MC79L24ACPRM

Negative Voltage Regulators 100 mA MC79L00A Series The MC79L00A Series negative voltage regulators are inexpensive, easy−to−use devices suitable for numerous applications requiring up to 100 mA. Like the higher powered MC7900 Series negative regulators, this series features thermal shutdown and current limiting, making them remarkably rugged. In most applications, no external components are required for operation. The MC79L00A devices are useful for on−card regulation or any other application where a regulated negative voltage at a modest current level is needed. These regulators offer substantial advantage over the common resistor/Zener diode approach. www.onsemi.com THREE−TERMINAL LOW CURRENT NEGATIVE FIXED VOLTAGE REGULATORS MARKING DIAGRAMS Features • • • • • • No External Components Required Internal Short Circuit Current Limiting Internal Thermal Overload Protection Low Cost Complementary Positive Regulators Offered (MC78L00 Series) Pb−Free Packages are Available Pin 1. Vout 2. Vin 3. Vin 4. NC 5. GND 6. Vin 7. Vin 8. NC 8 1 SOIC−8 D SUFFIX CASE 751 R1 R8 R6 Q10 Q5 R9 Q4 1 12 3 STRAIGHT LEAD R17 R7 Q8 Q1 R16 R4 1 2 3 BENT LEAD Pin 1. Ground 2. Input 3. Output Q14 Q9 9Lxxx ALYWy G TO−92 P SUFFIX CASE 29−10 GND R 5 R18 8 Output MC79L xxxxx ALYW Q12 R2 Z1 R3 C Q7 Q6 R10 Q13 Q2 R11 Q11 R14 R15 Input *Automotive temperature range selections are available with special test conditions and additional tests in 5, 12 and 15 V devices. Contact your local ON Semiconductor sales office for information. xxx A L Y W y = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = B or C Figure 1. Representative Schematic Diagram ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 1994 April, 2021 − Rev. 11 1 Publication Order Number: MC79L00/D MC79L00A Series MAXIMUM RATINGS (TA = +25°C, unless otherwise noted.) Symbol Value Unit VI −30 −35 −40 Vdc Power Dissipation Case 29 (TO−92 Type) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case PD RqJA RqJC Internally Limited 160 83 W °C/W °C/W Case 751 (SOIC−8 Type) (Note 1) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case PD RqJA RqJC Internally Limited 180 45 W °C/W °C/W Tstg −65 to +150 °C TJ +150 °C Rating Input Voltage (−5 V) (−12, −15, −18 V) (−24 V) Storage Temperature Range Junction Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. SOIC−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 9 for Thermal Resistance variation versus pad size. *This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL_STD_883, Method 3015 Machine Model Method 200 V. ELECTRICAL CHARACTERISTICS (VI = −10 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, −40°C < TJ +125°C (for MC79LXXAB), 0°C < TJ < +125°C (for MC79LXXAC)). MC79L05AC, AB Characteristics Symbol Min Typ Max Unit VO −4.8 −5.0 −5.2 Vdc − − − − 150 100 − − − − 60 30 −4.75 −4.75 − − −5.25 −5.25 − − − − 6.0 5.5 − − − − 1.5 0.1 