MM74HCT245N

DATA SHEET www.onsemi.com Octal 3-State Transceiver MM74HCT245 Description The MM74HCT245 3−STATE bi−directional buffer utilizes advanced silicon−gate CMOS technology and is intended for two−way asynchronous communication between data buses. It has high drive current outputs which enable high speed operation even when driving large bus capacitances. This circuit possesses the low power consumption of CMOS circuitry, yet has speeds comparable to low power Schottky TTL circuits. This device is TTL input compatible and can drive up to 15 LS−TTL loads, and all inputs are protected from damage due to static discharge by diodes to VCC and ground. The MM74HCT245 has one active low enable input (G), and a direction control (DIR). When the DIR input is HIGH, data flows from the A inputs to the B outputs. When DIR is LOW, data flows from B to A. MM74HCT devices are intended to interface between TTL and NMOS components and standard CMOS devices. These parts are also plug−in replacements for LS−TTL devices and can be used to reduce power consumption in existing designs. SOIC−20 WB TSSOP−20 WB CASE 751D−05 CASE 948E TSSOP−20 WB CASE 948AQ MARKING DIAGRAMS 20 HCT 245A ALYW HCT245A AWLYYWW 1 (TSSOP−WB) (SOIC−20 WB) HCT245A= Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week CONNECTION DIAGRAM Features • • • • • TTL Input Compatible 3−STATE Outputs for connection to system busses High Output Drive Current: 6 mA (min) High Speed: 16 ns Typical propagation delay Low Power: 160 mA (74HCT Series) Top View TRUTH TABLE Control Operation Inputs G DIR 245 L L B data to A bus L L A data to B bus H H isolation H = HIGH Level L = LOW Level X = Irrelevant ORDERING INFORMATION See detailed ordering and shipping information on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2016 December, 2022 − Rev 1 1 Publication Order Number: MM74HCT245/D MM74HCT245 Figure 1. Logic Diagram www.onsemi.com 2 MM74HCT245 ABSOLUTE MAXIMUM RATINGS (Note 1) (Note 2) Parameter Symbol Rating Unit VCC Supply Voltage –0.5 to +7.0 V VIN DC Input Voltage –0.5 to VCC+0.5 V DC Output Voltage VOUT –0.5 to VCC+0.5 V Clamp Diode Current ±20 mA IOUT DC Output Current, per pin ±35 mA ICC Maximum Junction Temperature ±70 mA –65 to +150 °C IIK, IOK TSTG Storage Temperature Range PD Power Dissipation S.O. Package only 500 TL Lead Temperature (Soldering 10 seconds) 260 mW °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Absolute Maximum Ratings are those values beyond which damage to the device may occur. 2. Unless otherwise specified all voltages are referenced to ground. RECOMMENDED OPERATING RANGES Symbol VCC VIN, VOUT Parameter Min. Supply Voltage DC Input or Output Voltage TA Operating Temperature Range tr, tf Input Rise or Fall Times Max. Unit 4.5 5.5 V 0 VCC V −55 +125 °C − 500 ns Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 MM74HCT245 DC ELECTRICAL CHARACTERISTICS (VCC = 5 V ±10%, unless otherwise specified.) TA = 25°C TA = –40°C to 85°C TA = –55°C to 125°C Test Conditions Typ. VIH Minimum HIGH Level Input Voltage − − 2.0 2.0 2.0 V VIL Maximum LOW Level Input Voltage − − 0.8 0.8 0.8 V VOH Minimum HIGH Level Output Voltage VIN = VIH or VIL, |IOUT| = 20 mA |IOUT| = 6.0 mA,VCC = 4.5 V |IOUT| = 7.2 mA,VCC = 5.5 V VCC 4.2 5.2 VCC− 0.1 3.98 4.98 VCC− 0.1 3.84 4.84 VCC− 0.1 3.7 4.7 VOL Maximum LOW Level Output Voltage VIN = VIH or VIL, |IOUT| = 20 mA |IOUT| = 6.0 mA,VCC = 4.5 V |IOUT| = 7.2 mA,VCC = 5.5 V 0 0.2 0.2 0.1 