MM74HCT373SJX

MM74HCT373SJX

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOIC20_208MIL

  • 描述:

    MM74HCT373SJX

  • 数据手册
  • 价格&库存
MM74HCT373SJX 数据手册
Revised February 1999 MM74HCT373 • MM74HCT374 3-STATE Octal D-Type Latch • 3-STATE Octal D-Type Flip-Flop General Description The MM74HCT373 octal D-type latches and MM74HCT374 Octal D-type flip flops advanced silicongate CMOS technology, which provides the inherent benefits of low power consumption and wide power supply range, but are LS-TTL input and output characteristic & pin-out compatible. The 3-STATE outputs are capable of driving 15 LS-TTL loads. All inputs are protected from damage due to static discharge by internal diodes to VCC and ground. When the MM74HCT373 LATCH ENABLE input is HIGH, the Q outputs will follow the D inputs. When the LATCH ENABLE goes LOW, data at the D inputs will be retained at the outputs until LATCH ENABLE returns HIGH again. When a high logic level is applied to the OUTPUT CONTROL input, all outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of the storage elements. The MM74HCT374 are positive edge triggered flip-flops. Data at the D inputs, meeting the setup and hold time requirements, are transferred to the Q outputs on positive going transitions of the CLOCK (CK) input. When a high logic level is applied to the OUTPUT CONTROL (OC) input, all outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of the storage elements. MM74HCT devices are intended to interface between TTL and NMOS components and standard CMOS devices. These parts are also plug in replacements for LS-TTL devices and can be used to reduce power consumption in existing designs. Features ■ TTL input characteristic compatible ■ Typical propagation delay: 20 ns ■ Low input current: 1 µA maximum ■ Low quiescent current: 80 µA maximum ■ Compatible with bus-oriented systems ■ Output drive capability: 15 LS-TTL loads Ordering Code: Order Number Package Number MM74HCT373WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT373SJ MM74HCT373MTC MTC20 Package Descriptions 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT373N N20A MM74HCT373WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide MM74HCT373SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT373MTC MM74HCT373N MTC20 N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. © 1999 Fairchild Semiconductor Corporation DS005367.prf www.fairchildsemi.com MM74HCT373 • MM74HCT374 3-STATE Octal D-Type Latch • 3-STATE Octal D-Type Flip-Flop February 1984 MM74HCT373 • MM74HCT374 Connection Diagrams Pin Assignments for DIP, SOIC, SOP and TSSOP Top View MM74HCT373 Top View MM74HCT374 MM74HCT373 MM74HCT374 Truth Tables Output LE Data Control 373 Output Output Control Clock Data Output (374) L H H H L ↑ H L H L L L ↑ L L L L X Q0 L L X Q0 H X X Z H X X Z H = HIGH Level L = LOW Level Q0 = Level of output before steady-state input conditions were established. Z = High Impedance www.fairchildsemi.com H H = HIGH Level L = LOW Level X = Don’t Care ↑ = Transition from LOW-to-HIGH Z = High Impedance State Q0 = The level of the output before steady state input conditions were established. 2 MM74HCT373 • MM74HCT374 Logic Diagrams MM74HCT373 MM74HCT374 3 www.fairchildsemi.com MM74HCT373 • MM74HCT374 Absolute Maximum Ratings(Note 1) Recommended Operating Conditions (Note 2) −0.5 to +7.0V Supply Voltage (VCC) DC Input Voltage (VIN ) −1.5 to VCC +1.5V DC Output Voltage (VOUT) −0.5 to VCC +0.5V Clamp Diode Current (IIK, IOK) ±20 mA DC Output Current, per pin (IOUT) ±35 mA DC VCC or GND Current, per pin (ICC) ±70 mA Storage Temperature Range (TSTG) 600 mW 500 mW Units V 0 VCC V −40 +85 °C 500 ns Input Rise or Fall Times (tr, tf) Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C. Lead Temperature (TL) (Soldering 10 seconds) 5.5 (VIN, VOUT) Operating Temperature Range (TA) −65°C to +150°C S.O. Package only Max 4.5 DC Input or Output Voltage Power Dissipation (PD) (Note 3) Min Supply Voltage (VCC) 260°C DC Electrical Characteristics VCC = 5V ± 10% (unless otherwise specified) Symbol VIH Parameter TA = 25°C Conditions Typ Minimum HIGH Level TA = −40 to 85°C TA = −55 to 125°C Guaranteed Limits Units 2.0 2.0 2.0 V 0.8 0.8 0.8 V Input Voltage VIL Maximum LOW Level Input Voltage VOH VOL IIN IOZ Minimum HIGH Level VIN = VIH or VIL Output Voltage |IOUT | = 20 µA VCC VCC− 0.1 VCC− 0.1 VCC− 0.1 V |IOUT | = 6.0 mA, VCC = 4.5V 4.2 3.98 3.84 3.7 V |IOUT | = 7.2 mA, VCC = 5.5V 5.7 4.98 4.84 4.7 V Maximum LOW Level VIN = VIH or VIL Voltage |IOUT | = 20 µA Maximum Input 0 0.1 0.1 0.1 V |IOUT | = 6.0 mA, VCC = 4.5V 0.2 0.26 0.33 0.4 V |IOUT | = 7.2 mA, VCC = 5.5V 0.2 0.26 0.33 0.4 V ±0.1 ±1.0 ±1.0 µA ±0.5 ±5.0 ±10 µA 8.0 80 160 