DATA SHEET
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Voltage Regulator Micropower
5
1
MC78LC00 Series
•
•
•
•
•
•
•
•
Low Quiescent Current of 1.1 mA Typical
Excellent Line and Load Regulation
Maximum Operating Voltage of 12 V
Low Output Voltage Option
High Accuracy Output Voltage of 2.5%
Industrial Temperature Range of −40°C to 85°C
Surface Mount Packages (SOT−23, 5 Pin)
These are Pb−Free Devices
GND
1
Vin
2
Vout
3
5
N/C
4
N/C
G
Features
MARKING DIAGRAMS AND
PIN CONNECTION
XXX AYW G
The MC78LC00 series of fixed output low dropout linear regulators
are designed for handheld communication equipment and portable
battery powered applications which require low quiescent current. The
MC78LC00 series features an ultra−low quiescent current of 1.1 mA.
Each device contains a voltage reference unit, an error amplifier, a
PMOS power transistor, and resistors for setting output voltage.
The MC78LC00 has been designed to be used with low cost ceramic
capacitors and requires a minimum output capacitor of 0.1 mF. The
device is housed in the micro−miniature Thin SOT23−5 surface mount
package Standard voltage versions are 1.8, 2.5, 3.0, 3.3, V.
TSOP−5
NTR SUFFIX
CASE 483
(Top View)
(Tab is connected to Pin 2)
XXX= Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Typical Applications
• Battery Powered Instruments
• Hand−Held Instruments
• Camcorders and Cameras
Vin
2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
3
VO
Vref
1
GND
This device contains 8 active transistors.
Figure 1. Representative Block Diagram
© Semiconductor Components Industries, LLC, 2016
October, 2021 − Rev. 12
1
Publication Order Number:
MC78LC00/D
MC78LC00 Series
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PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
1
GND
Description
2
Vin
Positive power supply input voltage
3
Vout
Regulated Output
4
N/C
No Internal Connection
5
N/C
No Internal Connection
Power supply ground
MAXIMUM RATINGS
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Symbol
Value
Unit
Input Voltage
Rating
Vin
12
V
Output Voltage
Vout
−0.3 to Vin +0.3
V
Power Dissipation and Thermal Characteristics
Case 483−01 (Thin SOT23−5) NTR Suffix
Power Dissipation @ TA = 85°C
Thermal Resistance, Junction−to−Ambient
PD
RqJA
140
280
mW
°C/W
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Operating Junction Temperature
TJ
+125
°C
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Tsolder
10
s
Lead Soldering Temperature @ 260°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
MC78LC00 Series
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) (Note 5)
NTR SUFFIX
Symbol
Characteristic
Output Voltage (TA = 25°C, Iout = 1.0 mA)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
4.0 V
5.0 V
Vout
Output Voltage (TA = −40°C to 85°C)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
4.0 V
5.0 V
Vout
Min
Typ
Max
1.455
1.746
2.425
2.646
2.744
2.94
3.234
3.9
4.90
1.5
1.8
2.5
2.7
2.8
3.0
3.3
4.0
5.0
1.545
1.854
2.575
2.754
2.856
3.06
3.366
4.1
5.10
1.455
1.746
2.425
2.619
2.716
2.910
3.201
3.9
4.90
1.5
1.8
2.5
2.7
2.8
3.0
3.3
4.0
5.0
1.545
1.854
2.575
2.781
2.884
3.09
3.399
4.1
5.10
Unit
V
V
Line Regulation (Vin = VO(nom.) + 1.0 V to 12 V, Iout = 1.0 mA)
Regline
−
0.05
0.2
%/V
Load Regulation (Iout = 1.0 mA to 10 mA)
Regload
−
40
60
mV
Output Current (Note 6)
1.5 V, 1.8 V (Vin = 4.0 V)
2.5 V, 2.7 V, 2.8 V, 3.0 V (Vin = 5.0 V)
3.3 V (Vin = 6.0 V)
4.0 V (Vin = 7.0 V)
5.0 V (Vin = 8.0 V)
Iout
35
50
50
80
80
50
80
80
80
100
−
−
−
−
−
−
−
−
−
35
30
30
30
70
60
53
38
Dropout Voltage (Iout = 1.0 mA, Measured at Vout −3.0%)
1.5 V
1.6 V−3.2 V
3.3 V−3.9 V
4.0 V−5.0 V
Vin−Vout
mA
mV
Quiescent Current (Iout = 1.0 mA to IO(nom.))
