MJE18004D2G
High Speed, High Gain
Bipolar NPN Power
Transistor
with Integrated Collector−Emitter Diode
and Built−in Efficient Antisaturation
Network
http://onsemi.com
POWER TRANSISTORS
5 AMPERES,
1000 VOLTS, 75 WATTS
The MJE18004D2 is state−of−art High Speed High gain BIPolar
transistor (H2BIP). High dynamic characteristics and lot to lot
minimum spread (±150 ns on storage time) make it ideally suitable for
light ballast applications. Therefore, there is no need to guarantee an
hFE window.
It’s characteristics make it also suitable for PFC application.
Features
• Low Base Drive Requirement
• High Peak DC Current Gain (55 Typical) @ IC = 100 mA
• Extremely Low Storage Time Min/Max Guarantees Due to the
•
•
•
•
H2BIP Structure which Minimizes the Spread
Integrated Collector−Emitter Free Wheeling Diode
Fully Characterized and Guaranteed Dynamic VCE(sat)
“6 Sigma” Process Providing Tight and Reproductible Parameter
Spreads
These Devices are Pb−Free and are RoHS Compliant*
MARKING
DIAGRAM
4
TO−220AB
CASE 221A
STYLE 1
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Symbol
Value
Unit
Collector−Emitter Sustaining Voltage
Rating
VCEO
450
Vdc
Collector−Base Breakdown Voltage
VCBO
1000
Vdc
Collector−Emitter Breakdown Voltage
VCES
1000
Vdc
Emitter−Base Voltage
VEBO
12
Vdc
Collector Current − Continuous
Collector Current − Peak (Note 1)
IC
ICM
5
10
Adc
Base Current − Continuous
Base Current − Peak (Note 1)
IB
IBM
2
4
Adc
Total Device Dissipation @ TC = 25_C
Derate above 25°C
PD
75
0.6
W
W/°C
TJ, Tstg
– 65 to 150
°C
Operating and Storage Temperature
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Case
RqJC
1.65
_C/W
Thermal Resistance, Junction−to−Ambient
RqJA
62.5
_C/W
Maximum Lead Temperature for Soldering
Purposes: 1/8″ from Case for 5 Seconds
TL
260
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤ 10%.
© Semiconductor Components Industries, LLC, 2010
April, 2010 − Rev. 6
1
1
2
18004D2G
AYWW
3
18004D2
G
A
Y
WW
= Device Code
= Pb−Free Package
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping†
MJE18004D2G
TO−220AB
(Pb−Free)
50 Units / Rail
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Publication Order Number:
MJE18004D2/D
MJE18004D2G
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ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
VCEO(sus)
450
547
−
Vdc
Collector−Base Breakdown Voltage (ICBO = 1 mA)
VCBO
1000
1100
−
Vdc
Emitter−Base Breakdown Voltage (IEBO = 1 mA)
VEBO
12
14
−
Vdc
