MMQA30VT1G

MMQA Quad Common Anode Series Preferred Devices SC−74 Quad Monolithic Common Anode Transient Voltage Suppressors for ESD Protection http://onsemi.com This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium. SC−74 QUAD TRANSIENT VOLTAGE SUPPRESSOR 24 WATTS PEAK POWER 5.6 − 33 VOLTS Specification Features: PIN ASSIGNMENT • SC−74 Package Allows Four Separate Unidirectional Configurations • Peak Power − Min. 24 W @ 1.0 ms (Unidirectional), • • • • • per Figure 5 Waveform Peak Power − Min. 150 W @ 20 s (Unidirectional), per Figure 6 Waveform Maximum Clamping Voltage @ Peak Pulse Current Low Leakage < 2.0 A ESD Rating of Class N (exceeding 16 kV) per the Human Body Model Pb−Free Packages are Available 6 1 SC−74 PLASTIC CASE 318F 1 6 2 5 3 4 PIN 1. 2. 3. 4. 5. 6. CATHODE ANODE CATHODE CATHODE ANODE CATHODE THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Value Unit Peak Power Dissipation @ 1.0 ms (Note 1) @ TA ≤ 25°C Ppk 24 W Peak Power Dissipation @ 20 s (Note 2) @ TA ≤ 25°C Ppk 150 W Total Power Dissipation on FR-5 Board (Note 3) @ TA = 25°C °PD° °225 1.8 °mW° mW/°C Thermal Resistance from Junction−to−Ambient RJA 556 °C/W Total Power Dissipation on Alumina Substrate (Note 4) @ TA = 25°C Derate above 25°C °PD° °300 2.4 °mW mW/°C xxx xxx M = Device Code = Date Code ORDERING INFORMATION RJA 417 °C/W Junction and Storage Temperature Range TJ, Tstg °− 55 to +150° °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Thermal Resistance from Junction−to−Ambient MARKING DIAGRAM M Characteristic See detailed ordering and shipping information in the table on page 5 of this data sheet. DEVICE MARKING INFORMATION See specific marking information in the device marking table on page 5 of this data sheet. Preferred devices are recommended choices for future use and best overall value.  Semiconductor Components Industries, LLC, 2004 April, 2004 − Rev. 4 1 Publication Order Number: MMQA/D MMQA Quad Common Anode Series ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA) Max Reverse Leakage Current Breakdown Voltage VZT (Note 5) (V) @ IZT IR VR Max Zener Impedance (Note 7) Max Reverse Surge Current Max Reverse Voltage @ IRSM (Note 6) (Clamping Voltage) Maximum Temperature Coefficient of VZ Capacitance @ 0 Volt Bias, 1 MHz (pF) Device Min Nom Max (mA) (nA) (V) ZZT @ IZT (
) (mA) IRSM (A) VRSM (V) (mV/°C) Min Max MMQA5V6T1,T3 5.32 5.6 5.88 1.0 2000 3.0 400 3.0 8.0 1.26 − − MMQA6V2T1,T3 5.89 6.2 6.51 1.0 700 4.0 300 2.66 9.0 10.6 − − MMQA6V8T1,T3 6.46 6.8 7.14 1.0 500 4.3 300 2.45 9.8 10.9 100 250 MMQA12VT1,T3 11.4 12 12.6 1.0 75 9.1 80 1.39 17.3 14 − − MMQA13VT1 12.4 13 13.7 1.0 75 9.8 80 1.29 18.6 15 − − MMQA15VT1,T3 14.3 15 15.8 1.0 75 11 80 1.1 21.7 16 − − MMQA18VT1,T3 17.1 18 18.9 1.0 75 14 80 0.923 26 19 − − MMQA20VT1,T3 19 20 21 1.0 75 15 80 0.84 28.6 20.1 − − MMQA21VT1,T3 20 21 22.1 1.0 75 16 80 0.792 30.3 21 − − MMQA22VT1,T3 20.9 22 23.1 1.0 75 17 80 0.758 31.7 22 − − MMQA24VT1,T3 22.8 24 25.2 1.0 75 18 100 0.694 34.6 25 − − MMQA27VT1,T3 25.7 27 28.4 1.0 75 21 125 0.615 39 28 − − MMQA30VT1,T3 28.5 30 31.5 1.0 75 23 150 0.554 43.3 32 − − MMQA33VT1,T3 31.4 33 34.7 1.0 75 25 200 0.504 48.6 37 − − 1. 2. 3. 4. 5. 6. 7. Non-repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 4. Non-repetitive current pulse per Figure 6 and derate above TA = 25°C per Figure 4. FR-5 = 1.0 x 0.75 x 0.62 in. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina VZ measured at pulse test current IT at an ambient temperature of 25°C. Surge current waveform per Figure 5 and derate per Figure 4. ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. TYPICAL CHARACTERISTICS 300 10,000 BIASED AT 0 V BIASED AT 1 V BIASED AT 50% OF VZ NOM 200 1,000 I R , LEAKAGE (nA) C, CAPACITANCE (pF) 250 150 100 +150°C 100 +25°C 10 −40°C 50 0 5.6 6.8 12 20 27 VZ, NOMINAL ZENER VOLTAGE (V) 0 33 5.6 6.8 20 27 VZ, NOMINAL ZENER VOLTAGE (V) Figure 1. Typical Capacitance Figure 2. Typical Leakage Current http://onsemi.com 2 33 MMQA Quad Common Anode Series PD , POWER DISSIPATION (mW) 300 250 ALUMINA SUBSTRATE 200 150 100 FR-5 BOARD 50 0 0 25 50 75 100 125 150 175 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25 ° C TYPICAL CHARACTERISTICS 100 90 80 70 60 50 40 30 20 10 0 0 25 50 TA, AMBIENT TEMPERATURE (°C) Figure 3. Steady State Power Derating Curve VALUE (%) HALF VALUE
