PN200A / MMBT200 — PNP General-Purpose Amplifier
PN200A / MMBT200
PNP General-Purpose Amplifier
Description
This device is designed for general-purpose amplifier
applications at collector currents to 300 mA. Sourced
from Process 68.
C
E
TO-92
SOT-23
EBC
Figure 1. PN200A Device Package
B
Figure 2. MMBT200 Device Package
Ordering Information
Part Number
Marking
Package
Packing Method
PN200A
PN200A
TO-92 3L
Bulk
MMBT200
N2
SOT-23 3L
Tape and Reel
Absolute Maximum Ratings(1),(2)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Value
Unit
VCEO
Collector-Emitter Voltage
-45
V
VCBO
Collector-Base Voltage
-60
V
VEBO
Emitter-Base Voltage
-6
V
-500
mA
-55 to +150
°C
IC
TJ, TSTG
Collector Current - Continuous
Operating and Storage Junction Temperature Range
Notes:
1. These ratings are based on a maximum junction temperature of 150°C.
2. These are steady-state limits. ON Semiconductor should be consulted on applications involving pulsed or lowduty cycle operations.
© 1997 Semiconductor Components Industries, LLC.
October-2017, Rev. 2
Publication Order Number:
PN200A/D
Values are at TA = 25°C unless otherwise noted.
Symbol
Max.
Parameter
(3)
PN200A
MMBT200(4)
Unit
Total Device Dissipation
625
350
mW
Derate Above 25°C
5.0
2.8
mW/°C
RθJC
Thermal Resistance, Junction to Case
83.3
RθJA
Thermal Resistance, Junction to Ambient
200
PD
°C/W
357
°C/W
Notes:
3. PCB size: FR-4 76 x 114 x 1.57 mm3 (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.
4. Device mounted on FR-4 PCB 1.6 inch X 1.6 inch X 0.06 inch.
Electrical Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Conditions
Min.
Max.
Unit
Off Characteristics
BVCEO
Collector-Base Breakdown Voltage IC = -10 μA, IB = 0
Collector-Emitter Breakdown
IC = -1.0 mA, IE = 0
Voltage(5)
BVEBO
Emitter-Base Breakdown Voltage
IE = -10 μA, IC = 0
ICBO
Collector Cut-Off Current
VCB = -50 V, IE = 0
-50
nA
ICES
Collector Cut-Off Current
VCE = -40 V, IE = 0
-50
nA
IEBO
Emitter Cut-Off Current
VEB = -4.0 V, IC = 0
-50
nA
BVCBO
-60
V
-45
V
-6.0
V
On Characteristics
hFE
DC Current Gain
IC = -100 μA,
VCE = -1.0 V
MMBT200
PN200A
240
IC = -10 mA,
VCE = -1.0 V
MMBT200
100
450
PN200A
300
600
PN200A
100
MMBT200
100
PN200A
100
IC = -100 mA,
VCE = -1.0 V(5)
IC = -150 mA,
VCE = -5.0 V(5)
VCE(sat)
Collector-Emitter Saturation
Voltage
IC = -10 mA, IB = -1.0 mA
VBE(sat)
Base-Emitter Saturation
Voltage
IC = -10 mA, IB = -1.0 mA
IC = -200 mA, IB = -20
IC = -200 mA, IB = -20
80
350
-0.2
mA(5)
-0.4
-0.85
mA(5)
-1.00
V
V
Small Signal Characteristics
fT
Cob
NF
Current Gain - Bandwidth Product
VCE = -20 V, IC = -20 mA,
Output Capacitance
VCB = -10 V, f = -1.0 MHz
6.0
pF
Noise Figure
IC = -100 μA, VCE = -5.0 V,
RG = 2.0 kΩ, f = 1.0 kHz
4.0
dB
Note:
5. Pulse test: pulse width ≤ 300 μs, duty cycle ≤ 2.0%.
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2
250
MHz
PN200A / MMBT200 — PNP General-Purpose Amplifier
Thermal Characteristics
β
β
VCESAT - COLLECTOR EMITTER VOLTAGE (V)
h FE - TYPICAL PULSED CURRENT GAIN
500
V CE = 5V
400
0.25
125 °C
300
- 40 °C
0
0.01
0.1
1
10
100
I C - COLLECTOR CURRENT (mA)
0
0.1
V BEON - BAS E EMITTER ON VOLTAGE (V)
V BESAT - BASE EM ITTE R VOLTAGE (V)
β = 10
25 °C
- 40 °C
1
10
100
I C - COLLECTOR CURRE NT (mA)
300
- 40°C
25 °C
0.6
125 °C
125 °C
0.4
0.4
V CE = 5V
0.2
0.2
1
10
100
I C - COLLECTOR CURRE NT (mA)
300
0
0.1
1
10
I C - COLLECTOR CURRE NT (mA)
100 200
Figure 6. Base-Emitter On Voltage vs.