IQ
−
1.1
3.6
mA
Output Voltage Temperature Coefficient
Tc
−
"100
−
ppm/°C
Output Noise Voltage (f = 1.0 kHz to 100 kHz)
Vn
−
89
−
mVrms
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
2. Latch up capability (85°C) "100 mA
3. Maximum package power dissipation limits must be observed.
TJ(max) * TA
PD +
RqJA
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
6. Output Current is measured when Vout = VO1 − 3% where VO1 = Vout at Iout = 0 mA.
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3
MC78LC00 Series
DEFINITIONS
Load Regulation
difference between the input current (measured through the
LDO input pin) and the output current.
The change in output voltage for a change in output current
at a constant temperature.
Line Regulation
Dropout Voltage
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low dissipation
or by using pulse technique such that the average chip
temperature is not significantly affected.
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 3% below its
nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Line Transient Response
Typical over and undershoot response when input voltage is
excited with a given slope.
Maximum Power Dissipation
The maximum total dissipation for which the regulator will
operate within its specifications.
Maximum Package Power Dissipation
The maximum power package dissipation is the power
dissipation level at which the junction temperature reaches its
maximum operating value, i.e. 125°C. Depending on the
ambient power dissipation and thus the maximum available
output current.
Quiescent Current
The quiescent current is the current which flows through the
ground when the LDO operates without a load on its output:
internal IC operation, bias, etc. When the LDO becomes
loaded, this term is called the Ground current. It is actually the
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4
MC78LC00 Series
3.2
3.2
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
3.1
3
IO = 1 mA
2.9
IO = 10 mA
2.8
2.7
2.6
IO = 5 mA
2.5
2.4
2.2
2.5
2.7
2.9
3.1
3.3
2.4
MC78LC30HT1
IO = 10 mA
2.9
3.1
Vin, Input Voltage (V)
Figure 2. Output Voltage versus Input Voltage
Figure 3. Output Voltage versus Input Voltage
2.7
3.3
3.5
3.2
NTR Series
VO, OUTPUT VOLTAGE (V)
−40°C
2.95
80°C
2.9
2.85
2.8
2.75
25°C
2.7
2.65
0
20
40
60
80
100
3.1
TA = −30°C
3.0
2.9
TA = 25°C
2.8
MC78LC30HT1
2.7
0
0
120
20
TA = 80°C
100
120
IO, Output Current (mA)
40
60
80
IO, Output Current (mA)
Figure 4. Output Voltage versus Output Current
Figure 5. Output Voltage versus Output Current
2
2.0
Vin −VO, DROPOUT VOLTAGE (V)
Vin −VO, DROPOUT VOLTAGE (V)
IO = 5.0 mA
2.6
Vin, Input Voltage (V)
3
VO, OUTPUT VOLTAGE (V)
2.8
2.2
2.5
3.5
3.05
MC78LC30NTR
TA = 25°C
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
IO = 1.0 mA
3.0
TA = 25°C
2.3
2.6
TA = 25°C
NTR Series
0
10
20
30
40
1.6
1.2
0.8
0
0
50
MC78LC30HT1
TA = 25°C
0.4
IO, Output Current (mA)
10
20
30
40
50
IO, Output Current (mA)
Figure 6. Dropout Voltage versus Output Current
Figure 7. Dropout Voltage versus Output Current
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5
MC78LC00 Series
3.10
MC78LC30NTR
Vin = 4.0 V
