (Pb−Free) SOT−89 SOT−89 (Pb−Free) 1000 Units Tape & Reel SOT−89 SOT−89 (Pb−Free) SOT−89 SOT−89 (Pb−Free) 3000 Units/7″ Tape & Reel Shipping † †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative. http://onsemi.com 10 MC78LC00 Series PACKAGE DIMENSIONS THIN SOT23−5 NTR SUFFIX PLASTIC PACKAGE CASE 483−02 ISSUE E D 5 1 2 4 3 S B L G A J C 0.05 (0.002) H K M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181 DIM A B C D G H J K L M S SOLDERING FOOTPRINT* 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 MC78LC00 Series PACKAGE DIMENSIONS SOT−89 H SUFFIX PLASTIC PACKAGE CASE 1213−02 ISSUE C −A− F C J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. 1213−01 OBSOLETE, NEW STANDARD 1213−02. MILLIMETERS MIN MAX 4.40 4.60 2.40 2.60 1.40 1.60 0.37 0.57 0.32 0.52 1.50 1.83 1.50 BSC 3.00 BSC 0.30 0.50 0.80 −−− −−− 4.25 INCHES MIN MAX 0.173 0.181 0.094 0.102 0.055 0.063 0.015 0.022 0.013 0.020 0.059 0.072 0.059 BSC 0.118 BSC 0.012 0.020 0.031 −−− −−− 0.167 L K D −B− 0.10 E G H 2 PL M TB TB S A A S −T− SEATING PLANE 0.10 M S S DIM A B C D E F G H J K L ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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