Collector Cutoff Current (VCE = Rated VCEO, IB = 0)
ICEO
−
−
100
mAdc
ICES
−
−
100
500
100
mAdc
IEBO
−
−
100
mAdc
VBE(sat)
−
0.8
0.7
1
0.9
Vdc
−
0.9
0.8
1
0.9
−
0.38
0.55
0.5
0.75
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (IC = 100 mA, L = 25 mH)
Collector Cutoff Current (VCE = Rated VCES, VEB = 0)
@ TC = 25°C
@ TC = 125°C
@ TC = 125°C
Collector Cutoff Current (VCE = 500 V, VEB = 0)
Emitter−Cutoff Current (VEB = 10 Vdc, IC = 0)
ON CHARACTERISTICS
Base−Emitter Saturation Voltage (IC = 0.8 Adc, IB = 80 mAdc)
(IC = 2 Adc, IB = 0.4 Adc)
@ TC = 25°C
@ TC = 125°C
@ TC = 25°C
@ TC = 125°C
VCE(sat)
Collector−Emitter Saturation Voltage (IC = 0.8 Adc, IB = 80 mAdc)
@ TC = 25°C
@ TC = 125°C
(IC = 2 Adc, IB = 0.4 Adc)
@ TC = 25°C
@ TC = 125°C
−
0.45
0.75
0.75
1
(IC = 0.8 Adc, IB = 40 mAdc)
@ TC = 25°C
@ TC = 125°C
−
0.9
1.6
1.5
(IC = 1 Adc, IB = 0.2 Adc)
@ TC = 25°C
@ TC = 125°C
−
0.25
0.28
0.5
0.6
DC Current Gain (IC = 0.8 Adc, VCE = 1 Vdc)
@ TC = 25°C
@ TC = 125°C
15
10
28
14
−
(IC = 2 Adc, VCE = 1 Vdc)
@ TC = 25°C
@ TC = 125°C
6
4
8
6
−
(IC = 1 Adc, VCE = 2.5 Vdc)
@ TC = 25°C
@ TC = 125°C
18
14
28
20
−
−
9
16
−
hFE
Vdc
−
DYNAMIC SATURATION VOLTAGE
Dynamic Saturation Voltage:
Determined 1 ms and 3 ms
respectively after rising IB1
reaches 90% of final IB1
IC = 1 Adc
IB1 = 100 mA
VCC = 300 V
IC = 2 Adc
IB1 = 0.4 A
VCC = 300 V
VCE(dsat)
@ 1 ms
@ TC = 25°C
@ TC = 125°C
@ 3 ms
@ TC = 25°C
@ TC = 125°C
−
3.1
9
−
@ 1 ms
@ TC = 25°C
@ TC = 125°C
−
11
18
−
@ 3 ms
@ TC = 25°C
@ TC = 125°C
−
1.4
8
−
http://onsemi.com
2
V
MJE18004D2G
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ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
VEC
−
0.96
0.72
1.5
V
−
1.15
0.8
1.7
DIODE CHARACTERISTICS
Forward Diode Voltage (IEC = 1 Adc)
@ TC = 25°C
@ TC = 125°C
(IEC = 2 Adc)
@ TC = 25°C
@ TC = 125°C
@ TC = 25°C
tfr
ns
−
440
−
(IF = 1 Adc, di/dt = 10 A/ms)
@ TC = 25°C
−
335
−
(IF = 2 Adc, di/dt = 10 A/ms)
@ TC = 25°C
−
335
−
fT
−
13
−
MHz
Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1 MHz)
Cob
−
60
100
pF
Input Capacitance (IC = 0.5 Adc, VCE = 10 Vdc, f = 1 MHz)
Cib
−
450
750
pF
@ TC = 25°C
ton
−
500
750
ns
@ TC = 25°C
toff
1.1
−
1.4
ms
@ TC = 25°C
@ TC = 125°C
ton
−
100
150
150
ns
@ TC = 25°C
@ TC = 125°C
toff
−
1.15
1.6
1.3
ms
@ TC = 25°C
@ TC = 125°C
ton
−
120
500
150
ns
@ TC = 25°C
@ TC = 125°C
toff
1.85
−
2.6
2.15
ms
@ TC = 25°C
@ TC = 125°C
tf
−
130
300
175
ns
@ TC = 25°C
@ TC = 125°C
ts
−
2.12
2.6
2.4
ms
@ TC = 25°C
@ TC = 125°C