IO = 10 mA
3.06
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
3.1
3.02
2.98
2.94
2.9
−40
−20
0
20
40
60
3.06
3.02
2.98
MC78LC30HT1
2.94
2.90
−40
80
−20
20
40
60
80
TA, Ambient Temperature (°C)
Figure 8. Output Voltage versus Temperature
Figure 9. Output Voltage versus Temperature
1.4
1.3
IQ, QUIESCENT CURRENT (mA)
MC78LC30NTR
TA = 25°C
IO = 0 mA
1.2
1.1
1
0.9
0.8
3
4
5
6
7
8
9
10
11
TA = 25°C
1.3
1.2
1.1
1.0
MC78LC30HT1
0.9
0.8
3.0
12
4.0
Vin, Input Voltage (V)
7.0
8.0
9.0
10
1.2
IQ, QUIESCENT CURRENT (mA)
MC78LC30NTR
Vin = 4.0 V
IO = 0 mA
1.25
1
0.75
0.5
−20
6.0
Figure 11. Quiescent Current versus Input Voltage
1.75
1.5
5.0
Vin, Input Voltage (V)
Figure 10. Quiescent Current versus Input Voltage
IQ, QUIESCENT CURRENT (mA)
0
TA, Ambient Temperature (°C)
1.4
IQ, QUIESCENT CURRENT (mA)
Vin = 5.0 V
IO = 10 mA
0
20
40
60
Vin = 5.0 V
1.1
1.0
0.9
0.8
MC78LC30HT1
0.7
0.6
−40
80
−20
0
20
40
60
80
TA, Ambient Temperature (°C)
TA, Ambient Temperature (°C)
Figure 12. Quiescent Current versus Temperature
Figure 13. Quiescent Current versus Temperature
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MC78LC00 Series
0.8
NTR Series
0.7
Vin − Vout, DROPOUT VOLTAGE (V)
Vin − Vout, DROPOUT VOLTAGE (V)
0.8
HT1 Series
0.7
0.6
IO = 10 mA
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
0.1
0
0.0
1.0
2.0
4.0
3.0
5.0
6.0
IO = 1.0 mA
0
0
1.0
2.0
VO, Set Output Voltage (V)
Output Voltage
Deviation (mV)
INPUT VOLTAGE/OUTPUT VOLTAGE (V)
Input Voltage (V)
6.0
NTR Series
5.0
4.0
Vin = 4.5 V to 5.5 V
Vout = 3.0 V
200
RL = 3 k
Cout = 0.1 mF
100
0
−100
−200
−300
0
0.5
1.0
1.5
2.0
2.5
6.0
8.0
7.5
Input Voltage
7.0
6.5
6.0
HT1 Series
5.5
Output Voltage
5.0
CO = 0.1 mF
IO = 1.0 mA
4.5
4.0
0
2.0
4.0
6.0
t, Time (ms)
Figure 16. Line Transient
Figure 17. Line Transient Response
1.5
TA = 25°C
3.0
NTR Series
Ig GROUND CURRENT (mA)
Vout, OUTPUT VOLTAGE (V)
5.0
Time (mS)
3.5
2.5
2.0
1.5
IO = 50 mA
1.0
100 mA
0.5
0
4.0
Figure 15. Dropout Voltage versus
Set Output Voltage
Figure 14. Dropout Voltage versus Set Output Voltage
300
3.0
VO, Set Output Voltage (V)
TA = 25°C
IO = 0 mA
1.0
NTR Series
50 mA
0.8
200 mA
0.6
100 mA
50 mA
0.4
0.2
200 mA
200 mA
0
0.5
1.0
1.5
2.0
0
2.5
0
Vin, Input Voltage (V)
0.5
1.0
1.5
2.0
2.5
Vin, Input Voltage (V)
Figure 18. Output Voltage versus Input Voltage
Figure 19. Ground Current versus Input Voltage
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7
MC78LC00 Series
APPLICATIONS INFORMATION
Thermal
A typical application circuit for the MC78LC00 series is
shown in Figure 20.
As power across the MC78LC00 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and also the
ambient temperature effect the rate of temperature rise for
the part. This is stating that when the MC78LC00 has good
thermal conductivity through the PCB, the junction
temperature will be relatively low with high power
dissipation applications.
The maximum dissipation the package can handle is
given by:
Input Decoupling (C1)
A 0.1 mF capacitor either ceramic or tantalum is
recommended and should be connected close to the
MC78LC00 package. Higher values and lower ESR will
improve the overall line transient response.