− 50 100 tr 90 % OF PEAK PULSE CURRENT PEAK VALUE
−
IRSM 100 100 125 150 175 200 Figure 4. Pulse Derating Curve PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr ≤ 10 s tr 75 TA, AMBIENT TEMPERATURE (°C) IRSM 2 tP PEAK VALUE IRSM @ 8 s PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 s 80 70 60 HALF VALUE IRSM/2 @ 20 s 50 40 30 tP 20 10 0 0 1 2 3 0 4 0 20 40 t, TIME (ms) 200 RECTANGULAR WAVEFORM, TA = 25°C 180 PPK , PEAK SURGE POWER (W) Ppk PEAK SURGE POWER (W) 80 Figure 6. 8 × 20
s Pulse Waveform Figure 5. 10 × 1000
s Pulse Waveform 100 60 t, TIME (s) 10 UNIDIRECTIONAL 160 8 × 20 WAVEFORM AS PER FIGURE 6 140 120 100 80 10 × 100 WAVEFORM AS PER FIGURE 5 60 40 20 1.0 0.1 1.0 10 100 1000 0 5.6 PW, PULSE WIDTH (ms) 6.8 12 20 27 NOMINAL VZ Figure 7. Maximum Non−Repetitive Surge Power, Ppk versus PW Figure 8. Typical Maximum Non−Repetitive Surge Power, Ppk versus VBR Power is defined as VRSM x IZ(pk) where VRSM is the clamping voltage at IZ(pk). http://onsemi.com 3 33 MMQA Quad Common Anode Series TYPICAL COMMON ANODE APPLICATIONS A quad junction common anode design in a SC−74 package protects four separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. A simplified example of MMQA Series Device applications is illustrated below. Computer Interface Protection A KEYBOARD TERMINAL PRINTER ETC. B C I/O D FUNCTIONAL DECODER GND MMQA SERIES DEVICE Microprocessor Protection VDD VGG ADDRESS BUS RAM ROM DATA BUS I/O CPU CLOCK CONTROL BUS GND MMQA SERIES DEVICE http://onsemi.com 4 MMQA Quad Common Anode Series DEVICE MARKING AND ORDERING INFORMATION Device Marking Package Shipping† MMQA5V6T1 5A6 SC−74 3,000/Tape & Reel MMQA5V6T3 5A6 SC−74 10,000/Tape & Reel MMQA6V2T1 6A2 SC−74 3,000/Tape & Reel MMQA6V2T1G 6A2 SC−74 (Pb−Free) 3,000/Tape & Reel MMQA6V2T3 6A2 SC−74 10,000/Tape & Reel MMQA6V8T1 6A8 SC−74 3,000/Tape & Reel MMQA6V8T3 6A8 SC−74 10,000/Tape & Reel MMQA12VT1 12A SC−74 3,000/Tape & Reel MMQA12VT1G 12A SC−74 (Pb−Free) 3,000/Tape & Reel MMQA12VT3 12A SC−74 10,000/Tape & Reel MMQA13VT1 13A SC−74 3,000/Tape & Reel MMQA15VT1 15A SC−74 3,000/Tape & Reel MMQA15VT3 15A SC−74 10,000/Tape & Reel MMQA18VT1 18A SC−74 3,000/Tape & Reel MMQA18VT3 18A SC−74 10,000/Tape & Reel MMQA20VT1 20A SC−74 3,000/Tape & Reel MMQA20VT3 20A SC−74 10,000/Tape & Reel MMQA20VT3G 20A SC−74 (Pb−Free) 10,000/Tape & Reel MMQA21VT1 21A SC−74 3,000/Tape & Reel MMQA21VT3 21A SC−74 10,000/Tape & Reel MMQA22VT1 22A SC−74 3,000/Tape & Reel MMQA22VT3 22A SC−74 10,000/Tape & Reel MMQA24VT1 24A SC−74 3,000/Tape & Reel MMQA24VT3 24A SC−74 10,000/Tape & Reel MMQA27VT1 27A SC−74 3,000/Tape & Reel MMQA27VT3 27A SC−74 10,000/Tape & Reel MMQA30VT1 30A SC−74 3,000/Tape & Reel MMQA30VT3 30A SC−74 10,000/Tape & Reel MMQA33VT1 33A SC−74 3,000/Tape & Reel MMQA33VT3 33A SC−74 10,000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case. FINISH: Corrosion resistant finish, easily solderable. Package designed for optimal automated board assembly. Small package size for high density applications. Available in 8 mm Tape and Reel. Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. http://onsemi.com 5 MMQA Quad Common Anode Series PACKAGE DIMENSIONS SC−74 CASE 318F−05 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F−01, −02, −03 OBSOLETE. NEW STANDARD 318F−04. A L 6 5 4 2 3 B S 1 DIM A B C D G H J K L M S D G M J C 0.05 (0.002) K H INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0649 0
10
0.0985 0.1181 MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.65 0
10
2.50 3.00 STYLE 1: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. CATHODE 5. ANODE 6. CATHODE SOLDERING FOOTPRINT* 2.4 0.094 0.95 0.037 1.9 0.074 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm 
inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 For additional information, please contact your local Sales Representative. MMQA/D