tc
−
355
750
500
ns
@ TC = 25°C
@ TC = 125°C
tf
−
95
230
150
ns
@ TC = 25°C
@ TC = 125°C
ts
2.1
2.4
ms
@ TC = 25°C
@ TC = 125°C
tc
−
300
700
450
ns
@ TC = 25°C
@ TC = 125°C
tf
−
70
100
90
ns
@ TC = 25°C
@ TC = 125°C
ts
−
0.7
1.05
0.9
ms
@ TC = 25°C
@ TC = 125°C
tc
−
75
160
120
ns
Forward Recovery Time (IF = 0.4 Adc, di/dt = 10 A/ms)
DYNAMIC CHARACTERISTICS
Current Gain Bandwidth (IC = 0.5 Adc, VCE = 10 Vdc, f = 1 MHz)
SWITCHING CHARACTERISTICS: Resistive Load (D.C. ≤ 10%, Pulse Width = 40 ms)
Turn−on Time
Turn−off Time
Turn−on Time
Turn−off Time
Turn−on Time
Turn−off Time
IC = 2.5 Adc, IB1 = 0.5 Adc
IB2 = 1 Adc
VCC = 250 Vdc
IC = 2 Adc, IB1 = 0.4 Adc
IB2 = 1 Adc
VCC = 300 Vdc
IC = 2.5 Adc, IB1 = 0.5 Adc
IB2 = 0.5 Adc
VCC = 300 Vdc
SWITCHING CHARACTERISTICS: Inductive Load (VCC = 15 V)
Fall Time
Storage Time
Crossover Time
IC = 2.5 Adc
IB1 = 500 mAdc
IB2 = 500 mAdc
VZ = 350 V
LC = 300 mH
Fall Time
Storage Time
Crossover Time
IC = 2 Adc
IB1 = 400 mAdc
IB2 = 400 mAdc
VZ = 300 V
LC = 200 mH
Fall Time
Storage Time
Crossover Time
IC = 1 Adc
IB1 = 100 mAdc
IB2 = 500 mAdc
VZ = 300 V
LC = 200 mH
http://onsemi.com
3
2.9
MJE18004D2G
TYPICAL STATIC CHARACTERISTICS
100
100
TJ = 125°C
TJ = -20°C
hFE, DC CURRENT GAIN
hFE, DC CURRENT GAIN
VCE = 1 V
TJ = 25°C
10
TJ = 125°C
1
TJ = -20°C
TJ = 25°C
10
1
0.001
0.01
0.1
1
IC, COLLECTOR CURRENT (AMPS)
10
0.001
Figure 1. DC Current Gain @ 1 Volt
0.01
0.1
1
IC, COLLECTOR CURRENT (AMPS)
10
Figure 2. DC Current Gain @ 5 Volt
3
10
TJ = 25°C
5A
2
4A
3A
2A
1
TJ = 125°C
IC/IB = 5
VCE , VOLTAGE (VOLTS)
VCE , VOLTAGE (VOLTS)
VCE = 5 V
1A
TJ = 25°C
1
TJ = -20°C
0
IC = 500 mA
0.1
0.01
0.1
1
IB, BASE CURRENT (mA)
10
0.001
Figure 3. Collector Saturation Region
10
Figure 4. Collector−Emitter Saturation
Voltage
10
10
IC/IB = 20
VCE , VOLTAGE (VOLTS)
TJ = 125°C
IC/IB = 10
VCE , VOLTAGE (VOLTS)
0.01
0.1
1
IC, COLLECTOR CURRENT (AMPS)
1
TJ = 25°C
TJ = -20°C
0.1
0.001
TJ = 125°C
TJ = -20°C
1
TJ = 25°C
0.1
0.01
0.1
1
IC, COLLECTOR CURRENT (AMPS)
10
0.001
Figure 5. Collector−Emitter Saturation
Voltage
0.01
0.1
1
IC, COLLECTOR CURRENT (AMPS)
Figure 6. Collector−Emitter Saturation
Voltage
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4
10
MJE18004D2G
TYPICAL STATIC CHARACTERISTICS
10
10
IC/IB = 10
1
VBE , VOLTAGE (VOLTS)
VBE , VOLTAGE (VOLTS)
IC/IB = 5
TJ = -20°C
TJ = 125°C
TJ = 25°C
0.1
1
TJ = -20°C
TJ = 125°C
0.1
0.001
1
0.01
0.1
IC, COLLECTOR CURRENT (AMPS)
10
0.001
Figure 7. Base−Emitter Saturation Region
