MICROFJ-60035-TSV-TR1

DATA SHEET www.onsemi.com Silicon Photomultipliers (SiPM), High PDE and Timing Resolution Sensors in a TSV Package J-Series SiPM Sensors onsemi’s J-Series low-light sensors feature a high PDE (photon detection efficiency) that is achieved using a high-volume, P-on-N silicon foundry process. The J-Series sensors incorporate major improvements in the transit time spread which results in a significant improvement in the timing performance of the sensor. J-Series sensors are available in different sizes (3 mm, 4 mm and 6 mm) and use a TSV (Through Silicon Via) process to create a package with minimal deadspace, that is compatible with industry standard lead-free, reflow soldering processes. The J-Series Silicon Photomultipliers (SiPM) combine high performance with the practical advantages of solid-state technology: low operating voltage, excellent temperature stability, robustness, compactness, output uniformity, and low cost. For more information on the J-Series sensors please refer to the website. ORDERING INFORMATION See detailed ordering and shipping information on page 11 of this data sheet. Table 1. GENERAL PARAMETERS Parameter (Note 1) Maximum Unit 24.2 24.7 V 1 6 V Operating Voltage (Vop = Vbr + OV)) 25.2 30.7 V Spectral Range (Note 3) 200 900 nm Breakdown Voltage (Vbr) (Note 2) Overvoltage (OV) Minimum Typical Peak PDE Wavelength (lp) 420 nm Temperature dependence of Vbr 21.5 mV/°C 1. All measurements made at 21°C unless otherwise stated. 2. The breakdown voltage (Vbr) is defined as the value of the voltage intercept of a straight line fit to a plot of √I vs V, where I is the current and V is the bias voltage. 3. The range where PDE > 2.0% at Vbr + 6.0 V. Table 2. PHYSICAL PARAMETERS 3 mm Parameter Active Area No. of Microcells Microcell Fill Factor © Semiconductor Components Industries, LLC, 2017 August, 2021 − Rev. 7 4 mm 30020, 30035 3.07 × 3.07 mm2 6 mm 40035 3.93 × 3.93 60035 mm2 6.07 × 6.07 mm2 30020: 14,410 30035: 5,676 40035: 9,260 60035: 22,292 30020: 62% 30035: 75% 40035: 75% 60035: 75% 1 Publication Order Number: MICROJ−SERIES/D J−Series SiPM Sensors Table 3. PERFORMANCE PARAMETERS 30035 40035 60035 Unit Overvoltage +2.5 V Parameter (Note 4) +6 V +2.5 V +6 V +2.5 V +6 V Unit PDE (Note 5) 38 50 38 50 38 50 % Dark Count Rate 50 150 50 150 50 150 kHz/mm2 Gain (anode-cathode) 2.9 × 106 6.3 × 106 2.9 × 106 6.3 × 106 2.9 × 106 6.3 × 106 Dark Current − typical 0.23 1.9 0.35 3.0 0.9 7.5 Dark Current − maximum 0.31 3.00 0.45 4.0 1.25 12.0 110 90 110 180 Rise Time (Note 6) − anode-cathode output 90 Microcell Recharge Time Constant (Note 7) Capacitance (Note 8) (anode output) Capacitance (Note 8) (fast output) Fast Output Pulse Width (FWHM) Afterpulsing 250 ps 45 48 50 ns 1070 1800 4140 pF 40 70 160 pF 1.5 Crosstalk mA 1.7 3.0 ns 8 25 8 25 8 25 % 0.75 5.0 0.75 5.0 0.75 5.0 % 30020 Overvoltage +2.5 V Parameter (Note 4) +5 V Unit PDE (Note 5) 30 38 % Dark Count Rate 50 125 kHz/mm2 Gain (anode-cathode) 1.0 × 106 1.9 × 106 Dark Current − typical 0.1 0.45 Dark Current − maximum 0.2 0.72 Rise Time (Note 6) − anode-cathode output 130 160 Microcell Recharge Time Constant (Note 7) mA ps 15 ns 1040 pF Capacitance (Note 8) (fast output) 50 pF Fast Output Pulse Width (FWHM) 1.4 ns Capacitance (Note 8) (anode output) Crosstalk 2.5 7.5 % Afterpulsing 0.75 5.0 % 4. 5. 6. 7. 8. All measurements made at 21°C unless otherwise stated. PDE does not contain afterpulsing or crosstalk, and is quoted at the peak wavelength (lp). Measured as time to go from 10% to 90% of the peak amplitude and measured over a 1 W series output resistor. RC charging time constant of the microcell (τ). Capacitance values are for the complete TSV package. Table 4. TVS PACKAGE SPECIFICS 3 mm 4 mm 30020, 30035 Package Dimensions 3.16 × 3.16 mm2 6 mm 40035 4.00 × 4.00 60035 mm2 Recommended Operating Temperature Range −40°C − +85°C Soldering Conditions Reflow Solder Cover Material Glass Cover Refractive Index Moisture Sensitivity Level Maximum Average Current 6.13 × 6.13 