MCR22−6, MCR22−8
Preferred Device
Sensitive Gate
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed and tested for repetitive peak operation required for CD
ignition, fuel ignitors, flash circuits, motor controls and low-power
switching applications.
• 150 Amperes for 2 μs Safe Area
• High dv/dt
• Very Low Forward “On” Voltage at High Current
• Low-Cost TO-226AA (TO-92)
• Device Marking: Device Type, e.g., MCR22−6, Date Code
w
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SCRs
1.5 AMPERES RMS
400 thru 600 VOLTS
These devices are available in Pb−free package(s). Specifications herein
apply to both standard and Pb−free devices. Please see our website at
www.onsemi.com for specific Pb−free orderable part numbers, or
contact your local ON Semiconductor sales office or representative.
G
A
K
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Peak Repetitive Off−State Voltage
(RGK = IK, TJ = *40 to +110°C,
Sine Wave, 50 to 60 Hz, Gate Open)
MCR22−6
MCR22−8
VDRM,
VRRM
On-State Current RMS
(180° Conduction Angles, TC = 80°C)
IT(RMS)
1.5
Amps
ITSM
15
Amps
I2t
0.9
A2s
Peak Non-repetitive Surge Current,
TA = 25°C
(1/2 Cycle, Sine Wave, 60 Hz)
Circuit Fusing Considerations (t = 8.3 ms)
Forward Peak Gate Power
(Pulse Width ≤ 1.0 msec, TA = 25°C)
Value
Unit
Volts
400
600
1
PGM
0.5
Watt
PG(AV)
0.1
Watt
Forward Peak Gate Current
(Pulse Width ≤ 1.0 μs, TA = 25°C)
IFGM
0.2
Amp
Reverse Peak Gate Voltage
(Pulse Width ≤ 1.0 μs, TA = 25°C)
VRGM
5.0
Volts
Operating Junction Temperature Range
@ Rated VRRM and VDRM
TJ
−40 to
+110
°C
Storage Temperature Range
Tstg
−40 to
+150
°C
Forward Average Gate Power
(t = 8.3 msec, TA = 25°C)
2
3
TO−92 (TO−226AA)
CASE 029
STYLE 10
PIN ASSIGNMENT
1
Cathode
2
Gate
3
Anode
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
(1) VDRM and VRRM for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; however, positive gate voltage
shall not be applied concurrent with negative potential on the anode.
Blocking voltages shall not be tested with a constant current source such
that the voltage ratings of the devices are exceeded.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 4
1
Publication Order Number:
MCR22−6/D
MCR22−6, MCR22−8
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction to Case
RθJC
50
°C/W
Thermal Resistance, Junction to Ambient
RθJA
160
°C/W
TL
+260
°C
Lead Solder Temperature
(Lead Length q 1/16″ from case, 10 s Max)
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
—
—
—
—
10
200
μA
μA
VTM
—
1.2
1.7
Volts
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(VAK = Rated VDRM or VRRM; RGK = 1000 Ohms)
TC = 25°C
TC = 110°C
IDRM, IRRM
ON CHARACTERISTICS
Peak Forward On−State Voltage(1)
(ITM = 1 A Peak)
Gate Trigger Current (Continuous dc)(2)
(VAK = 6 Vdc, RL = 100 Ohms)
TC = 25°C
TC = −40°C
IGT
—
—
30
—
200
500
μA
Gate Trigger Voltage (Continuous dc)(2)
(VAK = 7 Vdc, RL = 100 Ohms)
TC = 25°C
TC = −40°C
VGT
—
—
—
—
0.8
1.2
Volts
Gate Non−Trigger Voltage(1)
(VAK = 12 Vdc, RL = 100 Ohms)
VGD
0.1
—
—
Volts
TC = 110°C
Holding Current
(VAK = 12 Vdc, Gate Open)
Initiating Current = 200 mA
TC = 25°C
TC = −40°C
—
—
2.0
—
5.0
10
—
25
—
IH
mA
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Off−State Voltage
(TC = 110°C)
dv/dt
(1) Pulse Width = 1.0 ms, Duty Cycle v 1%.
(2) RGK Current not included in measurement.