10
10
1
FORWARD DIODE VOLTAGE (VOLTS)
IC/IB = 20
VBE , VOLTAGE (VOLTS)
1
0.01
0.1
IC, COLLECTOR CURRENT (AMPS)
Figure 8. Base−Emitter Saturation Region
10
TJ = -20°C
TJ = 125°C
TJ = 25°C
0.1
25°C
1
125°C
0.1
0.001
1
0.01
0.1
IC, COLLECTOR CURRENT (AMPS)
10
0.01
Figure 9. Base−Emitter Saturation Region
COLLECTOR EMITTER VOLTAGE (VOLTS)
Cib (pF)
TJ = 25°C
f(test) = 1 MHz
100
Cob
10
VR, REVERSE VOLTAGE (VOLTS)
10
1200
TC = 25°C
BVCER @ ICER = 10 mA
1000
800
BVCER(sus) @
ICER = 200
mA,
Lc = 25 mH
600
10
1
0.1
1
REVERSE EMITTER-COLLECTOR CURRENT (AMPS)
Figure 10. Forward Diode Voltage
1000
C, CAPACITANCE (pF)
TJ = 25°C
100
10
Figure 11. Capacitance
100
BASE-EMITTER RESISTOR (W)
Figure 12. BVCER = f(RBE)
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5
1000
MJE18004D2G
TYPICAL SWITCHING CHARACTERISTICS
3200
5
TJ = 125°C
TJ = 25°C
2400
IBon = IBoff
VCC = 300 V
PW = 20 ms
4
t, TIME (ns)
t, TIME (s)
μ
IC/IB = 10
1600
800
3
2
1
TJ = 125°C
TJ = 25°C
IC/IB = 5
0
IC/IB = 5
0
3
2
IC, COLLECTOR CURRENT (AMPS)
1
4
2
3
IC, COLLECTOR CURRENT (AMPS)
1
Figure 13. Resistive Switch Time, ton
4
IC/IB = 5
IC/IB = 10
3
t, TIME (s)
μ
3
t, TIME (s)
μ
4
Figure 14. Resistive Switch Time, toff
4
2
IBon = IBoff
VCC = 15 V
VZ = 300 V
LC = 200 mH
1
TJ = 125°C
TJ = 25°C
2
IBon = IBoff
VCC = 15 V
VZ = 300 V
LC = 200 mH
1
TJ = 125°C
TJ = 25°C
0
0
0
2
3
1
IC, COLLECTOR CURRENT (AMPS)
4
0
Figure 15. Inductive Storage Time,
tsi @ IC/IB = 5
2
3
1
IC, COLLECTOR CURRENT (AMPS)
4
Figure 16. Inductive Storage Time,
tsi @ IC/IB = 10
1000
1000
TJ = 125°C
TJ = 25°C
TJ = 125°C
TJ = 25°C
IC/IB = 5
800
IC/IB = 10
800
IBon = IBoff
VCC = 15 V
VZ = 300 V
LC = 200 mH
600
tc
t, TIME (ns)
t, TIME (ns)
IBon = IBoff
VCC = 300 V
PW = 20 ms
IC/IB = 10
400
tfi
200
IBoff = IBon
VCC = 15 V
VZ = 300 V
LC = 200 mH
600
400
200
0
0
0
1
2
3
IC, COLLECTOR CURRENT (AMPS)
4
0
Figure 17. Inductive Switching Time,
tc and tfi @ IC/IB = 5
1
2
3
IC, COLLECTOR CURRENT (AMPS)
Figure 18. Inductive Switching Time,
tfi @ IC/IB = 10
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4
MJE18004D2G
TYPICAL SWITCHING CHARACTERISTICS
1600
5
t si , STORAGE TIME (μs)
1200
t, TIME (ns)
IC/IB = 10
IBoff = IBon
VCC = 15 V
VZ = 300 V
LC = 200 mH
800
400
IBon = IBoff
VCC = 15 V
VZ = 300 V
LC = 200 mH
4
TJ = 125°C
TJ = 25°C
IC = 1 A
IC = 2 A
3
TJ = 125°C
TJ = 25°C
0
0
2
1
3
IC, COLLECTOR CURRENT (AMPS)
2
4
Figure 19. Inductive Switching, tc @ IC/IB = 10
15
20
2000
IBon = IBoff
VCC = 15 V
VZ = 300 V