mm2 1.53 @ 436 nm Tape & reel MSL3* Cut tape MSL4* 10 mA 10 mA *Please refer to the TSV Handling and Soldering guide for more information on MSL for different delivery options. www.onsemi.com 2 15 mA J−Series SiPM Sensors PERFORMANCE PLOTS Figure 1. Photon Detection Efficiency (PDE) (MicroFJ−60035−TSV) Figure 2. PDE vs. Overvoltage Figure 3. PDE vs. Crosstalk (MicroFJ−60035−TSV) (MicroFJ−60035−TSV) www.onsemi.com 3 J−Series SiPM Sensors Figure 4. Gain vs. Overvoltage (MicroFJ−30035−TSV) Figure 5. Fast Output Pulse Shape Figure 6. Standard Output Pulse Shape (MicroFJ−30035, MicroFJ−40035, MicroFJ−60035 Vbr + 2.5 V, 10 W Sense Resistor) (MicroFJ−30035, MicroFJ−40035, MicroFJ−60035 Vbr + 2.5 V, 10 W Sense Resistor) www.onsemi.com 4 J−Series SiPM Sensors EVALUATION BOARD OPTIONS SMA BIASING BOARD (MicroFJ−SMA−XXXXX) circuit schematic is shown in Figure 8. Please consult the Readout and Biasing Application Note for further information on biasing. The SMTPA board electrical schematics are available to download in the AND9808/D. The MicroFJ−SMA is a printed circuit board (PCB) that can facilitate the evaluation of the J-Series sensors. The board has three female SMA connectors for connecting the bias voltage, the standard output from the anode and the fast output signal. The output signals can be connected directly to a 50 W-terminated oscilloscope for viewing. The biasing and output signal tracks are laid out in such a way as to preserve the fast timing characteristics of the sensor. The MicroFJ−SMA is recommended for users who require a plug-and-play set-up to quickly evaluate J-Series TSV sensors with optimum timing performance. The board also allows the standard output from the anode to be observed at the same time as the fast output. The outputs can be connected directly to the oscilloscope or measurement device, but external preamplification may be required to boost the signal. The table below lists the SMA board connections. The SMA board electrical schematics are available to download in the AND9808/D document. Figure 7. Top View of the SMTPA Board Showing the Pin Numbering MicroFJ−SMA−XXXXX Output Function Vbias Positive bias input (cathode) Fout Fast output Sout Standard output (anode) Figure 8. SMTPA Circuit Schematic PIN ADAPTER (MicroFJ−SMTPA−XXXXX) The TSV Pin Adapter board (SMTPA) is a small PCB board that houses the TSV sensor and has through-hole pins to allow its use with standard sockets or probe clips. This product is useful for those needing a quick way to evaluate the TSV package without the need for specialist surface-mount soldering. While this is a ‘quick fix’ suitable for many evaluations, it should be noted that the timing performance from this board will not be optimized and if the best possible timing performance is required, the MicroFJ−SMA−XXXXX is recommended. The SMTPA MicroFJ−SMTPA−XXXXX Pin No. Connection 1 Anode 2 Fast output 3 Cathode 4 Ground 5 No connect www.onsemi.com 5 J−Series SiPM Sensors CIRCUIT SCHEMATICS An SiPM is formed of a large number (hundreds or thousands) of microcells. Each microcell (Figure 9) is an avalanche photodiode with its own quench resistor and a capacitively coupled fast output. These microcells are arranged in a close-packed array with all of the like terminals (e.g. all of the anodes) summed together (Figure 10). The array of microcells can thus be considered as a single photodiode sensor with three terminals: anode, cathode and fast output, as shown in Figure 11. Figure 9. Circuit Schematic of the onsemi SiPM Microcell, showing Details of the Fast Output Figure 11. onsemi SiPM Component Symbol Figure 10. Simplified Circuit Schematic of the onsemi SiPM showing only a 12 Microcell Example. Typically, SiPM Sensors have Hundreds or Thousands of Microcells TILING OF THE TSV PACKAGE For the J-Series, onsemi has developed a market-leading, high-performance package using a TSV process. It is a chip-scale package that is compatible with lead-free, reflow soldering processes. The glass cover is ideal