DUAL CHANNEL PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOCD223-M
DESCRIPTION
The MOCD223-M consist of two gallium arsenide infrared emitting diodes optically coupled to two
monolithic silicon phototransistor darlington detectors, in a surface mountable, small outline plastic
package. It is ideally suited for high density applications that require low input current and eliminates
the need for through-the-board mounting.
FEATURES
• U.L. Recognized (File #E90700, Volume 2)
• VDE Recognized (File #13616) (add option “V” for VDE approval, i.e, MOCD223V-M)
• Convenient Plastic SOIC-8 Surface Mountable Package Style
• High Current Transfer Ratio of 500% Minimum at IF = 1 mA
• Minimum BVCEO of 30 Volts Guaranteed
• Standard SOIC-8 Footprint, with 0.050" Lead Spacing
• Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
• High Input-Output Isolation Voltage of 2500 VAC(rms) Guaranteed
LED 1 ANODE 1
8 COLLECTOR 1
LED 1 CATHODE 2
7 EMITTER 1
LED 2 ANODE 3
6 COLLECTOR 2
LED 2 CATHODE 4
5 EMITTER 2
APPLICATIONS
• Interfacing and coupling systems of different potentials and impedances
• General purpose switching circuits
• Monitor and detection circuits
ABSOLUTE MAXIMUM RATINGS (TA = 25°C Unless otherwise specified)
Rating
EMITTER
Forward Current - Continuous
Forward Current - Peak (PW = 100 µs, 120 pps)
Reverse Voltage
LED Power Dissipation @ TA = 25°C
Derate above 25°C
DETECTOR
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Collector Voltage
Collector Current-Continuous
Detector Power Dissipation @ TA = 25°C
Derate above 25°C
TOTAL DEVICE
Input-Output Isolation Voltage(1,2,3)
(f = 60 Hz, t = 1 min. Duration)
Total Device Power Dissipation @ TA = 25°C
Derate above 25°C
Ambient Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
(1/16" from case, 10 sec. duration)
© 2003 Fairchild Semiconductor Corporation
Symbol
Value
Unit
IF
IF (pk)
VR
60
1.0
6.0
90
0.8
mA
A
V
mW
mW/°C
30
70
7.0
150
150
1.76
V
V
V
mA
mW
mW/°C
2500
Vac(rms)
TA
Tstg
250
2.94
-40 to +100
-40 to +150
mW
mW/°C
°C
°C
TL
260
°C
PD
VCEO
VCBO
VECO
IC
PD
VISO
PD
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DUAL CHANNEL PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOCD223-M
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
Parameter
Test Conditions
Symbol
Min
Typ**
Max
Unit
VF
—
1.25
1.3
V
EMITTER
Input Forward Voltage
Reverse Leakage Current
(IF = 1.0 mA)
(VR = 6.0 V)
Capacitance
IR
—
0.001
100
µA
CIN
—
18
—
pF
ICEO1
—
1.0
50
nA
DETECTOR
Collector-Emitter Dark Current
(VCE = 5.0 V, TA = 25°C)
ICEO2
—
1.0
—
µA
Collector-Emitter Breakdown Voltage
(IC = 100 µA)
BVCEO
30
90
—
V
Emitter-Collector Breakdown Voltage
(IE = 100 µA)
BVECO
7.0
10
—
V
(f =z 1.0 MHz, VCE = 0)
CCE
—
5.5
—
pF
(IF = 1.0 mA, VCE = 5 V)
CTR
500
1000
—
%
(IC = 500 µA, IF = 1.0 mA)
VCE (sat)
—
—
1.0
V
Turn-On Time
(IF = 5.0 mA, VCC = 10 V,
RL = 100 Ω)(fig 6.)
ton
—
3.5
—
µs
Turn-Off Time
(IF = 5.0 mA, VCC = 10 V,
RL = 100 Ω)(fig 6.)
toff
—
95
—
µs
Rise Time
(IF = 5.0 mA, VCC = 10 V,
RL = 100 Ω)(fig 6.)
tr
—
1.0
—
µs
Fall Time
(IF = 5.0 mA, VCC = 10 V,
RL = 100 Ω)(fig 6.)
tf
—
2.0
—
µs
VISO
2500
—
—
Vac(rms)
VI-O = 500 V
RISO
1011
—
—
Ω
VI-O = 0 V, f = 1 MHz
CISO
—
0.2
—
pF
Collector-Emitter Capacitance
(VCE = 5.0 V, TA = 100°C)
COUPLED
Collector-Output Current(4)
Collector-Emitter Saturation Voltage
Isolation Surge Voltage(1,2,3)
Isolation
Resistance(2)
Isolation Capacitance(2)
f = 60 Hz, t = 1 min.
