MMBV3700LT1, MPN3700 High Voltage Silicon Pin Diodes
These devices are designed primarily for VHF band switching applications but are also suitable for use in general−purpose switching circuits. They are supplied in a cost−effective plastic package for economical, high−volume consumer and industrial requirements. They are also available in surface mount.
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SOT−23
• Long Reverse Recovery Time trr = 300 ns (Typ) • Rugged PIN Structure Coupled with Wirebond Construction for • Low Series Resistance @ 100 MHz −
Optimum Reliability RS = 0.7 W (Typ) @ IF = 10 mAdc
1 Anode
3 Cathode
MARKING DIAGRAM
3 SOT−23 (TO−236AB) CASE 318 −08 STYLE 8
• Reverse Breakdown Voltage = 200 V (Min) • Pb−Free Packages are Available
MAXIMUM RATINGS
Rating Reverse Voltage Forward Power Dissipation @ TA = 25°C MMBV3700LT1 Derate above 25°C Forward Power Dissipation @ TA = 25°C Derate above 25°C Junction Temperature Storage Temperature Range MPN3700 TJ Tstg Symbol VR PD 200 2.8 PD 280 2.8 +125 −55 to +150 mW mW/°C °C °C mW mW/°C Value 20 Unit Vdc 1 2
4R M G G
1
4R = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location.
TO−92 1 Anode 2 Cathode
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
MARKING DIAGRAM
1 2
TO−92 (TO−226AC) CASE 182−06 STYLE 1
MPN 3700 AYWW G G
MPN = Device Code 3700 = Specific Device A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
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January, 2006 − Rev. 3
Publication Order Number: MMBV3700LT1/D
MMBV3700LT1, MPN3700
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Reverse Breakdown Voltage (IR = 10 mAdc) Diode Capacitance (VR = 20 Vdc, f = 1.0 MHz) Series Resistance (Figure 5) (IF = 10 mAdc) Reverse Leakage Current (VR = 150 Vdc) Reverse Recovery Time (IF = IR = 10 mAdc) Symbol V(BR)R CT RS IR trr Min 200 − − − − Typ − − 0.7 − 300 Max − 1.0 1.0 0.1 − Unit Vdc pF W mAdc ns
TYPICAL CHARACTERISTICS
3.2 RS , SERIES RESISTANCE (OHMS) TA = 25°C I F , FORWARD CURRENT (mA) 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 0 2.0 4.0 6.0 8.0 10 12 14 16 800 700 600 500 400 300 200 100 0 0.7 0.8 0.9 1.0 TA = 25°C
IF, FORWARD CURRENT (mA)
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Series Resistance
10 8.0 6.0 4.0 2.0 1.0 0.8 0.6 0.4 0.2 0.1 TA = 25°C 100 40 I R , REVERSE CURRENT (μ A) 10 4.0 1.0 0.4 0.1 0.04 0.01
Figure 2. Forward Voltage
C T , DIODE CAPACITANCE (pF)
VR = 15 Vdc
0.004 0 −10 −20 −30 −40 −50 0.001 −60 −20 0 +20 +60 +100 +140
VR, REVERSE VOLTAGE (VOLTS)
TA, AMBIENT TEMPERATURE (°C)
Figure 3. Diode Capacitance
Figure 4. Leakage Current
ORDERING INFORMATION
Device MMBV3700LT1 MMBV3700LT1G MPN3700 MPN3700G Package SOT−23 SOT−23 (Pb−Free) TO−92 TO−92 (Pb−Free) Shipping † 3000 / Tape & Reel 3000 / Tape & Reel 1000 Units / Bulk 1000 Units / Bulk
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MMBV3700LT1, MPN3700
PACKAGE DIMENSIONS
SOT−23 (TO−236) CASE 318−08 ISSUE AN
D
3 SEE VIEW C
E
1 2
HE c b e q 0.25
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. DIM A A1 b c D E e L L1 HE MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10 MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083 INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094 MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104
A L A1 L1 VIEW C
STYLE 8: PIN 1. ANODE 2. NO CONNECTION 3. CATHODE
SOLDERING FOOTPRINT*
0.95 0.037 0.95 0.037
2.0 0.079 0.9 0.035
SCALE 10:1
0.8 0.031
mm inches
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MMBV3700LT1, MPN3700
PACKAGE DIMENSIONS
TO−92 (TO−226) CASE 182−06 ISSUE AL
A
B
SEATING PLANE
R D K L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND ZONE R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES DIM MIN MAX A 0.175 0.205 B 0.170 0.210 C 0.125 0.165 D 0.016 0.021 G 0.050 BSC H 0.100 BSC J 0.014 0.016 K 0.500 −−− L 0.250 −−− N 0.080 0.105 P −−− 0.050 R 0.115 −−− V 0.135 −−− STYLE 1: PIN 1. ANODE 2. CATHODE MILLIMETERS MIN MAX 4.45 5.21 4.32 5.33 3.18 4.19 0.407 0.533 1.27 BSC 2.54 BSC 0.36 0.41 12.70 −−− 6.35 −−− 2.03 2.66 −−− 1.27 2.93 −−− 3.43 −−−
XX D G H V C N
SECTION X−X
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ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MMBV3700LT1/D