Output Decoupling (C2)
The MC78LC00 is a stable component and does not
require any specific Equivalent Series Resistance (ESR) or
a minimum output current. Capacitors exhibiting ESRs
ranging from a few mW up to 3.0 W can thus safely be used.
The minimum decoupling value is 0.1 mF and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors as well as
tantalum devices. Larger values improve noise rejection and
load regulation transient response.
PD +
If junction temperature is not allowed above the
maximum 125°C, then the MC78LC00NTR can dissipate
up to 357 mW @ 25°C.
The power dissipated by the MC78LC00NTR can be
calculated from the following equation:
Hints
Please be sure the Vin and GND lines are sufficiently
wide. When the impedance of these lines is high, there is a
chance to pick up noise or cause the regulator to
malfunction.
Set external components, especially the output capacitor,
as close as possible to the circuit, and make leads as short as
possible.
Battery or
Unregulated
Voltage
TJ(max) * TA
RqJA
Ptot + ƪVin * Ignd (Iout)ƫ ) [Vin * Vout] * Iout
or
P ) Vout * Iout
VinMAX + tot
Ignd ) Iout
If an 80 mA output current is needed then the ground
current from the data sheet is 1.1 mA. For an
MC78LC30NTR (3.0 V), the maximum input voltage will
then be 7.4 V.
+
C1
Vout
+
C2
Figure 20. Basic Application Circuit for NTR Suffixes
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8
MC78LC00 Series
MJD32C
0.033 mF
2
100
Vin
MC78LC00
3
VO
MC78LC00
1
1
0.1 mF
2
Vin
C1
0.1 mF
3
R1
ICC
R2
Figure 21. Current Boost Circuit
R2
Figure 22. Adjustable VO
MJD32C
Q1
Q2
Vin
C2
GND
GND
GND
VO
0.033 mF
MMBT2907
ALT1
2
R1
MC78LC00
3
1
0.1 mF
VO
0.1 mF
GND
GND
Figure 23. Current Boost Circuit with
Overcurrent Limit Circuit
V
O
+ V
O(Reg)
ǒ1 ) R2
Ǔ ) ICC R2
R1
I
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9
O(short circuit)
[
V
BE2 )
R2
V
BE1
) V
R1
BE2
MC78LC00 Series
ORDERING INFORMATION
Nominal
Output Voltage
Marking
MC78LC18NTRG
1.8
LAH
MC78LC25NTRG
2.5
LAI
MC78LC30NTRG
3.0
LAL
MC78LC33NTRG
3.3
LAM
MC78LC50NTRG
5.0
LAN
Device
Package
Shipping†
Thin SOT23−5
(Pb−Free)
3000 Units/7″ Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Additional voltages in 100 mV steps are available upon request by contacting your onsemi representative.
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10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−89 (3−LEAD)
CASE 1213−02
ISSUE C
DATE 05/24/2001
SCALE 2:1
−A−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. 1213-01 OBSOLETE, NEW STANDARD 1213-02.
C
J
F
−B−
L
K
D
0.10
E
G
M
T B
S
A
S
2 PL
0.10
M
T B
S
A
−T−
SEATING
PLANE
DIM
A
B
C
D
E
F
G
H
J
K
L
MARKING
DIAGRAM
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
STYLE 2:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
xxxxx
xxxxx
DESCRIPTION:
INCHES
MIN
MAX
0.173
0.181
0.094
0.102
0.055
0.063
0.015
0.022
0.013
0.020
0.059
0.072
0.059 BSC
0.118 BSC
0.012
0.020
0.031
----0.167
S
H
DOCUMENT NUMBER:
MILLIMETERS
MIN
MAX
4.40
4.60
2.40
2.60
1.40
1.60
0.37
0.57
0.32
0.52
1.50
1.83
1.50 BSC
3.00 BSC
0.30
0.50
0.80
----4.25
98ASH70519A
SOT−89 (3−LEAD)
= Specific Device Code
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE N
5
1
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
NOTE 5
2X
DATE 12 AUG 2020
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XXX MG
G
Discrete/Logic
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ARB18753C
TSOP−5
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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