** Typical values at TA = 25°C
NOTE:
1. Isolation Surge Voltage, VISO, is an internal device dielectric breakdown rating.
2. For this test, Pins 1, 2, 3 and 4 are common and Pins 5, 6, 7 and 8 are common.
3. VISO rating of 2500 VAC(rms) for t = 1 min. is equivalent to a rating of 3,000 VAC(rms) for t = 1 sec.
4. Current Transfer Ratio (CTR) = IC/IF x 100%.
© 2003 Fairchild Semiconductor Corporation
Page 2 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOCD223-M
Fig. 2 Output Curent vs. Input Current
Fig. 1 LED Forward Voltage vs. Forward Current
1.8
I C - OUTPUT COLLECTOR CURRENT (NORMALIZED)
10
VF - FORWARD VOLTAGE (V)
1.7
1.6
1.5
1.4
TA = 55°C
1.3
1.2
TA = 25°C
1.1
TA = 100°C
1.0
1
10
100
IF - LED FORWARD CURRENT (mA)
1
VCE = 5V
NORMALIZED TO I F = 1mA
0.1
0.1
1
Fig. 3 Output Current vs. Ambient Temperature
10
100
Fig. 4 Output Current vs. Collector - Emitter Voltage
2.0
I C - OUTPUT COLLECTOR CURRENT (NORMALIZED)
I C - OUTPUT COLLECTOR CURRENT (NORMALIZED)
10
IF - LED INPUT CURRENT (mA)
1
0.1
IF = 1mA, VCE = 5V
NORMALIZED TO TA = 25oC
0.01
-80
-60
-40
-20
0
20
40
60
80
100
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
IF = 1mA
NORMALIZED TO VCE = 5V
0.0
120
0
1
2
3
4
5
6
7
8
9
10
o
TA - AMBIENT TEMPERATURE ( C)
VCE - COLLECTOR -EMITTER VOLTAGE (V)
Fig. 5 Dark Current vs. Ambient Temperature
I CEO - COLLECTOR -EMITTER DARK CURRENT (nA)
10 5
10 4
VCE = 10V
NORMALIZED TO TA= 25 oC
10 3
10 2
10 1
10 0
10 -1
10 -2
0
20
40
60
80
100
o
TA - AMBIENT TEMPERATURE ( C)
© 2003 Fairchild Semiconductor Corporation
Page 3 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOCD223-M
TEST CIRCUIT
WAVE FORMS
VCC = 10V
INPUT PULSE
IC
IF
INPUT
RL
10%
OUTPUT
OUTPUT PULSE
90%
RBE
tr
ton
tf
toff
Figure 6. Switching Time Test Circuit and Waveforms
© 2003 Fairchild Semiconductor Corporation
Page 4 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOCD223-M
Package Dimensions (Surface Mount)
8-Pin Small Outline
0.024 (0.61)
SEATING PLANE
0.164 (4.16)
0.144 (3.66)
0.060 (1.52)
PIN1
0.202 (5.13)
0.182 (4.63)
0.275 (6.99)
0.155 (3.94)
0.010 (0.25)
0.006 (0.16)
0.143 (3.63)
0.123 (3.13)
0.021 (0.53)
0.011 (0.28)
0.008 (0.20)
0.003 (0.08)
0.244 (6.19)
0.224 (5.69)
0.050 (1.27)
0.050 (1.27)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
© 2003 Fairchild Semiconductor Corporation
Page 5 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOCD223-M
ORDERING INFORMATION
Option
Order Entry Identifier
V
V
R1
R1
R1V
R1V
R2
R2
R2V
R2V
Description
VDE 0884
Tape and reel (500 units per reel)
VDE 0884, Tape and reel (500 units per reel)
Tape and reel (2500 units per reel)
VDE 0884, Tape and reel (2500 units per reel)
MARKING INFORMATION
1
D223
V
X YY S
3
4
2
6
5
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
One digit year code, e.g., ‘3’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
© 2003 Fairchild Semiconductor Corporation
Page 6 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOCD223-M
QT Carrier Tape Specifications
8.0 ± 0.10
3.50 ± 0.20
2.0 ± 0.05
Ø1.5 MIN
4.0 ± 0.10
0.30 MAX
1.75 ± 0.10
5.5 ± 0.05
12.0 ± 0.3
8.3 ± 0.10
5.20 ± 0.20
6.40 ± 0.20
0.1 MAX
Ø1.5 ± 0.1/-0
User Direction of Feed
Reflow Profile
Temperature (°C)
300
230°C, 10–30 s
250
245°C peak
200
150
Time above 183°C, 120–180 sec
100
Ramp up = 2–10°C/sec
50
• Peak reflow temperature: 245°C (package surface temperature)
• Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
© 2003 Fairchild Semiconductor Corporation
Page 7 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOCD223-M
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
© 2003 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
Page 8 of 8
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