for coupling to scintillators or fibre optic elements. The dead-space between the sensor active area and the edge of the package has been minimized, resulting in a package that can be tiled on 4 sides with high fill-factor. This allows multiple sensors to be configured into unique layouts for a wide range of custom applications. The distance between sensor packages can be as little as 200 mm when tiled, but actual alignment and placement tolerances will depend on the accuracy of the user’s assembly process. An Application Note is available that gives advice on creating arrays of the TSV sensors. www.onsemi.com 6 J−Series SiPM Sensors PACKAGE DIMENSIONS (All Dimensions in mm) MicroFJ−300XX−TSV TOP VIEW BOTTOM VIEW Pin Assignments Pin Number SIDE VIEW MicroFJ−300XX−TSV B1 Anode B3 Fast output A1, C3 Cathode All others No Connect* *The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation. The MicroFJ−300XX−TSV−A2 CAD, and solder footprint, is available to download here. www.onsemi.com 7 J−Series SiPM Sensors PACKAGE DIMENSIONS (All Dimensions in mm) MicroFJ−40035−TSV TOP VIEW BOTTOM VIEW Pin Assignments Pin Number MicroFJ−40035−TSV B1, C1 Anode B4, C4 Fast output A1, D4 Cathode All others No Connect* SIDE VIEW *The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation. The MicroFJ−40035−TSV CAD, and solder footprint, is available to download here. www.onsemi.com 8 J−Series SiPM Sensors PACKAGE DIMENSIONS (All Dimensions in mm) MicroFJ−60035−TSV TOP VIEW BOTTOM VIEW Pin Assignments Pin Number MicroFJ−60035−TSV C1, D1 Anode A1, F6 Cathode C6, D6 Fast output All others No Connect* SIDE VIEW *The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation. The MicroFJ−60035−TSV CAD, and solder footprint, is available to download here. www.onsemi.com 9 J−Series SiPM Sensors MicroFJ−SMA−60035 Board TOP VIEW BOTTOM VIEW SIDE VIEW The complete CAD for the SMA boards can be downloaded from the website: 3 mm, 4 mm and 6 mm versions. MicroFJ−SMTPA−60035 Board TOP VIEW SIDE VIEW BOTTOM VIEW The complete CAD for the SMTPA boards can be downloaded from the website: 3 mm and 6 mm versions. www.onsemi.com 10 J−Series SiPM Sensors ORDERING INFORMATION Table 5. ORDERING INFORMATION Product Code Microcell Size (No. of Microcells) Sensor Active Area Description Delivery Option (Note 9) 3 mm Sensors MICROFJ−30020−TSV 20 mm (14,410) 3.07 × 3.07 mm 4-side tileable, chip scale package with through-silicon vias (TSV) TR1, TR MICROFJ−SMA−30020−GEVB TSV sensor mounted onto a PCB with three SMA connectors for bias, standard output and fast output PK MICROFJ−SMTPA−30020−GEVB TSV sensor mounted onto a pin adapter board PK 4-side tileable, chip scale package with through-silicon vias (TSV) TR1, TR MICROFJ−30035−TSV 35 mm (5,676) MICROFJ−SMA−30035−GEVB TSV sensor mounted onto a PCB with three SMA connectors for bias, standard output and fast output PK MICROFJ−SMTPA−30035−GEVB TSV sensor mounted onto a pin adapter board PK 4-side tileable, chip scale package with through-silicon vias (TSV) TR1, TR 4 mm Sensors MICROFJ−40035−TSV 35 mm (9,260) 3.93 × 3.93 mm MICROFJ−SMA−40035−GEVB TSV sensor mounted onto a PCB with three SMA connectors for bias, standard output and fast output. PK 6 mm Sensors MICROFJ−60035−TSV 35 mm (22,292) 6.07 × 6.07 mm 4-side tileable, chip scale package with through-silicon vias (TSV) TR1, TR MICROFJ−SMA−60035−GEVB TSV sensor mounted onto a PCB with three SMA connectors for bias, standard output and fast output PK MICROFJ−SMTPA−60035−GEVB TSV sensor mounted onto a pin adapter board PK 9. The two-letter delivery option code should be appended to the order number, e.g.) to receive a MICROFJ−60035−TSV on tape and reel, use MICROFJ−60035−TSV−TR. The codes are as follows: PK = ESD Package TR1 = Tape TR = Tape and Reel There is a minimum order quantity (MOQ) of 3000 for the tape and reel (TR) option. Quantities less than this are available on tape (−TR1). The TR option is only available in multiples of the MOQ. 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