LC = 200 mH
IC = 2 A
t c , CROSSOVER TIME (ns)
TJ = 125°C
TJ = 25°C
IBoff = IBon
VCC = 15 V
VZ = 300 V
LC = 200 mH
800
t fi , FALL TIME (ns)
10
hFE, FORCED GAIN
Figure 20. Inductive Storage Time
1000
600
IC = 1 A
400
200
0
1500
TJ = 125°C
TJ = 25°C
IC = 2 A
1000
500
IC = 1 A
0
2
4
6
8
10
12
14
hFE, FORCED GAIN
16
18
20
2
Figure 21. Inductive Fall Time
8
14
hFE, FORCED GAIN
20
Figure 22. Inductive Crossover Time
4
420
3
IBon = IBoff
VCC = 15 V
VZ = 300 V
LC = 200 mH
t fr , FORWARD RECOVERY TIME (ns)
IB = 50 mA
t, TIME (s)
μ
5
0
2
IB = 100 mA
IB = 200 mA
IB = 500 mA I = 1 A
B
1
0.5
1
1.5
2
2.5
3
IC, COLLECTOR CURRENT (AMPS)
3.5
dI/dt = 10 A/ms
TC = 25°C
380
340
300
4
0
Figure 23. Inductive Storage Time, tsi
0.5
1
1.5
IF, FORWARD CURRENT (AMP)
Figure 24. Forward Recovery Time, TFR
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7
2
MJE18004D2G
TYPICAL SWITCHING CHARACTERISTICS
10
VCE
9
dyn 1 ms
IC
90% IC
tfi
8
dyn 3 ms
tsi
7
VOLTS
6
0V
Vclamp
5
10% IC
10% Vclamp
tc
4
90% IB
3
1 ms
2
IB
IB
90% IB1
1
2
1
3 ms
0
0
3
4
TIME
TIME
Figure 25. Dynamic Saturation Voltage Measurements
5
6
7
8
Figure 26. Inductive Switching Measurements
VFRM
VFR (1.1 VF unless otherwise specified)
VF
VF
tfr
0.1 VF
0
IF
10% IF
0
2
4
6
8
10
Figure 27. tfr Measurements
+15 V
1 mF
150
W
3W
IC PEAK
100 mF
MTP8P10
100
W
3W
VCE PEAK
MTP8P10
VCE
RB1
MPF930
MUR105
Iout
MPF930
+10 V
IB1
IB
A
50 W
MJE210
COMMON
500 mF
150
W
3W
IB2
RB2
MTP12N10
1 mF
V(BR)CEO(sus)
L = 10 mH
RB2 = ∞
VCC = 20 V
IC(pk) = 100 mA
-Voff
Table 1. Inductive Load Switching Drive Circuit
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8
Inductive Switching
L = 200 mH
RB2 = 0
VCC = 15 V
RB1 selected for
desired Ib1
RBSOA
L = 500 mH
RB2 = 0
VCC = 15 V
RB1 selected
for desired Ib1
MJE18004D2G
TYPICAL CHARACTERISTICS
6
IC, COLLECTOR CURRENT (AMPS)
IC, COLLECTOR CURRENT (AMPS)
100
1 ms
10
1 ms
5 ms
10 ms
EXTENDED
SOA
DC
1
0.1
0.01
TC ≤ 125°C
GAIN ≥ 5
LC = 2 mH
5
4
3
2
-5 V
1
0V
0
10
100
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
1000
200
Figure 28. Forward Bias Safe Operating Area
1.0
SECOND
BREAKDOWN
DERATING
0.8
0.6
0.4
THERMAL
DERATING
0.2
0
20
40
60
80
100
120
TC, CASE TEMPERATURE (°C)
140
160
Figure 30. Forward Bias Power Derating
400
600
800
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
1000
Figure 29. Reverse Bias Safe Operating Area
There are two limitations on the power handling ability of a
transistor: average junction temperature and second breakdown.