Output Voltage (TJ = +25°C) Input Regulation (TJ = +25°C) −7.0 Vdc ≥ VI ≥ −20 Vdc −8.0 Vdc ≥ VI ≥ −20 Vdc Regline Load Regulation TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA 1.0 mA ≤ IO ≤ 40 mA Regload mV mV Output Voltage −7.0 Vdc ≥ VI ≥ −20 Vdc, 1.0 mA ≤ IO ≤ 40 mA VI = −10 Vdc, 1.0 mA ≤ IO ≤ 70 mA VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change −8.0 Vdc ≥ VI ≥ −20 Vdc 1.0 mA ≤ IO ≤ 40 mA IIB Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 40 − mV Ripple Rejection (−8.0 ≥ VI ≥ −18 Vdc, f = 120 Hz, TJ = +25°C) RR 41 49 − dB |VI−VO| − 1.7 − Vdc Dropout Voltage (IO = 40 mA, TJ = +25°C) Vdc mA mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2 MC79L00A Series ELECTRICAL CHARACTERISTICS (VI = −19 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, −40°C < TJ +125°C (for MC79LXXAB), 0°C < TJ < +125°C (for MC79LXXAC)). MC79L12AC, AB Characteristics Symbol Min Typ Max Unit VO −11.5 −12 −12.5 Vdc − − − − 250 200 − − − − Output Voltage (TJ = +25°C) Input Regulation (TJ = +25°C) −14.5 Vdc ≥ VI ≥ −27 Vdc −16 Vdc ≥ VI ≥ −27 Vdc Regline Load Regulation TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA 1.0 mA ≤ IO ≤ 40 mA Regload Output Voltage −14.5 Vdc ≥ VI ≥ −27 Vdc, 1.0 mA ≤ IO ≤ 40 mA VI = −19 Vdc, 1.0 mA ≤ IO ≤ 70 mA VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change −16 Vdc ≥ VI ≥ −27 Vdc 1.0 mA ≤ IO ≤ 40 mA IIB Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Ripple Rejection (−15 ≤ VI ≤ −25 Vdc, f = 120 Hz, TJ = +25°C) Dropout Voltage (IO = 40 mA, TJ = +25°C) −11.4 −11.4 − − − − − − − − − − Vn − RR |VI−VO| mV 100 50 mV −12.6 −12.6 Vdc 6.5 6.0 mA 1.5 0.2 mA 80 − mV 37 42 − dB − 1.7 − Vdc Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ELECTRICAL CHARACTERISTICS (VI = −23 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, −40°C < TJ +125°C (for MC79LXXAB), 0°C < TJ < +125°C (for MC79LXXAC)). MC79L15AC, AB Characteristics Symbol Min Typ Max Unit VO −14.4 −15 −15.6 Vdc − − − − 300 250 − − − − 150 75 −14.25 −14.25 − − −15.75 −15.75 − − − − 6.5 6.0 − − − − 1.5 0.1 Output Voltage (TJ = +25°C) Input Regulation (TJ = +25°C) −17.5 Vdc ≥ VI ≥ −30 Vdc −20 Vdc ≥ VI ≥ −30 Vdc Regline Load Regulation TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA 1.0 mA ≤ IO ≤ 40 mA Regload Output Voltage −17.5 Vdc ≥ VI ≥ −Vdc, 1.0 mA ≤ IO ≤ 40 mA VI = −23 Vdc, 1.0 mA ≤ IO ≤ 70 mA VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB mV mV Vdc mA Input Bias Current Change −20 Vdc ≥ VI ≥ −30 Vdc 1.0 mA ≤ IO ≤ 40 mA DIIB Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) VN − 90 − mV Ripple Rejection (−18.5 ≤ VI ≤ −28.5 Vdc, f = 120 Hz) RR 34 39 − dB |VI−VO| − 1.7 − Vdc Dropout Voltage IO = 40 mA, TJ = +25°C mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 MC79L00A Series ELECTRICAL CHARACTERISTICS (VI = −27 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, −40°C < TJ +125°C (for MC79LXXAB), 