MICROFC-60035-SMT-TR

DATA SHEET www.onsemi.com Silicon Photomultipliers (SiPM), Low-Noise, Blue-Sensitive C-Series SiPM Sensors The C−Series low-light sensors from onsemi feature an industry-leading low dark-count rate combined with a high PDE. For ultrafast timing applications, C−Series sensors have a fast output that can have a rise time of 300 ps and a pulse width of 600 ps. The C−Series is available in different sensor sizes (1 mm, 3 mm and 6 mm) and packaged in a 4-side tileable surface mount (SMT) package that is compatible with industry standard, lead-free, reflow soldering processes. The C−Series Silicon Photomultipliers (SiPM) form a range of high gain, single-photon sensitive, UV-to-visible light sensors. They have performance characteristics similar to a conventional PMT, while benefiting from the practical advantages of solid-state technology: low operating voltage, excellent temperature stability, robustness, compactness, output uniformity, and low cost. For advice on the usage of these sensors please refer to the Biasing and Readout Application Note. Figure 1. C−Series Sensors ORDERING INFORMATION See detailed ordering and shipping information on page 14 of this data sheet. Table 1. PERFORMANCE PARAMETERS Sensor Size Parameter (Note 1) Microcell Size 1 mm 10m, 20m, 35m 3 mm 20m, 35m, 50m 6 mm 35m 1 mm 10m, 20m, 35m 3 mm 20m, 35m, 50m 6 mm 35m 1 mm 10m, 20m, 35m 3 mm 20m, 35m, 50m 6 mm 35m 1 mm 10m, 20m, 35m 3 mm 20m, 35m, 50m 6 mm 35m Max. Units 24.2 24.7 V Recommended overvoltage Range (Voltage above Vbr) (Note 2) 1.0 5.0 V Spectral Range (Note 4) 300 950 nm Breakdown Voltage (Vbr) (Note 3) February, 2022 − Rev. 9 Min. Typ. 420 Peak Wavelength (lp) © Semiconductor Components Industries, LLC, 2014 Overvoltage 1 nm Publication Order Number: MICROC−SERIES/D C−Series SiPM Sensors Table 1. PERFORMANCE PARAMETERS (continued) Sensor Size Microcell Size 1 mm 10m 1 mm 3 mm 3 mm Parameter (Note 1) Overvoltage Vbr + 2.5 V PDE (Note 5) at lp Min. Typ. Max. Units 14 % 20m 24 % 35m 31 % 18 % 20m 31 % 35m 41 % 24 % 35m 31 % 50m 35 % 31 % 35m 41 % 50m 47 % Vbr + 5.0 V 10m Vbr + 2.5 V 20m Vbr + 5.0 V 20m 6 mm 35m Vbr + 2.5 V 31 % 6 mm 35m Vbr + 5.0 V 41 % 1 mm 10m Vbr + 2.5 V 2 × 105 Gain (anode to cathode readout) 20m 1 × 106 35m 3 × 106 20m 1 × 106 35m 3 × 106 50m 6 × 106 6 mm 35m 3 × 106 1 mm 10m 3 mm 3 mm 6 mm Dark Current (Note 6) Vbr + 2.5 V 1 3 nA 20m 5 16 nA 35m 15 49 nA 20m 50 142 nA 35m 154 443 nA 50m 319 914 nA 35m 618 1750 nA www.onsemi.com 2 C−Series SiPM Sensors Table 1. PERFORMANCE PARAMETERS (continued) Sensor Size Microcell Size 1 mm 10m Parameter (Note 1) Typ. Max. Units 30 96 kHz 20m 30 96 kHz 35m 30 96 kHz 20m 300 860 kHz 35m 300 860 kHz 50m 300 860 kHz 6 mm 35m 1200 3400 kHz 1 mm 10m, 20m, 35m 3 mm 3 mm Dark Count Rate Overvoltage Vbr + 2.5 V Rise Time − Fast Output (Note 7) Min. 0.3 ns 20m, 35m, 50m 0.6 ns 6 mm 35m 1.0 ns 1 mm 10m, 20m, 35m 0.6 ns 3 mm 20m, 35m, 50m 1.5 ns 6 mm 35m 3.2 ns 1 mm 10m 5 ns 20m 23 ns 35m 82 ns 20m 23 ns 35m 82 ns 50m 159 ns 95 ns 50 pF 90 pF 35m 100 pF 20m 770 pF 35m 850 pF 50m 920 pF 6 mm 35m 3400 pF 1 mm 10m 1 pF 1 pF 1 pF 3 mm 6 mm 1 mm Microcell recharge time constant (Note 8) 35m 10m 20m 3 mm Signal Pulse Width − Fast Output (FWHM) 20m Capacitance (Note 9) (anode−cathode) Vbr + 2.5 V Capacitance (Note 9) (fast terminal to cathode) Vbr + 2.5 V 35m www.onsemi.com 3 C−Series SiPM Sensors Table 1. PERFORMANCE PARAMETERS (continued) Sensor Size Microcell Size 3 mm 20m Parameter (Note 1) Capacitance (Note 9) (fast terminal to cathode) Overvoltage Vbr + 2.5 V Min. Typ. Max. Units 20 pF 12 pF 50m 7 pF 6 mm 35m 48 pF 1 mm 10m, 20m, 35m Temperature dependence of Vbr 21.5 mV/°C 3 mm 20m, 35m, 50m 6 mm 35m 1 mm 10m, 20m, 35m Temperature dependence of Gain (Note 10) −0.8 %/°C 3 mm 20m, 35m, 50m 6 mm 35m 1 mm 10m 0.6 % 20m 3 % 35m 7 % 20m 3 % 35m 7 % 50m 10 % 6 mm 35m 7 % 1 mm 10m 0.2 % 20m 0.2 % 35m 0.2 % 20m 0.2 % 35m 0.2 % 50m 0.6 % 35m 0.2 % 35m 3 mm 3 mm 6 mm Crosstalk Vbr + 2.5 V Afterpulsing Vbr + 2.5 V 1. All measurements made at 2.5 V overvoltage and 21°C unless otherwise stated. 