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MMBTA42LT1G_11

MMBTA42LT1G_11

  • 厂商:

    ONSEMI(安森美)

  • 封装:

  • 描述:

    MMBTA42LT1G_11 - High Voltage Transistors - ON Semiconductor

  • 数据手册
  • 价格&库存
MMBTA42LT1G_11 数据手册
MMBTA42LT1G, MMBTA43LT1G High Voltage Transistors NPN Silicon Features http://onsemi.com COLLECTOR 3 1 BASE Symbol MMBTA42 MMBTA43 MMBTA42 MMBTA43 MMBTA42 MMBTA43 VCEO Value 300 200 300 200 6.0 6.0 500 Unit Vdc 3 1 Vdc 2 SOT−23 (TO−236) CASE 318 STYLE 6 2 EMITTER • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Characteristic Collector − Emitter Voltage Collector − Base Voltage VCBO Vdc Emitter − Base Voltage VEBO Collector Current − Continuous IC Symbol PD mAdc THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR−5 Board (Note 1) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Total Device Dissipation Alumina Substrate (Note 2) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Max 225 1.8 556 300 2.4 417 −55 to +150 Unit mW mW/°C °C/W 1 mW mW/°C °C/W °C MARKING DIAGRAMS RqJA PD 1D M G G 1 M1E M G G RqJA TJ, Tstg Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 x 0.75 x 0.062 in. 2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina. 1D = MMBTA42LT M1E = MMBTA43LT M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ORDERING INFORMATION © Semiconductor Components Industries, LLC, 2011 June, 2011 − Rev. 10 1 Publication Order Number: MMBTA42LT1/D MMBTA42LT1G, MMBTA43LT1G ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic OFF CHARACTERISTICS Collector − Emitter Breakdown Voltage (Note 3) (IC = 1.0 mAdc, IB = 0) Collector − Base Breakdown Voltage (IC = 100 mAdc, IE = 0) Emitter − Base Breakdown Voltage (IE = 100 mAdc, IC = 0) Collector Cutoff Current (VCB = 200 Vdc, IE = 0) (VCB = 160 Vdc, IE = 0) Emitter Cutoff Current (VEB = 6.0 Vdc, IC = 0) (VEB = 4.0 Vdc, IC = 0) ON CHARACTERISTICS (Note 3) DC Current Gain (IC = 1.0 mAdc, VCE = 10 Vdc) (IC = 10 mAdc, VCE = 10 Vdc) (IC = 30 mAdc, VCE = 10 Vdc) Collector − Emitter Saturation Voltage (IC = 20 mAdc, IB = 2.0 mAdc) Base−Emitter Saturation Voltage (IC = 20 mAdc, IB = 2.0 mAdc) SMALL− SIGNAL CHARACTERISTICS Current − Gain − Bandwidth Product (IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz) Collector−Base Capacitance (VCB = 20 Vdc, IE = 0, f = 1.0 MHz) 3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%. MMBTA42 MMBTA43 fT Ccb 50 − MHz pF Both Types Both Types MMBTA42 MMBTA43 MMBTA42 MMBTA43 VCE(sat) hFE 25 40 40 40 − − − − − − − 0.5 0.5 0.9 Vdc − MMBTA42 MMBTA43 MMBTA42 MMBTA43 MMBTA42 MMBTA43 MMBTA42 MMBTA43 V(BR)CEO 300 200 300 200 6.0 − − − − − Vdc Symbol Min Max Unit V(BR)CBO Vdc V(BR)EBO ICBO Vdc mAdc − − − − 0.1 0.1 0.1 0.1 IEBO mAdc VBE(sat) Vdc − − 3.0 4.0 http://onsemi.com 2 MMBTA42LT1G, MMBTA43LT1G TYPICAL CHARACTERISTICS 1000 VCE(sat), COLLECTOR−EMITTER SATURATION VOLTAGE (V) VCE = 10 V hFE, DC CURRENT GAIN 1.2 IC/IB = 10 1.0 0.8 0.6 0.4 0.2 −55°C 0.0 0.1 1 10 100 25°C 150°C TJ = 150°C 100 25°C −55°C 10 0.1 1 10 100 IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA) Figure 1. DC Current Gain Figure 2. Collector−Emitter Saturation Voltage vs. Collector Current 1.0 0.9 0.8 −55°C 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1 1 10 IC/IB = 10 100 150°C 25°C 0.9 VBE(sat), BASE−EMITTER SATURATION VOLTAGE (V) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1 1 10 IC/IB = 10 100 150°C −55°C 25°C IC, COLLECTOR CURRENT (mA) VBE(on), BASE−EMITTER VOLTAGE (V) 1.0 IC, COLLECTOR CURRENT (mA) Figure 3. Base−Emitter Saturation Voltage vs. Collector Current qVB, TEMPERATURE COEFFICIENT (mV/°C) 0 −0.4 −0.8 −1.2 −1.6 −2.0 −2.4 −2.8 0.1 1 qVB, for VBE −55°C to 150°C 10 100 0.1 0.1 VCE = 10 V C, CAPACITANCE (pF) 100 Figure 4. Base−Emitter On Voltage vs. Collector Current Cibo TJ = 25°C f = 1 MHz 10 Cobo 1 1 10 100 1000 IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS) Figure 5. Base−Emitter Temperature Coefficient http://onsemi.com 3 Figure 6. Capacitance MMBTA42LT1G, MMBTA43LT1G TYPICAL CHARACTERISTICS fTau, CURRENT−GAIN BANDWIDTH (MHz) 100 VCE = 20 V TJ = 25°C 10 1 10 IC, COLLECTOR CURRENT (mA) 100 Figure 7. Current−Gain — Bandwidth Product http://onsemi.com 4 MMBTA42LT1G, MMBTA43LT1G ORDERING INFORMATION Device Order Number MMBTA42LT1G MMBTA42LT3G MMBTA43LT1G Package Type SOT−23 (Pb−Free) SOT−23 (Pb−Free) SOT−23 (Pb−Free) Shipping† 3,000 / Tape & Reel 10,000 / Tape & Reel 3,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MMBTA42LT1G, MMBTA43LT1G PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AP D SEE VIEW C 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A A1 b c D E e L L1 HE q MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10 0° MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 −−− 10 ° MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083 0° INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094 −−− MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104 10° E 1 2 HE c e b q 0.25 A A1 L L1 VIEW C STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.0 0.079 0.9 0.035 SCALE 10:1 0.8 0.031 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 6 MMBTA42LT1/D
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