DATA SHEET
www.onsemi.com
6-Pin DIP Zero-Cross
Triac Driver Optocoupler
(600 Volt Peak)
PDIP6 8.51x6.35, 2.54P
CASE 646BX
6
1
MOC3061M, MOC3062M,
MOC3063M, MOC3162M,
MOC3163M
PDIP6 8.51x6.35, 2.54P
CASE 646BY
6
1
PDIP6 8.51x6.35, 2.54P
CASE 646BZ
6
Description
The MOC306XM and MOC316XM devices consist of a GaAs
infrared emitting diode optically coupled to a monolithic silicon
detector performing the function of a zero voltage crossing bilateral
triac driver.
They are designed for use with a triac in the interface of logic
systems to equipment powered from 115/240 VAC lines, such as
solid−state relays, industrial controls, motors, solenoids and consumer
appliances, etc.
Features
• Simplifies Logic Control of 115/240 VAC Power
• Zero Voltage Crossing to Minimize Conducted and Radiated Line
Noise
• 600 V Peak Blocking Voltage
• Superior Static dv/dt
1
MARKING DIAGRAM
ON
MOC3061
V XYYQ
MOC3061 = Device Number
V
= DIN EN/IEC60747−5−5 Option (only
appears on component ordered with
this option)
X
= One−Digit Year Code, e.g., ‘5’
YY
= Two−Digit Work Week, Ranging from
‘01’ to ‘53’
Q
= Assembly Package Code
♦
•
•
600 V/ms (MOC306xM)
1000 V/ms (MOC316xM)
Safety and Regulatory Approvals
♦ UL1577, 4,170 VACRMS for 1 Minute
♦ DIN EN/IEC60747−5−5
These are Pb−Free Devices
♦
SCHEMATIC
•
•
•
•
•
•
•
•
6 MAIN TERM.
ANODE 1
Applications
Solenoid/Valve Controls
Static Power Switches
Temperature Controls
AC Motor Starters
Lighting Controls
AC Motor Drives
E.M. Contactors
Solid State Relays
CATHODE 2
N/C 3
5 NC*
ZERO
CROSSING
CIRCUIT
4 MAIN TERM.
*DO NOT CONNECT (TRIAC SUBSTRATE)
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of
this data sheet.
© Semiconductor Components Industries, LLC, 2005
September, 2022 − Rev. 3
1
Publication Order Number:
MOC3163M/D
MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M
SAFETY AND INSULATION RATINGS (As per DIN EN/IEC 60747−5−5, this optocoupler is suitable for “safe electrical insulation”
only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.)
Parameter
Characteristics
Installation Classifications per DIN VDE 0110/1.89 Table 1, For Rated Mains Voltage
> 100 ms
12
10
8
6
4
2
0
−20
0
20
40
60
80
TA, AMBIENT TEMPERATURE (°C)
Figure 2. Trigger Current Vs. Temperature
IDRM, LEAKAGE CURRENT (nA)
IFT, LED TRIGGER CURRENT (NORMALIZED)
VTM = 3 V
NORMALIZED TO TA = 25°C
1
10
1000
100
10
1
0.1
−40
100
PWIN, LED TRIGGER PULSE WIDTH (ms)
−20
0
20
40
60
80
100
TA, AMBIENT TEMPERATURE (°C)
Figure 4. Leakage Current, IDRM vs. Temperature
Figure 3. LED Current Required to Trigger vs.
LED Pulse Width
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4
MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M
TYPICAL PERFORMANCE CURVES (Continued)
2.4
IDRM2, NORMALIZED
2.0
1.8
1.6
1.4
1.2
1.0
0.8
400
200
0
−200
−400
−600
0.6
0.4
−40
−20
0
20
40
60
80
TA, AMBIENT TEMPERATURE (°C)
−800
−4
100
3.2
1.20
2.8
1.15
2.4
1.10
2.0
1.6
1.2
4
1.00
0.95
0.90
0.4
0.85
0.80
−40
100
Figure 7. IH, Holding Current vs. Temperature
NORMALIZED TO TA = 25°C
1.05
0.8
−20
0
20
40
60
80
TA, AMBIENT TEMPERATURE (°C)
−1
−3 −2
0
1
2
3
VTM, ON−STATE VOLTAGE (VOLTS)
Figure 6. On−State Characteristics
VINH, NORMALIZED
IH, HOLDING CURRENT (NORMALIZED)
Figure 5. IDRM2, Leakage in Inhibit State vs.