2. Please consult the maximum current levels on page 6 when selecting the overvoltage to apply. 3. The breakdown voltage (Vbr) is defined as the value of the voltage intercept of a straight line fit to a plot of √I vs V, where I is the current and V is the bias voltage. 4. The range where PDE > 1% at Vbr + 5.0 V. 5. Note that the PDE does not contain contributions from afterpulsing or crosstalk. 6. Dark current derived from dark count data as DC × M × q × (1 + CT), where DC is dark count, M is gain, q is the charge of an electron, and CT is cross talk. 7. Measured as time to go from 10% to 90% of the peak amplitude. 8. RC charging time constant of the microcell (t) 9. Internal capacitance of the sensor. Typically add 2−3 pF for sensor in package. Listed by unique microcell size for each part version. 10. Quoted as the percentage change per degree C from the measured value at 21°C. www.onsemi.com 4 C−Series SiPM Sensors GENERAL PARAMETERS Table 2. GENERAL PARAMETERS 1 mm 3 mm 6 mm 10010, 10020, 10035 30020, 30035, 30050 60035 1 × 1 mm2 3 × 3 mm2 6 × 6 mm2 No. of microcells 10010: 2880 10020: 1296 10035: 504 30020: 10998 30035: 4774 30050: 2668 60035: 18980 Microcell fill factor 10010: 28% 10020: 48% 10035: 64% 30020: 48% 30035: 64% 30050: 72% 60035: 64% 1 mm 3 mm 6 mm 10010, 10020, 10035 30020, 30035, 30050 60035 1.5 × 1.8 mm2 4 × 4 mm2 7 × 7 mm2 Active area Table 3. PACKAGE PARAMETERS Package dimensions Recommended operating temperature range −40°C to +85°C Maximum storage temperature Soldering conditions +105°C Lead−free, reflow soldering process compatible (MSL 3 for tape & reel quantities; MSL 4 for tape only qty.) See the SMT Handling Tech Note for more details. Encapsulant type Clear transfer molding compound Encapsulant refractive Index 1.59 @ 420 nm Table 4. MAXIMUM CURRENT LEVELS FOR EACH SENSOR SIZE 1 mm 3 mm 6 mm 10010, 10020, 10035 30020, 30035, 30050 60035 6 mA 15 mA 20 mA www.onsemi.com 5 C−Series SiPM Sensors CIRCUIT SCHEMATICS An SiPM is formed of a large number (hundreds or thousands) of microcells. Each microcell is an avalanche photodiode with its own quench resistor and a capacitively coupled fast output. These microcells are arranged in a close-packed array with all of the like terminals (e.g. all of the anodes) summed together. The array of microcells can thus be considered as a single photodiode sensor with three terminals: anode, cathode and fast output. Circuit schematic of the SensL SiPM microcell, showing details of the Fast Output. SensL SiPM component symbol. Simplified circuit schematic of the SensL® SiPM showing only a 12 microcell example. Typically, SiPM sensors have hundreds or thousands of microcells. Figure 2. Circuit Schematic www.onsemi.com 6 C−Series SiPM Sensors PERFORMANCE Figure 3. PDE versus Wavelength (MicroFC−30035−SMT) Figure 4. Responsivity versus Wavelength (MicroFC−30035−SMT) www.onsemi.com 7 C−Series SiPM Sensors Figure 5. PDE at 420 nm versus Voltage Figure 6. Dark Count Rate versus Overvoltage Figure 7. Gain versus Overvoltage Figure 8. Dark Current versus Voltage and Temperature www.onsemi.com 8 C−Series SiPM Sensors EVALUATION BOARD OPTIONS SMA Biasing Board (MicroFC−SMA−XXXXX) information is shown in the table below. The SMTPA board electrical schematics are shown in Figure 12 and are available to download