0.26 0.26 0.1 0.33 0.33 0.1 0.4 0.4 IIN Maximum Input Current VIN = VCC or GND VIH or VIL, Pin 1or 19 − ±0.1 ±1.0 ±1.0 mA IOZ Maximum 3−STATE Output Leakage Current Vout = VCC or GND G = VIH − ±0.5 ±5.0 ±10 mA ICC Maximum Quiescent Supply Current VIN = VCC or GND, IOUT = 0 mA − 8 80 160 mA 0.6 1.0 1.3 1.5 mA Symbol Parameter VIN = 2.4 V or 0.5 V (Note 4) Guaranteed Limits Unit V V 3. Measured per input. All other inputs at VCC or ground. AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V, tr = tf = 6 ns, TA = 25°C unless otherwise specified) Symbol Test Conditions Parameter Typ. Guaranteed Limit Unit tPHL, tPLH Maximum Output Propagation Delay CL = 45 pF 16 20 ns tPZL, tPZH Maximum Output Enable Time CL = 45 pF RL = 1 kQ 29 40 ns tPLZ, tPHZ Maximum Output Disable Time CL = 5 pF RL = 1 kQ 20 25 ns www.onsemi.com 4 MM74HCT245 AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ±10%, tr = tf = 6 ns, unless otherwise specified) TA = 25°C Typ. TA = –40°C to 85°C TA = –55°C to 125°C Guaranteed Limits Symbol Parameter tPHL, tPLH Maximum Output Propagation Delay CL = 50 pF 17 23 29 34 CL = 150 pF 24 30 38 45 tPZL Maximum Output Enable Time RL = 1 kQ CL = 50 pF 31 42 53 63 ns tPZH Maximum Output Enable Time RL = 1 kQ CL = 50 pF 23 33 41 49 ns tPHZ, tPLZ Maximum Output Disable Time RL = 1 kQ CL = 50 pF 21 30 38 45 ns tTHL, tTLH Maximum Output Rise and Fall Time CL = 50 pF 8 12 15 NIL 18 ns Maximum Input Capacitance − 10 15 15 15 pF COUT Maximum Output/Input Capacitance − 20 25 25 25 pF CPD Power Dissipation Capacitance G = VCC (Note 5) G = GND 7 100 − − − pF pF CIN Test Conditions Unit ns 4. CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. ORDERING INFORMATION Package Shipping† TSSOP−20 WB,Case, 948E (Pb−Free) 75 Units / Tube TSSOP−20 WB, 948AQ (Pb−Free) 2500 Units / Tape and Reel MM74HCT245WM SOIC−20 WB (Pb−Free) 38 Units / Tube MM74HCT245WMX SOIC−20 WB (Pb−Free) 1000 Units / Tape and Reel Product Number MM74HCT245MTC MM74HCT245MTCX †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE H DATE 22 APR 2015 SCALE 1:1 A 20 q X 45 _ M E h 0.25 H NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B b 0.25 M T A S B DIM A A1 b c D E e H h L q S L A 18X e SEATING PLANE A1 c T GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT* 20 20X 20X 1.30 0.52 20 XXXXXXXXXXX XXXXXXXXXXX AWLYYWWG 11 1 11.00 1 XXXXX A WL YY WW G 10 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ 98ASB42343B SOIC−20 WB = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−20 WB CASE 948E ISSUE D DATE 17 FEB 2016 SCALE 2:1 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ K K1 S J J1 11 B SECTION N−N −U− PIN 1 IDENT 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING PLANE DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 7.06 XXXX XXXX ALYWG G 1 0.65 PITCH 16X 0.36 16X 1.26 DOCUMENT NUMBER: 98ASH70169A DESCRIPTION: TSSOP−20 WB A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP20, 4.4x6.5 CASE 948AQ−01 ISSUE A DATE 19 MAR 2009 b SYMBOL MIN NOM MAX A E1 E 1.20 A1 0.05 0.15 A2 0.80 1.05 b 0.19 0.30 c 0.09 0.20 D 6.40 6.50 6.60 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 0.65 BSC e L 0.45 0.75 1.00 REF L1 θ 0.60 0º 8º e TOP VIEW D c A2 A θ1 L A1 SIDE VIEW END VIEW L1 Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. DOCUMENT NUMBER: DESCRIPTION: 98AON34453E TSSOP20, 4.4X6.5 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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