MMQA21VT1

MMQA Quad Common Anode Series Preferred Devices SC−74 Quad Monolithic Common Anode Transient Voltage Suppressors for ESD Protection This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium. Features http://onsemi.com SC−74 QUAD TRANSIENT VOLTAGE SUPPRESSOR 24 WATTS PEAK POWER 5.6 − 33 VOLTS PIN ASSIGNMENT 1 2 6 1 SC−74 PLASTIC CASE 318F 3 PIN 1. 2. 3. 4. 5. 6. 6 5 4 CATHODE ANODE CATHODE CATHODE ANODE CATHODE • SC−74 Package Allows Four Separate Unidirectional Configurations • Peak Power − Min. 24 W @ 1.0 ms (Unidirectional), • • • • • per Figure 5 Waveform Peak Power − Min. 150 W @ 20 ms (Unidirectional), per Figure 6 Waveform Maximum Clamping Voltage @ Peak Pulse Current Low Leakage < 2.0 mA ESD Rating of Class N (exceeding 16 kV) per the Human Body Model Pb−Free Packages are Available THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Peak Power Dissipation @ 1.0 ms (Note 1) @ TA ≤ 25°C Peak Power Dissipation @ 20 ms (Note 2) @ TA ≤ 25°C Total Power Dissipation on FR-5 Board (Note 3) @ TA = 25°C Thermal Resistance from Junction−to−Ambient Total Power Dissipation on Alumina Substrate (Note 4) @ TA = 25°C Derate above 25°C Thermal Resistance from Junction−to−Ambient Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) Symbol Ppk Ppk °PD° Value 24 150 °225 1.8 556 °300 2.4 417 °− 55 to +150° 260 Unit W W mW° mW/°C ° °C/W mW° mW/°C °C/W °C MARKING DIAGRAM xxx M G G RqJA °PD° xxx = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. RqJA TJ, Tstg TL DEVICE MARKING INFORMATION See specific marking information in the device marking table on page 5 of this data sheet. ORDERING INFORMATION °C See detailed ordering and shipping information in the table on page 5 of this data sheet. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2005 1 August, 2005 − Rev. 6 Publication Order Number: MMQA/D MMQA Quad Common Anode Series ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA) Max Reverse Leakage Current Max Zener Impedance (Note 7) ZZT @ IZT (W) (mA) 400 300 300 80 80 80 80 80 80 80 100 125 150 200 Max Reverse Voltage @ IRSM (Note 6) (Clamping Voltage) VRSM (V) 8.0 9.0 9.8 17.3 18.6 21.7 26 28.6 30.3 31.7 34.6 39 43.3 48.6 Capacitance @ 0 Volt Bias, 1 MHz Breakdown Voltage VZT (Note 5) (V) Device MMQA5V6T1,T3 MMQA6V2T1,T3 MMQA6V8T1,T3 MMQA12VT1,T3 MMQA13VT1 MMQA15VT1,T3 MMQA18VT1,T3 MMQA20VT1,T3 MMQA21VT1,T3 MMQA22VT1,T3 MMQA24VT1,T3 MMQA27VT1,T3 MMQA30VT1,T3 MMQA33VT1,T3 1. 2. 3. 4. 5. 6. 7. Min 5.32 5.89 6.46 11.4 12.4 14.3 17.1 19 20 20.9 22.8 25.7 28.5 31.4 Nom 5.6 6.2 6.8 12 13 15 18 20 21 22 24 27 30 33 Max 5.88 6.51 7.14 12.6 13.7 15.8 18.9 21 22.1 23.1 25.2 28.4 31.5 34.7 @ IZT (mA) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 IR (nA) 2000 700 500 75 75 75 75 75 75 75 75 75 75 75 VR (V) 3.0 4.0 4.3 9.1 9.8 11 14 15 16 17 18 21 23 25 Max Reverse Surge Current IRSM (A) 3.0 2.66 2.45 1.39 1.29 1.1 0.923 0.84 0.792 0.758 0.694 0.615 0.554 0.504 Maximum Temperature Coefficient of VZ (mV/°C) 1.26 10.6 10.9 14 15 16 19 20.1 21 22 25 28 32 37 (pF) Min − − 100 − − − − − − − − − − − Max − − 250 − − − − − − − − − − − Non-repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 4. Non-repetitive current pulse per Figure 6 and derate above TA = 25°C per Figure 4. FR-5 = 1.0 x 0.75 x 0.62 in. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina VZ measured at pulse test current IT at an ambient temperature of 25°C. Surge current waveform per Figure 5 and derate per Figure 4. ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. TYPICAL CHARACTERISTICS 300 250 C, CAPACITANCE (pF) 200 150 100 50 0 5.6 0 5.6 6.8 20 27 BIASED AT 0 V BIASED AT 1 V BIASED AT 50% OF VZ NOM 10,000 1,000 I R , LEAKAGE (nA) +150°C +25°C 10 −40°C 100 6.8 12 20 27 VZ, NOMINAL ZENER VOLTAGE (V) 33 33 VZ, NOMINAL ZENER VOLTAGE (V) Figure 1. Typical Capacitance Figure 2. Typical Leakage Current http://onsemi.com 2 MMQA Quad Common Anode Series TYPICAL CHARACTERISTICS PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25 ° C 300 PD , POWER DISSIPATION (mW) 250 200 150 100 50 0 0 25 50 75 100 125 150 175 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 200 ALUMINA SUBSTRATE FR-5 BOARD TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 3. Steady State Power Derating Curve Figure 4. Pulse Derating Curve 100 VALUE (%) PEAK VALUE − I RSM % OF PEAK PULSE CURRENT tr PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr ≤ 10 ms IRSM 2 100 90 80 70 60 50 40 30 20 10 0 tr PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms HALF VALUE − 50 tP 0 tP 0 1 2 3 t, TIME (ms) 4 0 20 40 t, TIME (ms) 60 80 Figure 5. 10 × 1000 ms Pulse Waveform Figure 6. 8 × 20 ms Pulse Waveform 100 Ppk PEAK SURGE POWER (W) PPK , PEAK SURGE POWER (W) RECTANGULAR WAVEFORM, TA = 25°C 200 180 160 140 120 100 80 60 40 20 0 10 × 100 WAVEFORM AS PER FIGURE 5 8 × 20 WAVEFORM AS PER FIGURE 6 10 UNIDIRECTIONAL 1.0 0.1 1.0 10 PW, PULSE WIDTH (ms) 100 1000 5.6 6.8 12 20 NOMINAL VZ 27 33 Figure 7. Maximum Non−Repetitive Surge Power, Ppk versus PW Power is defined as VRSM x IZ(pk) where VRSM is the clamping voltage at IZ(pk). http://onsemi.com 3 Figure 8. Typical Maximum Non−Repetitive Surge Power, Ppk versus VBR MMQA Quad Common Anode Series TYPICAL COMMON ANODE APPLICATIONS A quad junction common anode design in a SC−74 package protects four separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. A simplified example of MMQA Series Device applications is illustrated below. Computer Interface Protection A KEYBOARD TERMINAL PRINTER ETC. B I/O C D FUNCTIONAL DECODER GND MMQA SERIES DEVICE Microprocessor Protection VDD VGG ADDRESS BUS RAM ROM DATA BUS I/O CPU CLOCK CONTROL BUS GND MMQA SERIES DEVICE http://onsemi.com 4 MMQA Quad Common Anode Series DEVICE MARKING AND ORDERING INFORMATION Device* MMQA5V6T1* MMQA6V2T1* MMQA6V2T3* MMQA6V8T1* MMQA12VT1* MMQA13VT1* MMQA15VT1* MMQA18VT1* MMQA20VT1* MMQA20VT3* MMQA21VT1* MMQA22VT1* MMQA24VT1* MMQA27VT1* MMQA27VT3* MMQA30VT1* MMQA33VT1* Device Marking 5A6 6A2 6A2 6A8 12A 13A 15A 18A 20A 20A 21A 22A 24A 27A 27A 30A 33A Package SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 SC−74 Shipping † 3,000/Tape & Reel 3,000/Tape & Reel 10,000/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel 10,000/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel 10,000/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *The “G’’ suffix indicates Pb−Free package available. Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case. FINISH: Corrosion resistant finish, easily solderable. Package designed for optimal automated board assembly. Small package size for high density applications. Available in 8 mm Tape and Reel. Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. http://onsemi.com 5 MMQA Quad Common Anode Series PACKAGE DIMENSIONS SC−74 CASE 318F−05 ISSUE L D 6 5 1 2 4 HE E 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F−01, −02, −03 OBSOLETE. NEW STANDARD 318F−04. DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.37 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.015 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° b e q 0.05 (0.002) A1 A L C SOLDERING FOOTPRINT* 2.4 0.094 STYLE 1: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. CATHODE 5. ANODE 6. CATHODE 1.9 0.074 0.7 0.028 0.95 0.037 0.95 0.037 1.0 0.039 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan : ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 6 MMQA/D