Safe operating area curves indicate IC−VCE limits of the transistor
that must be observed for reliable operation; i.e., the transistor
must not be subjected to greater dissipation than the curves
indicate. The data of Figure 28 is based on TC = 25°C; TJ(pk) is
variable depending on power level. Second breakdown pulse
limits are valid for duty cycles to 10% but must be derated when
TC > 25°C. Second breakdown limitations do not derate the same
as thermal limitations. Allowable current at the voltages shown on
Figure 28 may be found at any case temperature by using the
appropriate curve on Figure 30.
TJ(pk) may be calculated from the data in Figure 31. At any
case temperatures, thermal limitations will reduce the power that
can be handled to values less than the limitations imposed by
second breakdown. For inductive loads, high voltage and current
must be sustained simultaneously during turn−off with the
base−to−emitter junction reverse biased. The safe level is
specified as a reverse−biased safe operating area (Figure 29). This
rating is verified under clamped conditions so that the device is
never subjected to an avalanche mode.
TYPICAL THERMAL RESPONSE
1
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
POWER DERATING FACTOR
-1.5
V
0.5
0.2
0.1
0.1
P(pk)
0.05
0.02
t1
SINGLE PULSE
0.01
0.01
t2
DUTY CYCLE, D = t1/t2
0.1
1
10
RqJC(t) = r(t) RqJC
RqJC = 2.5°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) - TC = P(pk) RqJC(t)
100
t, TIME (ms)
Figure 31. Typical Thermal Response (ZqJC(t)) for MJE18004D2
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9
1000
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−220
CASE 221A
ISSUE AK
DATE 13 JAN 2022
SCALE 1:1
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
STYLE 2:
PIN 1.
2.
3.
4.
BASE
EMITTER
COLLECTOR
EMITTER
STYLE 3:
PIN 1.
2.
3.
4.
CATHODE
ANODE
GATE
ANODE
STYLE 4:
PIN 1.
2.
3.
4.
MAIN TERMINAL 1
MAIN TERMINAL 2
GATE
MAIN TERMINAL 2
STYLE 5:
PIN 1.
2.
3.
4.
GATE
DRAIN
SOURCE
DRAIN
STYLE 6:
PIN 1.
2.
3.
4.
ANODE
CATHODE
ANODE
CATHODE
STYLE 7:
PIN 1.
2.
3.
4.
CATHODE
ANODE
CATHODE
ANODE
STYLE 8:
PIN 1.
2.
3.
4.
CATHODE
ANODE
EXTERNAL TRIP/DELAY
ANODE
STYLE 9:
PIN 1.
2.
3.
4.
GATE
COLLECTOR
EMITTER
COLLECTOR
STYLE 10:
PIN 1.
2.
3.
4.
GATE
SOURCE
DRAIN
SOURCE
STYLE 11:
PIN 1.
2.
3.
4.
DRAIN
SOURCE
GATE
SOURCE
STYLE 12:
PIN 1.
2.
3.
4.
MAIN TERMINAL 1
MAIN TERMINAL 2
GATE
NOT CONNECTED
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42148B
TO−220
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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