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2
V/μs
MCR22−6, MCR22−8
Voltage Current Characteristic of SCR
+ Current
Symbol
Parameter
VDRM
Peak Repetitive Off State Forward Voltage
IDRM
Peak Forward Blocking Current
VRRM
Peak Repetitive Off State Reverse Voltage
IRRM
Peak Reverse Blocking Current
VTM
Peak on State Voltage
IH
Holding Current
Anode +
VTM
on state
IH
IRRM at VRRM
Reverse Blocking Region
(off state)
Reverse Avalanche Region
+ Voltage
IDRM at VDRM
Forward Blocking Region
(off state)
Anode −
TA , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE (° C)
TC , MAXIMUM ALLOWABLE CASE TEMPERATURE (° C)
CURRENT DERATING
140
140
120
100
100
α = 180°
α = CONDUCTION
ANGLE
60
dc
20
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
80
60
dc
40
α = 180°
α = CONDUCTION ANGLE
20
0
0
Figure 1. Maximum Case Temperature
0.2
0.4
0.6
0.8
IT(AV), AVERAGE ON-STATE CURRENT (AMP)
Figure 2. Maximum Ambient Temperature
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3
1.0
MCR22−6, MCR22−8
5.0
3.0
TJ = 110°C
2.0
I T , INSTANTANEOUS ON-STATE CURRENT (AMP)
25°C
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0
0.5
1.5
1.0
2.0
2.5
VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 3. Typical Forward Voltage
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0.1
0.2
0.5
1.0
2.0
5.0
10
20
50
100
200
t, TIME (ms)
Figure 4. Thermal Response
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4
500
1000
2000
5000
10000
MCR22−6, MCR22−8
TYPICAL CHARACTERISTICS
100
I GT GATE TRIGGER CURRENT ( μA)
VAK = 7.0 V
RL = 100
0.7
0.6
0.5
0.4
0.3
−75
−50
−25
0
25
50
100 110
75
50
30
20
10
5.0
3.0
2.0
1.0
−40
−20
0
20
60
80
100 110
TJ JUNCTION TEMPERATURE (°C)
Figure 5. Typical Gate Trigger Voltage
Figure 6. Typical Gate Trigger Current
2.0
10
1.8
I H , HOLDING CURRENT (mA)
40
TJ, JUNCTION TEMPERATURE (°C)
P(AV) MAXIMUM AVERAGE POWER DISSIPATION (WATTS)
VGT, GATE TRIGGER VOLTAGE (VOLTS)
0.8
1.6
VAK = 12 V
RL = 100 Ω
30°
1.4
5.0
60°
90°
120
°
180°
1.2
1.0
dc
0.8
0.6
2.0
0.4
0.2
1.0
−40
−20
0
20
40
60
80
100 110
0
0
0.2
0.4
0.6
0.8
1.0
1.2
TJ, JUNCTION TEMPERATURE (°C)
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
Figure 7. Typical Holding Current
Figure 8. Power Dissipation
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5
1.4
1.6
MCR22−6, MCR22−8
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H2A
H2B
H2B
H
W2
H4 H5
T1
L1
H1
W1 W
L
F1
T2
F2
P2
D
P2
P1
T
P
Figure 9. Device Positioning on Tape
Specification
Inches
Symbol
Item
Millimeter
Min
Max
Min
Max
0.1496
0.1653
3.8
4.2
D
Tape Feedhole Diameter
D2
Component Lead Thickness Dimension
0.015
0.020
0.38
0.51
Component Lead Pitch
0.0945
0.110
2.4
2.8
F1, F2
H
Bottom of Component to Seating Plane
H1
Feedhole Location
.059
.156
1.5
4.0
0.3346
0.3741
8.5
9.5
H2A
Deflection Left or Right
0
0.039
0
1.0
H2B
Deflection Front or Rear
0
0.051
0
1.0
H4
Feedhole to Bottom of Component
0.7086
0.768
18
19.5
H5
Feedhole to Seating Plane
0.610
0.649
15.5
16.5
L
Defective Unit Clipped Dimension
0.3346
0.433
8.5
11
L1
Lead Wire Enclosure
0.09842
—
2.5
—
P
Feedhole Pitch
0.4921
0.5079
12.5
12.9
P1
Feedhole Center to Center Lead
0.2342
0.2658
5.95
6.75
P2
First Lead Spacing Dimension
0.1397
0.1556
3.55
3.95
0.06
0.08
0.15
0.20
—
0.0567
—
1.44
T
Adhesive Tape Thickness
T1
Overall Taped Package Thickness
T2
Carrier Strip Thickness
0.014
0.027
0.35
0.65
W
Carrier Strip Width
0.6889
0.7481
17.5
19
W1
Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2
Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
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6
MCR22−6, MCR22−8
ORDERING & SHIPPING INFORMATION: MCR22 Series packaging options, Device Suffix
U.S.
Europe
Equivalent
MCR22−8RL1
MCR22−6,8
MCR22−6RLRA
MCR22−6RLRP
MCR22−8ZL1
Shipping
Description of TO92 Tape Orientation
Radial Tape and Reel (2K/Reel)
Bulk in Box (5K/Box)
Radial Tape and Reel (2K/Reel)
Radial Tape and Fan Fold Box (2K/Box)
Radial Tape and Fan Fold Box (2K/Box)
Flat side of TO92 and adhesive tape visible
N/A, Bulk
Round side of TO92 and adhesive tape visible
Round side of TO92 and adhesive tape visible
Flat side of TO92 and adhesive tape visible
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7
MCR22−6, MCR22−8
PACKAGE DIMENSIONS
TO−92 (TO−226AA)
CASE 029−11
ISSUE AJ
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
B
R
P
L
SEATING
PLANE
K
DIM
A
B
C
D
G
H
J
K
L
N
P
R
V
D
X X
G
J
H
V
C
1
N
SECTION X−X
N
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
−−−
0.250
−−−
0.080
0.105
−−−
0.100
0.115
−−−
0.135
−−−
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
−−−
6.35
−−−
2.04
2.66
−−−
2.54
2.93
−−−
3.43
−−−
STYLE 10:
PIN 1. CATHODE
2. GATE
3. ANODE
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
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ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MCR22−6/D