µA 1.0 1.3 1.5 mA VIN = VCC or GND, Current VIH or VIL Maximum 3-STATE VOUT = VCC or GND Output Leakage Enable = V IH or VIL Current ICC Maximum Quiescent VIN = VCC or GND Supply Current IOUT = 0 µA VIN = 2.4V or 0.5V (Note 4) Note 4: Measured per pin. All others tied to VCCor ground. www.fairchildsemi.com 4 MM74HCT373: VCC = 5.0V, tr = tf = 6 ns TA = 25°C (unless otherwise specified) Symbol tPHL, tPLH Parameter Conditions Guaranteed Typ Limit Units CL = 45 pF 18 25 ns CL = 45 pF 21 30 ns Maximum Enable Propagation Delay CL = 45 pF 20 28 ns Control to Output RL = 1 kΩ Maximum Disable Propagation Delay CL = 5 pF 18 25 ns Control to Output RL = 1 kΩ Maximum Propagation Delay Data to Output tPHL, tPLH Maximum Propagation Delay Latch Enable to Output tPZH, tPZL tPHZ, tPLZ tW Minimum Clock Pulse Width 16 ns tS Minimum Setup Time Data to Clock 5 ns tH Minimum Hold Time Clock to Data 10 ns AC Electrical Characteristics MM74HCT373: VCC = 5.0V ± 10%, tr = tf = 6 ns (unless otherwise specified) Symbol Parameter tPHL, tPLH Maximum Propagation Delay Data to Output tPHL, tPLH Maximum Propagation Delay Latch Enable to Output tPZH, tPZL Maximum Enable Propagation Delay Control to Output TA=25°C Conditions TA=−40 to 85°C TA=−55 to 125°C Typ Guaranteed Limits Units CL = 50 pF 22 30 37 45 ns CL = 150 pF 30 40 50 60 ns CL = 50 pF 25 35 44 53 ns CL = 150 pF 32 45 56 68 ns CL = 50 pF 21 30 37 45 ns CL = 150 pF 30 40 50 60 ns 21 30 37 45 ns 8 12 15 18 ns RL = 1 kΩ tPHZ, tPLZ Maximum Disable Propagation Delay Control to Output tTHL, tTLH Maximum Output Rise CL = 50 pF RL = 1 kΩ CL = 50 pF and Fall Time tW Minimum Clock Pulse Width 16 20 24 ns tS Minimum Setup Time Data to Clock 5 6 8 ns tH Minimum Hold Time Clock to Data 10 13 20 ns CIN Maximum Input Capacitance 10 10 10 pF COUT Maximum Output Capacitance 20 20 20 pF CPD Power Dissipation Capacitance OC = VCC 5 pF (Note 5) OC = GND 52 pF Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. 5 www.fairchildsemi.com MM74HCT373 • MM74HCT374 AC Electrical Characteristics MM74HCT373 • MM74HCT374 AC Electrical Characteristics MM74HCT374: VCC = 5.0V, tr = tf = 6 ns TA = 25°C (unless otherwise specified) Symbol Parameter fMAX Maximum Clock Frequency tPHL, tPLH Maximum Propagation Delay Conditions Typ Guaranteed Limit Units 50 30 MHz CL = 45 pF 20 32 ns Maximum Enable Propagation Delay CL = 45 pF 19 28 ns Control to Output RL = 1 kΩ Maximum Disable Propagation Delay CL = 5 pF 17 25 ns Control to Output RL = 1 kΩ to Output tPZH, tPZL tPHZ, tPLZ tW Minimum Clock Pulse Width 20 ns tS Minimum Setup Time Data to Clock 5 ns tH Minimum Hold Time Clock to Data 16 ns AC Electrical Characteristics MM74HCT374: VCC = 5.0V ± 10%, tr = tf = 6 ns (unless otherwise specified) Symbol Parameter TA = 25°C Conditions TA = −40 to 85°C TA = −55 to 125°C Typ fMAX Maximum Clock Frequency tPHL, tPLH Maximum Propagation Delay to Output tPZH, tPZL Maximum Enable Propagation Delay Control to Output Units Guaranteed Limits 30 24 20 MHz ns CL = 50 pF 22 36 45 48 CL = 150 pF 30 46 57 69 ns CL = 50 pF 21 30 37 45 ns CL = 150 pF 30 40 50 60 ns 21 30 37 45 ns 8 12 15 18 ns RL = 1 kΩ tPHZ, tPLZ Maximum Disable Propagation Delay Control to Output tTHL, tTLH Maximum Output Rise CL = 50 pF RL = 1 kΩ CL = 50 pF and Fall Time tW Minimum Clock Pulse Width 16 20 24 ns tS Minimum Setup Time Data to Clock 20 25 30 ns tH Minimum Hold Time Clock to Data 5 5 5 ns CIN Maximum Input Capacitance 10 10 10 pF COUT Maximum Output Capacitance 20 20 20 pF CPD Power Dissipation Capacitance OC = VCC 5 pF (Note 6) OC = GND 58 pF Note 6: CPD determines the no load power consumption, PD = CPD V CC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + I CC. www.fairchildsemi.com 6 MM74HCT373 • MM74HCT374 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Package Number M20B 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D 7 www.fairchildsemi.com MM74HCT373 • MM74HCT374 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 www.fairchildsemi.com 8 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide Package Number N20A LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or systems device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the sonably expected to cause the failure of the life support body, or (b) support or sustain life, and (c) whose failure device or system, or to affect its safety or effectiveness. to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the www.fairchildsemi.com user. Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. MM74HCT373 • MM74HCT374 3-STATE Octal D-Type Latch • 3-STATE Octal D-Type Flip-Flop Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
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