Temperature
0.0
−40
TA = 25°C
600
ITM, ON−STATE CURRENT (mA)
2.2
800
IF = RATED IF
NORMALIZED TO TA = 25°C
−20
0
20
40
60
80
TA, AMBIENT TEMPERATURE (°C)
Figure 8. Inhibit Voltage vs. Temperature
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5
100
MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M
APPLICATION INFORMATION
The 39 W resistor and 0.01 mF capacitor are for snubbing
of the triac and is often, but not always, necessary depending
upon the particular triac and load used.
Suggested method of firing two, back−to−back SCR’s
with a onsemi triac driver. Diodes can be 1N4001; resistors,
R1 and R2, are optional 330 W.
NOTE: This optoisolator should not be used to drive a load
directly. It is intended to be a trigger device only.
Basic Applications
Typical circuit for use when hot line switching is required.
In this circuit the “hot” side of the line is switched and the
load connected to the cold or neutral side. The load may be
connected to either the neutral or hot line.
Rin is calculated so that IF is equal to the rated IFT of the
part, 15 mA for the MOC3061M, 10 mA for the
MOC3062M, or 5 mA for the MOC3063M.
VCC
Rin
1
2
3
6
MOC3061M
MOC3062M
MOC3063M
360 W
HOT
FKPF12N60
5
39 W
4
240 VAC
0.01 mF
360 W
LOAD
NEUTRAL
Figure 9. Hot−Line Switching Application Circuit
115 VAC
R1
1
VCC
Rin
D1
6
MOC3061M
2
5
MOC3062M
MOC3063M
3
4
SCR
SCR
360 W
R2
D2
LOAD
Figure 10. Inverse−Parallel SCR Driver Circuit
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6
MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M
280
260
220
200
TP
Max. Ramp−up Rate = 3°C/S
Max. Ramp−down Rate = 6°C/S
tP
TL
Tsmax
Temperature (°C)
180
160
140
tL
Preheat Area
Tsmin
ts
120
100
80
60
40
20
0
240
120
360
Time 25°C to Peak
Time (seconds)
Temperature Minimum (Tsmin)
150°C
Temperature Maximum (Tsmax)
200°C
Time (tS) from (Tsmin to Tsmax)
60 seconds to 120 seconds
Ramp−up Rate (TL to TP)
3°C/second maximum
Liquidous Temperature (TL)
217°C
Time (tL) Maintained Above (TL)
60 seconds to 150 seconds
Peak Body Package Temperature
260°C +0°C / –5°C
Time (tP) within 5°C of 260°C
30 seconds
Ramp−down Rate (TP to TL)
6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
Figure 11. Reflow Profile
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7
MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M
ORDERING INFORMATION (Note 5)
Package
Shipping†
DIP 6−Pin
(Pb−Free)
50 Units / Tube
MOC3061SM
SMT 6−Pin (Lead Bend)
(Pb−Free)
50 Units / Tube
MOC3061SR2M
SMT 6−Pin (Lead Bend)
(Pb−Free)
1000 / Tape & Reel
DIP 6−Pin, DIN EN/IEC60747−5−5 Option
(Pb−Free)
50 Units / Tube
MOC3061SVM
SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option
(Pb−Free)
50 Units / Tube
MOC3061SR2VM
SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option
(Pb−Free)
1000 / Tape & Reel
DIP 6−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 Option
(Pb−Free)
50 Units / Tube
Part Number
MOC3061M
MOC3061VM
MOC3061TVM
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
5. The product orderable part number system listed in this table also applies to the MOC3062M, MOC3063M, MOC3162M, and MOC3163M
product families.
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8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP6 8.51x6.35, 2.54P
CASE 646BX
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13449G
PDIP6 8.51X6.35, 2.54P
DATE 31 JUL 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP6 8.51x6.35, 2.54P
CASE 646BY
ISSUE A
DATE 15 JUL 2019
A
B
DOCUMENT NUMBER:
DESCRIPTION:
98AON13450G
PDIP6 8.51x6.35, 2.54P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP6 8.51x6.35, 2.54P
CASE 646BZ
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13451G
PDIP6 8.51X6.35, 2.54P
DATE 31 JUL 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
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