in AND9809/D. The MicroFC−SMA is a printed circuit board (PCB) that can facilitate the evaluation of the C−Series SMT sensors. The board has three female SMA connectors for connecting the bias voltage, the standard output from the anode and the fast output signal. The output signals can be connected directly to a 50 W-terminated oscilloscope for viewing. The biasing and output signal tracks are laid out in such a way as to preserve the fast timing characteristics of the sensor. The MicroFC−SMA is recommended for users who require a plug-and-play set-up to quickly evaluate C−Series SMT sensors with optimum timing performance. The board also allows the standard output from the anode-cathode readout to be observed at the same time as the fast output. The outputs can be connected directly to the oscilloscope or measurement device, but external preamplification may be required to boost the signal. The table below lists the SMA board connections. The SMA board electrical schematics are available to download in AND9809/D. Figure 10. Pin Adapter Figure 11. MicroFC−SMTPA−XXXXX Figure 9. SMA Biasing Board MicroFC−SMA−XXXXX Output Function Vbias Positive bias input (cathode) Fout Fast output Sout Standard output (anode) Figure 12. SMTPA Board Circuit Schematic Pin Adapter (MicroFC−SMTPA−XXXXX) The SMT Pin Adapter board (SMTPA) is a small PCB board that houses the SMT sensor and has through-hole pins to allow for use with standard sockets or probe clips. This product is useful for those needing a quick way to evaluate the C−Series SMT sensors without the need for specialist surface-mount soldering. While this is a ‘quick fix’ suitable for many evaluations, it should be noted that the timing performance from this board will not be optimized and if the best possible timing performance is required, the MicroFC−SMA−XXXXX is recommended. The pin-out MicroFC−SMTPA−XXXXX www.onsemi.com 9 Pin No. Connection 1 Anode 2 Fast output 3 Cathode 4 Ground 5 No connect C−Series SiPM Sensors PACKAGE DIMENSIONS (All Dimensions in mm) MicroFC−60035−SMT BOTTOM VIEW TOP VIEW Pin Assignments Pin # MicroFC−60035−SMT 1 Anode 2 Fast Output 3 SIDE VIEW 4, 5 Cathode No Connect* *The ‘No Connect’ pin 4 should be soldered to the PCB. This pin can be connected to ground but it can also be left floating without affecting the dark noise. It is recommended that the Pin 5 paddle is NOT soldered to the PCB and is left floating to achieve optimal soldering on pins 1 to 4. Please note the full advice in the CAD file. The complete MicroFC−60035−SMT POD is available to download here. www.onsemi.com 10 C−Series SiPM Sensors PACKAGE DIMENSIONS (All Dimensions in mm) MicroFC−30020−SMT, MicroFC−30035−SMT, MicroFC−30050−SMT BOTTOM VIEW TOP VIEW Pin Assignments Pin # MicroFC−300XX−SMT 1 Anode 2 Fast Output 3 SIDE VIEW 4 Cathode No Connect* *The ‘No Connect’ pin 4 should be soldered to the PCB. It can be connected to ground but it can also be left floating without affecting the dark noise. The complete MicroFC−300xx−SMT POD is available to download here. www.onsemi.com 11 C−Series SiPM Sensors PACKAGE DIMENSIONS (All Dimensions in mm) MicroFC−10010−SMT, MicroFC−10020−SMT & MicroFC−10035−SMT TOP VIEW BOTTOM VIEW Pin Assignments Pin # SIDE VIEW MicroFC−100XX−SMT 1 Anode 2 Fast Output 3 Cathode 4 No Connect* *The ‘No Connect’ pin 4 should be soldered to the PCB. It can be connected to ground but it can also be left floating without affecting the dark noise. The complete MicroFC−100XX−SMT POD is available to download here. www.onsemi.com 12 C−Series SiPM Sensors PACKAGE DIMENSIONS (All Dimensions in mm) MicroFC−SMTPA Board TOP VIEW SIDE VIEW BOTTOM VIEW The electrical schematics for the SMTPA board