MPN3700G

MMBV3700LT1, MPN3700 High Voltage Silicon Pin Diodes These devices are designed primarily for VHF band switching applications but are also suitable for use in general−purpose switching circuits. They are supplied in a cost−effective plastic package for economical, high−volume consumer and industrial requirements. They are also available in surface mount. Features http://onsemi.com SOT−23 • Long Reverse Recovery Time trr = 300 ns (Typ) • Rugged PIN Structure Coupled with Wirebond Construction for • Low Series Resistance @ 100 MHz − Optimum Reliability RS = 0.7 W (Typ) @ IF = 10 mAdc 1 Anode 3 Cathode MARKING DIAGRAM 3 SOT−23 (TO−236AB) CASE 318 −08 STYLE 8 • Reverse Breakdown Voltage = 200 V (Min) • Pb−Free Packages are Available MAXIMUM RATINGS Rating Reverse Voltage Forward Power Dissipation @ TA = 25°C MMBV3700LT1 Derate above 25°C Forward Power Dissipation @ TA = 25°C Derate above 25°C Junction Temperature Storage Temperature Range MPN3700 TJ Tstg Symbol VR PD 200 2.8 PD 280 2.8 +125 −55 to +150 mW mW/°C °C °C mW mW/°C Value 20 Unit Vdc 1 2 4R M G G 1 4R = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. TO−92 1 Anode 2 Cathode Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. MARKING DIAGRAM 1 2 TO−92 (TO−226AC) CASE 182−06 STYLE 1 MPN 3700 AYWW G G MPN = Device Code 3700 = Specific Device A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2006 1 January, 2006 − Rev. 3 Publication Order Number: MMBV3700LT1/D MMBV3700LT1, MPN3700 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Reverse Breakdown Voltage (IR = 10 mAdc) Diode Capacitance (VR = 20 Vdc, f = 1.0 MHz) Series Resistance (Figure 5) (IF = 10 mAdc) Reverse Leakage Current (VR = 150 Vdc) Reverse Recovery Time (IF = IR = 10 mAdc) Symbol V(BR)R CT RS IR trr Min 200 − − − − Typ − − 0.7 − 300 Max − 1.0 1.0 0.1 − Unit Vdc pF W mAdc ns TYPICAL CHARACTERISTICS 3.2 RS , SERIES RESISTANCE (OHMS) TA = 25°C I F , FORWARD CURRENT (mA) 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 0 2.0 4.0 6.0 8.0 10 12 14 16 800 700 600 500 400 300 200 100 0 0.7 0.8 0.9 1.0 TA = 25°C IF, FORWARD CURRENT (mA) VF, FORWARD VOLTAGE (VOLTS) Figure 1. Series Resistance 10 8.0 6.0 4.0 2.0 1.0 0.8 0.6 0.4 0.2 0.1 TA = 25°C 100 40 I R , REVERSE CURRENT (μ A) 10 4.0 1.0 0.4 0.1 0.04 0.01 Figure 2. Forward Voltage C T , DIODE CAPACITANCE (pF) VR = 15 Vdc 0.004 0 −10 −20 −30 −40 −50 0.001 −60 −20 0 +20 +60 +100 +140 VR, REVERSE VOLTAGE (VOLTS) TA, AMBIENT TEMPERATURE (°C) Figure 3. Diode Capacitance Figure 4. Leakage Current ORDERING INFORMATION Device MMBV3700LT1 MMBV3700LT1G MPN3700 MPN3700G Package SOT−23 SOT−23 (Pb−Free) TO−92 TO−92 (Pb−Free) Shipping † 3000 / Tape & Reel 3000 / Tape & Reel 1000 Units / Bulk 1000 Units / Bulk †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MMBV3700LT1, MPN3700 PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AN D 3 SEE VIEW C E 1 2 HE c b e q 0.25 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. DIM A A1 b c D E e L L1 HE MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10 MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083 INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094 MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104 A L A1 L1 VIEW C STYLE 8: PIN 1. ANODE 2. NO CONNECTION 3. CATHODE SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.0 0.079 0.9 0.035 SCALE 10:1 0.8 0.031 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 3 MMBV3700LT1, MPN3700 PACKAGE DIMENSIONS TO−92 (TO−226) CASE 182−06 ISSUE AL A B SEATING PLANE R D K L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND ZONE R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES DIM MIN MAX A 0.175 0.205 B 0.170 0.210 C 0.125 0.165 D 0.016 0.021 G 0.050 BSC H 0.100 BSC J 0.014 0.016 K 0.500 −−− L 0.250 −−− N 0.080 0.105 P −−− 0.050 R 0.115 −−− V 0.135 −−− STYLE 1: PIN 1. ANODE 2. CATHODE MILLIMETERS MIN MAX 4.45 5.21 4.32 5.33 3.18 4.19 0.407 0.533 1.27 BSC 2.54 BSC 0.36 0.41 12.70 −−− 6.35 −−− 2.03 2.66 −−− 1.27 2.93 −−− 3.43 −−− XX D G H V C N SECTION X−X 1 2 N ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan : ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 ÉÉ ÉÉ P J MMBV3700LT1/D