Collector Current
BV CER - BREAKDOWN VOLTAGE (V)
Figure 5. Base-Emitter Saturation Voltage
vs. Collector Current
I CBO - COLLE CTOR CURRENT (nA)
125 °C
1
0.8
- 40 °C
0.6
0
0.1
25 °C
0.1
Figure 4. Collector-Emitter Saturation Voltage
vs. Collector Current
1
0.8
0.2
0.05
Figure 3. Typical Pulsed Current Gain
vs. Collector Current
1.2
β = 10
0.15
25 °C
200
100
0.3
100
95
V CB = 50V
90
10
85
1
80
0.1
0.01
25
75
50
75
100
T A - AMBIE NT TEMPERATURE ( ° C)
70
0.1
125
Figure 7. Collector Cut-Off Current vs.
Ambient Temperature
1
10
RESISTANCE (kΩ )
100
1000
Figure 8. Collector-Emitter Breakdown Voltage with
Resistance Between Emitter-Base
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3
PN200A / MMBT200 — PNP General-Purpose Amplifier
Typical Performance Characteristics
β
V CE - COLLECTOR-EMITTER VOLTAGE (V)
100
4
f = 1.0 MHz
CAPACITANCE (pF)
Ta = 25°C
3
Ic =
2
100 uA
300 mA
50 mA
1
0
100
300
700
10
Cib
Cob
0.1
2000 4000
1
I B - BASE CURRENT (uA)
f T - GAIN BANDWIDTH PRODUCT (MHz)
300
40
270
Vce = 5V
TIME (nS)
210
20
180
IB1 = IB2 = Ic / 10
V cc = 10 V
150
120
90
10
tf
60
30
1
10
20
50
0
10
100 150
I C - COLLECTOR CURRENT (mA)
700
600
500
TO-92
400
SOT-23
300
200
100
0
25
50
75
100
TEMPER ATURE ( °C)
125
tr
td
20
30
50
100
200
I C - COLLECTOR CURRENT (mA)
300
Figure 12. Switching Times vs. Collector Current
Figure 11. Gain Bandwidth Product vs.
Collector Current
P D - POWER DISSIPATION (mW)
ts
240
30
0
100
Figure 10. Input and Output Capacitance vs.
Reverse Voltage
Figure 9. Collector Saturation Region
0
10
V CE - COLLECTOR VOLTAGE (V)
150
Figure 13. Power Dissipation vs.
Ambient Temperature
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4
PN200A / MMBT200 — PNP General-Purpose Amplifier
Typical Performance Characteristics (Continued)
PN200A / MMBT200 — PNP General-Purpose Amplifier
Physical Dimensions
TO-92
D
Figure 14. 3-LEAD, TO-92, MOLDED, STD STRAGHIT LEAD (NO EOL CODE) (ACTIVE)
Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in
any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to
verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor's worldwide terms and
conditions, specifically the warranty therein, which covers ON Semiconductor products.
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5
SOT-23
0.95
2.92±0.20
3
1.40
1.30+0.20
-0.15
1
(0.29)
2
0.95
1.90
2.20
0.60
0.37
0.20
A B
1.90
1.00
LAND PATTERN
RECOMMENDATION
SEE DETAIL A
1.20 MAX
0.10
0.00
(0.93)
0.10
C
C
2.40±0.30
NOTES: UNLESS OTHERWISE SPECIFIED
GAGE PLANE
0.23
0.08
0.25
0.20 MIN
(0.55)
SEATING
PLANE
A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M - 1994.
E) DRAWING FILE NAME: MA03DREV10
SCALE: 2X
Figure 15. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE)
Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in
any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to
verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and
conditions, specifically the warranty therein, which covers ON Semiconductor products.
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6
PN200A / MMBT200 — PNP General-Purpose Amplifier
Physical Dimensions (Continued)
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