MM74HCU04MTC

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This literature is subject to all applicable copyright laws and is not for resale in any manner. MM74HCU04 Hex Inverter Features General Description ■ Typical propagation delay: 7ns The MM74HCU04 inverters utilize advanced silicon-gate CMOS technology to achieve operating speeds similar to LS-TTL gates with the low power consumption of standard CMOS integrated circuits. ■ Fanout of 15 LS-TTL loads ■ Quiescent power consumption: 10µA maximum at room temperature Low input current: 1µA maximum ■ The MM74HCU04 is an unbuffered inverter. It has high noise immunity and the ability to drive 15 LS-TTL loads. The 74HCU logic family is functionally as well as pin-out compatible with the standard 74LS logic family. All inputs are protected from damage due to static discharge by internal diode clamps to VCC and ground. Ordering Information Package Number Package Description MM74HCU04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow MM74HCU04SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Order Number MM74HCU04MTC MM74HCU04N MTC14 N14A 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com MM74HCU04 — Hex Inverter February 2008 MM74HCU04 — Hex Inverter Connection Diagram Pin Assignments for DIP, SOIC, SOP and TSSOP Top View Schematic Diagram ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Rating VCC Supply Voltage VIN DC Input Voltage –1.5 to VCC+1.5V DC Output Voltage –0.5 to VCC+0.5V VOUT IIK, IOK –0.5 to +7.0V Clamp Diode Current ±20mA IOUT DC Output Current, per pin ±25mA ICC DC VCC or GND Current, per pin ±50mA TSTG PD Storage Temperature Range –65°C to +150°C Power Dissipation Note 2 600mW S.O. Package only TL 500mW Lead Temperature (Soldering 10 seconds) 260°C Notes: 1. Unless otherwise specified all voltages are referenced to ground. 2. Power Dissipation temperature derating — plastic “N” package: –12mW/°C from 65°C to 85°C. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol VCC VIN, VOUT TA Parameter Min. Max. Units Supply Voltage 2 6 V DC Input or Output Voltage 0 VCC V –40 +85 °C Operating Temperature Range ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 3 MM74HCU04 — Hex Inverter Absolute Maximum Ratings(1) TA = –40°C to 85°C TA = 25°C Symbol VIH VIL VOH VOL Parameter VCC (V) Conditions Typ. TA = –55°C to 125°C Guaranteed Limits Minimum HIGH Level Input Voltage 2.0 1.7 1.7 1.7 4.5 3.6 3.6 3.6 6.0 4.8 4.8 4.8 Maximum LOW Level Input Voltage 2.0 0.3 0.3 0.3 4.5 0.8 0.8 0.8 6.0 1.1 1.1 1.1 2.0 1.8 1.8 1.8 4.5 4.0 4.0 4.0 6.0 5.5 5.5 5.5 Minimum HIGH Level Output Voltage Maximum LOW Level Output Voltage 2.0 4.5 VIN = VIL, |IOUT| ≤ 20µA 6.0 4.5 VIN = GND, |IOUT| ≤ 4.0mA 4.2 3.98 3.84 3.7 6.0 VIN = GND, |IOUT| ≤ 5.2mA 5.7 5.48 5.34 5.2 2.0 VIN = VIH, |IOUT| ≤ 20µA 0 0.2 0.2 0.2 0 0.5 0.5 0.5 0 0.5 0.5 0.5 4.5 6.0 4.5 VIN = VCC, |IOUT| ≤ 6.0mA 0.2 0.26 0.33 0.4 6.0 VIN = VCC, |IOUT| ≤ 7.8mA 0.2 0.26 0.33 0.4 Units V V V V IIN Maximum Input Current 6.0 VIN = VCC or GND ±0.1 ±1.0 ±1.0 µA ICC Maximum Quiescent Supply Current 6.0 VIN = VCC or GND, IOUT = 0µA 2.0 20 40 µA Note: 3. For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. AC Electrical Characteristics VCC = 5V, TA = 25°C, CL = 15pF, tr = tf = 6ns Symbol Parameter Conditions tPHL, tPLH Maximum Propagation Delay ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 Typ. Guaranteed Limit Units 7 13 ns www.fairchildsemi.com 4 MM74HCU04 — Hex Inverter DC Electrical Characteristics TA=25°C Symbol tPHL, tPLH tTLH, tTHL Parameter Conditions VCC (V) Typ. Maximum Propagation Delay Maximum Output Rise and Fall Time CPD Power Dissipation Capacitance(4) CIN Maximum Input Capacitance (per gate) TA = –40°C to 85°C TA –55°C to 125°C Guaranteed Limits Units 2.0 49 82 103 120 4.5 9.9 16 21 24 6.0 8.4 14 18 20 2.0 30 75 95 110 4.5 8 15 19 22 6.0 7 13 16 19 90 8 ns ns pF 15 15 15 pF Note: 4. CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. Typical Applications Figure 1. Crystal Oscillator Figure 2. Stable RC Oscillator Figure 3. Schmitt Trigger ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 5 MM74HCU04 — Hex Inverter AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50pF, tr = tf = 6ns (unless otherwise specified) 0.65 A 0.43TYP 14 8 B 6.4 6.10 3.2 1 PIN#1 IDENT 0.2 C B A 7 TOP VIEW 1.65 ALL LEAD TIPS 0.45 RECOMMENDED LAND PATTERN 1.2 MAX 0.30 0.19 ALL LEAD TIPS 0.1 C 0.65 SEE DETAIL A 0.90+0.15 -0.10 0.13 A B 0.20 0.09 C C FRONT VIEW 0.09 MIN NOTES: A. CONFORMS TO JEDEC REGISTRATION MO-153, VARIATION AB, REF NOTE 6 B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS D. DIMENSIONING AND TOLERANCES PER ANSI Y14.5M, 2009. E. LANDPATTERN STANDARD: SOP65P640X110-14M. F. DRAWING FILE NAME: MKT-MTC14rev7. GAGE PLANE 0.09 MIN 1.00 0.25 SEATING PLANE DETAIL A 8.75 8.50 A 7.62 14 8 14 B 0.65 8 4.00 3.80 6.00 1 PIN #1 IDENT. 1.27 (0.33) TOP VIEW 5.60 7 0.51 0.35 0.25 M C B A 1.75 MAX 1.70 1 1.27 LAND PATTERN RECOMMENDATION A C 1.50 1.25 FRONT VIEW 0.25 0.10 0.50 0.25 x 45 R0.10 GAGE PLANE R0.10 0.36 8° 0° 0.90 0.50 (1.04) 0.10 C 0.25 0.19 SIDE VIEW NOTES: A. CONFORMS TO JEDEC MS-012, VARIATION AB, ISSUE C B. ALL DIMENSIONS ARE IN MILLIMETERS C. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR BURRS D. LAND PATTERN STANDARD: SOIC127P600X145-14M E. CONFORMS TO ASME Y14.5M, 2009 D. DRAWING FILENAME: MKT-M14Arev14 SEATING PLANE DETAIL A SCALE 16 : 1 7 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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