0°C < TJ < +125°C (for MC79LXXAC), unless otherwise noted). MC79L18AC Characteristics Symbol Min Typ Max Unit VO −17.3 −18 −18.7 Vdc − − − − − − − − 325 − − 275 − − − − 170 85 −17.1 − −17.1 − − − −18.9 − −18.9 − − − − 6.5 6.0 − − − − − − 1.5 − 0.1 Output Voltage (TJ = +25°C) Input Regulation (TJ = +25°C) −20.7 Vdc ≥ VI ≥ −33 Vdc −21.4 Vdc ≥ VI ≥ −33 Vdc −22 Vdc ≥ VI ≥ −33 Vdc −21 Vdc ≥ VI ≥ −33 Vdc Regline Load Regulation TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA 1.0 mA ≤ IO ≤ 40 mA Regload mV mV Output Voltage −20.7 Vdc ≥ VI ≥ −33 Vdc, 1.0 mA ≤ IO ≤ 40 mA −21.4 Vdc ≥ VI ≥ −33 Vdc, 1.0 mA ≤ IO ≤ 40 mA VI = −27 Vdc, 1.0 mA ≤ IO ≤ 70 mA VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change −21 Vdc ≥ VI ≥ −33 Vdc −27 Vdc ≥ VI ≥ −33 Vdc 1.0 mA ≤ IO ≤ 40 mA IIB Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 150 − mV Ripple Rejection (−23 ≤ VI ≤ −33 Vdc, f = 120 Hz, TJ = +25°C) RR 33 48 − dB |VI−VO| − 1.7 − Vdc Dropout Voltage IO = 40 mA, TJ = +25°C Vdc mA mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ELECTRICAL CHARACTERISTICS (VI = −33 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, −40°C < TJ +125°C (for MC79LXXAB), 0°C < TJ < +125°C (for MC79LXXAC), unless otherwise noted). MC79L24AC Characteristics Symbol Min Typ Max Unit VO −23 −24 −25 Vdc − − − − − − 350 − 300 − − − − 200 100 −22.8 − −22.8 − − − −25.2 − −25.2 − − − − 6.5 6.0 − − − − 1.5 0.1 Output Voltage (TJ = +25°C) Input Regulation (TJ = +25°C) −27 Vdc ≥ VI ≥ −38 Vdc −27.5 Vdc ≥ VI ≥ −38 Vdc −28 Vdc ≥ VI ≥ −38 Vdc Regline Load Regulation TJ = +25°C, 1.0 mA ≤ IO ≤ 100 mA 1.0 mA ≤ IO ≤ 40 mA Regload Output Voltage −27 Vdc ≥ VI ≥ −38 V, 1.0 mA ≤ IO ≤ 40 mA −28 Vdc ≥ VI ≥ −38 Vdc, 1.0 mA ≤ IO ≤ 40 mA VI = −33 Vdc, 1.0 mA ≤ IO ≤ 70 mA VO Input Bias Current (TJ = +25°C) (TJ = +125°C) IIB Input Bias Current Change −28 Vdc ≥ VI ≥ −38 Vdc 1.0 mA ≤ IO ≤ 40 mA DIIB mV mV Vdc mA mA Output Noise Voltage (TA = +25°C, 10 Hz ≤ f ≤ 100 kHz) Vn − 200 − mV Ripple Rejection (−29 ≤ VI ≤ −35 Vdc, f = 120 Hz, TJ = +25°C) RR 31 47 − dB |VI−VO| − 1.7 − Vdc Dropout Voltage IO = 40 mA, TJ = +25°C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 4 MC79L00A Series APPLICATIONS INFORMATION Design Considerations high−frequency characteristics to insure stable operation under all load conditions. A 0.33 mF or larger tantalum, mylar, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with the shortest possible leads directly across the regulator’s input terminals. Normally good construction techniques should be used to minimize ground loops and lead resistance drops since the regulator has no external sense lead. Bypassing the output is also recommended. The MC79L00A Series of fixed voltage regulators are designed with Thermal Overload Protections that shuts down the circuit when subjected to an excessive power overload condition, Internal Short Circuit Protection that