is available in AND9809/D. MicroFC−SMA Board BOTTOM VIEW SIDE VIEW The electrical schematics for the SMA board is available in AND9809/D. www.onsemi.com 13 TOP VIEW C−Series SiPM Sensors USEFUL LINKS • Introduction to Silicon Photomultipliers Application Note − If you are new to SiPM, this document explains their operation and main performance parameters. • Biasing and Readout Application Note − This document gives detailed information on how to bias the sensor for both • • standard and fast configurations, and amplifying and reading out the signal. How to Evaluate and Compare Silicon Photomultipliers Application Note − Information on what to consider when selecting an SiPM. Handling and Soldering Guide − This document gives information on safe handling of the sensors and soldering to PCB. ORDERING INFORMATION Table 5. ORDERING INFORMATION Product Code (Note 11) Microcell Size (Total Number) Sensor Active Area 10 mm (2880 microcells) 1 mm × 1 mm Package Type Delivery Options (Note 12) 10000 Series MICROFC−10010−SMT 4-side tileable, surface mount package (SMT) TR1, TR MICROFC−SMA−10010−GEVB SMT sensor mounted onto a PCB with SMA connectors for bias and output. PK MICROFC−SMTPA−10010−GEVB SMT sensor mounted onto a pin adapter board. PK MICROFC−10020−SMT 20 mm (1296 microcells) 4-side tileable, surface mount package (SMT) TR1, TR MICROFC−SMA−10020−GEVB SMT sensor mounted onto a PCB with SMA connectors for bias and output. PK MICROFC−SMTPA−10020−GEVB SMT sensor mounted onto a pin adapter board. PK MICROFC−10035−SMT 35 mm (504 microcells) 4-side tileable, surface mount package (SMT) TR1, TR MICROFC−SMA−10035−GEVB SMT sensor mounted onto a PCB with SMA connectors for bias and output. PK MICROFC−SMTPA−10035−GEVB SMT sensor mounted onto a pin adapter board. PK www.onsemi.com 14 C−Series SiPM Sensors Table 5. ORDERING INFORMATION (continued) Product Code (Note 11) Microcell Size (Total Number) Sensor Active Area 20 mm (10998 microcells) 3 mm × 3 mm Package Type Delivery Options (Note 12) 30000 Series MICROFC−30020−SMT 4-side tileable, surface mount package (SMT) TR1, TR MICROFC−SMA−30020−GEVB SMT sensor mounted onto a PCB with SMA connectors for bias and output. PK MICROFC−SMTPA−30020−GEVB SMT sensor mounted onto a pin adapter board PK MICROFC−30035−SMT 4-side tileable, surface mount package (SMT) TR1, TR MICROFC−SMA−30035−GEVB SMT sensor mounted onto a PCB with SMA connectors for bias and output. PK MICROFC−SMTPA−30035−GEVB SMT sensor mounted onto a pin adapter board PK MICROFC−30050−SMT 35 mm (4774 microcells) 50 mm (2668 microcells) 4-side tileable, surface mount package (SMT) TR1, TR MICROFC−SMA−30050−GEVB SMT sensor mounted onto a PCB with SMA connectors for bias and output. PK MICROFC−SMTPA−30050−GEVB SMT sensor mounted onto a pin adapter board PK 60000 Series MICROFC−60035−SMT 35 mm (18980 microcells) 6mm × 6mm 4-side tileable, surface mount package (SMT) TR1, TR MICROFC−SMA−60035−GEVB SMT sensor mounted onto a PCB with SMA connectors for bias and output. PK MICROFC−SMTPA−60035−GEVB SMT sensor mounted onto a pin adapter board PK 11. All Devices are Pb-Free and are RoHS Compliant. 12. The two-letter delivery option code should be appended to the order number, e.g.) to receive MICROFC−60035−SMT on tape and reel, use MICROFC−60035−SMT−TR. The codes are as follows: PK = ESD Package TR1 = Tape TR = Tape and Reel There is a minimum order quantity (MOQ) of 3000 for the tape and reel (TR) option. The TR option is only available in multiples of the MOQ. SensL is a registered trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. www.onsemi.com 15 onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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