limits the maximum current the circuit will pass. In many low current applications, compensation capacitors are not required. However, it is recommended that the regulator input be bypassed with a capacitor if the regulator is connected to the power supply filter with long wire length, or if the output load capacitance is large. An input bypass capacitor should be selected to provide good Input +Vin MC78LXX +VO CI* 0.33mF 0.1mF 0.33mF MC79LXX Output CO** 0.1mF 0.1mF -Vin MC79LXX A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output voltage even during the low point on the ripple voltage. -VO 0.33mF * CI is required if regulator is located an appreciable * distance from the power supply filter ** CO improves stability and transient response. Figure 2. Positive and Negative Regulator Figure 3. Standard Application www.onsemi.com 5 MC79L00A Series TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted.) MC79L05C VO = -5.0 V TJ = 25°C 6.0 IO = 1.0 mA 4.0 IO = 100 mA 2.0 IO = 40 mA 0 0 -2.0 -4.0 -6.0 Vin, INPUT VOLTAGE (V) -0.8 -2.5 V I -V O , INPUT/OUTPUT DIFFERENTIAL VOLTAGE (V) -2.0 IO = 70 mA IO = 40 mA -1.5 IO = 1.0 mA -1.0 Dropout of Regulation is defined when DVO = 2% of VO -0.5 0 -10 0 25 Figure 4. Dropout Characteristics I IB , INPUT BIAS CURRENT (mA) 5.0 4.0 3.8 3.6 3.4 MC79L05C Vin = -10 V VO = -5.0 V IO = 40 mA 3.2 3.0 0 0 25 50 75 100 TA, AMBIENT TEMPERATURE (°C) 4.0 3.0 2.0 1.0 0 125 MC79L05C VO = -5.0 V IO = 40 mA 0 -5.0 Figure 6. Input Bias Current versus Ambient Temperature -10 -15 -20 -25 -30 Vin, INPUT VOLTAGE (V) -35 170 3.2 RθJA , THERMAL RESISTANCE JUNCTION-TO-AIR (°C/W) 150 2.8 PD(max) for TA = +50°C 130 1,000 No Heatsink 100 RqJA = 200°C/W PD(max) to 25°C = 625 mW 10 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) -40 Figure 7. Input Bias Current versus Input Voltage 10,000 P D , POWER DISSIPATION (mW) 125 Figure 5. Dropout Voltage versus Junction Temperature 4.2 I IB , INPUT BIAS CURRENT (mA) 50 75 100 TJ, JUNCTION TEMPERATURE (°C) 2.4 ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ 110 Graph represents symmetrical layout 90 L 70 L 1.6 1.2 3.0 mm 50 0.8 RqJA 30 0 150 2.0 oz. Copper 2.0 10 20 30 L, LENGTH OF COPPER (mm) 40 0.4 50 Figure 9. SOP−8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length Figure 8. Maximum Average Power Dissipation versus Ambient Temperature (TO−92) www.onsemi.com 6 PD, MAXIMUM POWER DISSIPATION (W) VO, OUTPUT VOLTAGE (V) 8.0 MC79L00A Series ORDERING INFORMATION Nominal Voltage Operating Temperature Range Package Shipping† −5.0 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC79L05ABDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC79L05ABPG TO−92 (Pb−Free) 2000 Units / Bag MC79L05ABPRAG TO−92 (Pb−Free) 2000 / Tape & Reel SOIC−8 (Pb−Free) 98 Units / Rail MC79L05ACDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC79L05ACPG TO−92 (Pb−Free) 2000 Units / Bag MC79L05ACPRAG TO−92 (Pb−Free) 2000 / Tape & Reel MC79L05ACPRMG TO−92 (Pb−Free) 2000 / Tape & Ammo Box MC79L05ACPRPG TO−92 (Pb−Free) 2000 / Tape & Ammo Box SOIC−8 (Pb−Free) 98 Units / Rail MC79L12ABDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC79L12ABPG TO−92 (Pb−Free) 2000 Units / Bag MC79L12ABPRAG TO−92 (Pb−Free) 2000 / Tape & Reel SOIC−8 (Pb−Free) 98 Units / Rail MC79L12ACDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC79L12ACPG TO−92 (Pb−Free) 2000 Units / Bag MC79L12ACPRAG TO−92 (Pb−Free) 2000 / Tape & Reel MC79L12ACPRPG TO−92 (Pb−Free) 2000 / Tape & Ammo Box Device MC79L05ABDG MC79L05ACDG MC79L12ABDG MC79L12ACDG TJ = 0° to +125°C −12 V −12 V TJ = −40° to +125°C TJ = 0° to +125°C www.onsemi.com 7 MC79L00A Series ORDERING INFORMATION (continued) Nominal Voltage Operating Temperature Range Package Shipping† −15 V TJ = −40° to +125°C SOIC−8 (Pb−Free) 98 Units / Rail MC79L15ABDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC79L15ABPG TO−92 (Pb−Free) 2000 Units / Bag MC79L15ABPRPG TO−92 (Pb−Free) 2000 / Tape & Ammo Box SOIC−8 (Pb−Free) 98 Units / Rail MC79L15ACDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC79L15ACPG TO−92 (Pb−Free) 2000 Units / Bag MC79L15ACPRAG TO−92 (Pb−Free) 2000 / Tape & Reel MC79L15ACPREG TO−92 (Pb−Free) 2000 / Tape & Reel MC79L15ACPRPG TO−92 (Pb−Free) 2000 / Tape & Ammo Box TJ = −40° to +125°C TO−92 (Pb−Free) 2000 / Tape & Ammo Box TJ = 0° to +125°C TO−92 (Pb−Free) 2000 Units / Bag TJ = −40° to +125°C TO−92 (Pb−Free) 2000 Units / Bag TJ = 0° to +125°C TO−92 (Pb−Free) 2000 Units / Bag MC79L24ACPRMG TO−92 (Pb−Free) 2000 / Tape & Ammo Box MC79L24ACPRPG TO−92 (Pb−Free) 2000 / Tape & Ammo Box Device MC79L15ABDG MC79L15ACDG MC79L18ABPRPG TJ = 0° to +125°C −18 V MC79L18ACPG MC79L24ABPG MC79L24ACPG −24 V †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−92 (TO−226) 1 WATT CASE 29−10 ISSUE D SCALE 1:1 12 3 STRAIGHT LEAD 1 DATE 05 MAR 2021 2 3 BENT LEAD STYLES AND MARKING ON PAGE 3 DOCUMENT NUMBER: DESCRIPTION: 98AON52857E TO−92 (TO−226) 1 WATT Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 3 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−92 (TO−226) 1 WATT CASE 29−10 ISSUE D DATE 05 MAR 2021 STYLES AND MARKING ON PAGE 3 DOCUMENT NUMBER: DESCRIPTION: 98AON52857E TO−92 (TO−226) 1 WATT Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 3 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com TO−92 (TO−226) 1 WATT CASE 29−10 ISSUE D DATE 05 MAR 2021 STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR STYLE 2: PIN 1. BASE 2. EMITTER 3. COLLECTOR STYLE 3: PIN 1. ANODE 2. ANODE 3. CATHODE STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE STYLE 5: PIN 1. DRAIN 2. SOURCE 3. GATE STYLE 6: PIN 1. GATE 2. SOURCE & SUBSTRATE 3. DRAIN STYLE 7: PIN 1. SOURCE 2. DRAIN 3. GATE STYLE 8: PIN 1. DRAIN 2. GATE 3. SOURCE & SUBSTRATE STYLE 9: PIN 1. BASE 1 2. EMITTER 3. BASE 2 STYLE 10: PIN 1. CATHODE 2. GATE 3. ANODE STYLE 11: PIN 1. ANODE 2. CATHODE & ANODE 3. CATHODE STYLE 12: PIN 1. MAIN TERMINAL 1 2. GATE 3. MAIN TERMINAL 2 STYLE 13: PIN 1. ANODE 1 2. GATE 3. CATHODE 2 STYLE 14: PIN 1. EMITTER 2. COLLECTOR 3. BASE STYLE 15: PIN 1. ANODE 1 2. CATHODE 3. ANODE 2 STYLE 16: PIN 1. ANODE 2. GATE 3. CATHODE STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER STYLE 18: PIN 1. ANODE 2. CATHODE 3. NOT CONNECTED STYLE 19: PIN 1. GATE 2. ANODE 3. CATHODE STYLE 20: PIN 1. NOT CONNECTED 2. CATHODE 3. ANODE STYLE 21: PIN 1. COLLECTOR 2. EMITTER 3. BASE STYLE 22: PIN 1. SOURCE 2. GATE 3. DRAIN STYLE 23: PIN 1. GATE 2. SOURCE 3. DRAIN STYLE 24: PIN 1. EMITTER 2. COLLECTOR/ANODE 3. CATHODE STYLE 25: PIN 1. MT 1 2. GATE 3. MT 2 STYLE 26: PIN 1. 2. 3. STYLE 27: PIN 1. MT 2. SUBSTRATE 3. MT STYLE 28: PIN 1. CATHODE 2. ANODE 3. GATE STYLE 29: PIN 1. NOT CONNECTED 2. ANODE 3. CATHODE STYLE 30: PIN 1. DRAIN 2. GATE 3. SOURCE STYLE 32: PIN 1. BASE 2. COLLECTOR 3. EMITTER STYLE 33: PIN 1. RETURN 2. INPUT 3. OUTPUT STYLE 34: PIN 1. INPUT 2. GROUND 3. LOGIC STYLE 35: PIN 1. GATE 2. COLLECTOR 3. EMITTER VCC GROUND 2 OUTPUT STYLE 31: PIN 1. GATE 2. DRAIN 3. SOURCE GENERIC MARKING DIAGRAM* XXXXX XXXXX ALYWG G XXXX A L Y W G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON52857E TO−92 (TO−226) 1 WATT Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 3 OF 3 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK 8 1 SCALE 1:1 −X− DATE 16 FEB 2011 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N X 45 _ SEATING PLANE −Z− 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S 8 8 1 1 IC 4.0 0.155 XXXXX A L Y W G IC (Pb−Free) = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package XXXXXX AYWW 1 1 Discrete XXXXXX AYWW G Discrete (Pb−Free) XXXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. 1.270 0.050 SCALE 6:1 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 8 8 XXXXX ALYWX G XXXXX ALYWX 1.52 0.060 0.6 0.024 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 7.0 0.275 DIM A B C D G H J K M N S mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. STYLES ON PAGE 2 DOCUMENT NUMBER: DESCRIPTION: 98ASB42564B SOIC−8 NB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com SOIC−8 NB CASE 751−07 ISSUE AK DATE 16 FEB 2011 STYLE 1: PIN 1. EMITTER 2. COLLECTOR 3. COLLECTOR 4. EMITTER 5. EMITTER 6. BASE 7. BASE 8. EMITTER STYLE 2: PIN 1. COLLECTOR, DIE, #1 2. COLLECTOR, #1 3. COLLECTOR, #2 4. COLLECTOR, #2 5. BASE, #2 6. EMITTER, #2 7. BASE, #1 8. EMITTER, #1 STYLE 3: PIN 1. DRAIN, DIE #1 2. DRAIN, #1 3. DRAIN, #2 4. DRAIN, #2 5. GATE, #2 6. SOURCE, #2 7. GATE, #1 8. SOURCE, #1 STYLE 4: PIN 1. ANODE 2. ANODE 3. ANODE 4. ANODE 5. ANODE 6. ANODE 7. ANODE 8. COMMON CATHODE STYLE 5: PIN 1. DRAIN 2. DRAIN 3. DRAIN 4. DRAIN 5. GATE 6. GATE 7. SOURCE 8. SOURCE STYLE 6: PIN 1. SOURCE 2. DRAIN 3. DRAIN 4. SOURCE 5. SOURCE 6. GATE 7. GATE 8. SOURCE STYLE 7: PIN 1. INPUT 2. EXTERNAL BYPASS 3. THIRD STAGE SOURCE 4. GROUND 5. DRAIN 6. GATE 3 7. SECOND STAGE Vd 8. FIRST STAGE Vd STYLE 8: PIN 1. COLLECTOR, DIE #1 2. BASE, #1 3. BASE, #2 4. COLLECTOR, #2 5. COLLECTOR, #2 6. EMITTER, #2 7. EMITTER, #1 8. COLLECTOR, #1 STYLE 9: PIN 1. EMITTER, COMMON 2. COLLECTOR, DIE #1 3. COLLECTOR, DIE #2 4. EMITTER, COMMON 5. EMITTER, COMMON 6. BASE, DIE #2 7. BASE, DIE #1 8. EMITTER, COMMON STYLE 10: PIN 1. GROUND 2. BIAS 1 3. OUTPUT 4. GROUND 5. GROUND 6. BIAS 2 7. INPUT 8. GROUND STYLE 11: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. DRAIN 2 7. DRAIN 1 8. DRAIN 1 STYLE 12: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 13: PIN 1. N.C. 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 14: PIN 1. N−SOURCE 2. N−GATE 3. P−SOURCE 4. P−GATE 5. P−DRAIN 6. P−DRAIN 7. N−DRAIN 8. N−DRAIN STYLE 15: PIN 1. ANODE 1 2. ANODE 1 3. ANODE 1 4. ANODE 1 5. CATHODE, COMMON 6. CATHODE, COMMON 7. CATHODE, COMMON 8. CATHODE, COMMON STYLE 16: PIN 1. EMITTER, DIE #1 2. BASE, DIE #1 3. EMITTER, DIE #2 4. BASE, DIE #2 5. COLLECTOR, DIE #2 6. COLLECTOR, DIE #2 7. COLLECTOR, DIE #1 8. COLLECTOR, DIE #1 STYLE 17: PIN 1. VCC 2. V2OUT 3. V1OUT 4. TXE 5. RXE 6. VEE 7. GND 8. ACC STYLE 18: PIN 1. ANODE 2. ANODE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. CATHODE 8. CATHODE STYLE 19: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. MIRROR 2 7. DRAIN 1 8. MIRROR 1 STYLE 20: PIN 1. SOURCE (N) 2. GATE (N) 3. SOURCE (P) 4. GATE (P) 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 21: PIN 1. CATHODE 1 2. CATHODE 2 3. CATHODE 3 4. CATHODE 4 5. CATHODE 5 6. COMMON ANODE 7. COMMON ANODE 8. CATHODE 6 STYLE 22: PIN 1. I/O LINE 1 2. COMMON CATHODE/VCC 3. COMMON CATHODE/VCC 4. I/O LINE 3 5. COMMON ANODE/GND 6. I/O LINE 4 7. I/O LINE 5 8. COMMON ANODE/GND STYLE 23: PIN 1. LINE 1 IN 2. COMMON ANODE/GND 3. COMMON ANODE/GND 4. LINE 2 IN 5. LINE 2 OUT 6. COMMON ANODE/GND 7. COMMON ANODE/GND 8. LINE 1 OUT STYLE 24: PIN 1. BASE 2. EMITTER 3. COLLECTOR/ANODE 4. COLLECTOR/ANODE 5. CATHODE 6. CATHODE 7. COLLECTOR/ANODE 8. COLLECTOR/ANODE STYLE 25: PIN 1. VIN 2. N/C 3. REXT 4. GND 5. IOUT 6. IOUT 7. IOUT 8. IOUT STYLE 26: PIN 1. GND 2. dv/dt 3. ENABLE 4. ILIMIT 5. SOURCE 6. SOURCE 7. SOURCE 8. VCC STYLE 29: PIN 1. BASE, DIE #1 2. EMITTER, #1 3. BASE, #2 4. EMITTER, #2 5. COLLECTOR, #2 6. COLLECTOR, #2 7. COLLECTOR, #1 8. COLLECTOR, #1 STYLE 30: PIN 1. DRAIN 1 2. DRAIN 1 3. GATE 2 4. SOURCE 2 5. SOURCE 1/DRAIN 2 6. SOURCE 1/DRAIN 2 7. SOURCE 1/DRAIN 2 8. GATE 1 DOCUMENT NUMBER: DESCRIPTION: 98ASB42564B SOIC−8 NB STYLE 27: PIN 1. ILIMIT 2. OVLO 3. UVLO 4. INPUT+ 5. SOURCE 6. SOURCE 7. SOURCE 8. DRAIN STYLE 28: PIN 1. SW_TO_GND 2. DASIC_OFF 3. DASIC_SW_DET 4. GND 5. V_MON 6. VBULK 7. VBULK 8. VIN Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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