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MSD1328-RT1_04

MSD1328-RT1_04

  • 厂商:

    ONSEMI(安森美)

  • 封装:

  • 描述:

    MSD1328-RT1_04 - NPN Low Voltage Output Amplifiers - ON Semiconductor

  • 数据手册
  • 价格&库存
MSD1328-RT1_04 数据手册
MSD1328−RT1, MSD1328−ST1 NPN Low Voltage Output Amplifiers − Surface Mount Features • Pb−Free Packages are Available MAXIMUM RATINGS (TA = 25°C) Rating Collector−Base Voltage Collector−Emitter Voltage Emitter−Base Voltage Collector Current − Continuous Collector Current − Peak Symbol V(BR)CBO V(BR)CEO V(BR)EBO IC IC(P) Value 25 20 12 500 1000 Unit V V V mA mA http://onsemi.com COLLECTOR 3 2 BASE 1 EMITTER THERMAL CHARACTERISTICS Characteristic Power Dissipation Junction Temperature Storage Temperature Symbol PD TJ Tstg Max 200 150 −55 ~ +150 Unit mW °C °C 2 1 3 SC−59 CASE 318D Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. MARKING DIAGRAM ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Collector−Emitter Breakdown Voltage (IC = 1.0 mA, IB = 0) Collector−Base Breakdown Voltage (IC = 10 mA, IE = 0) Emitter−Base Breakdown Voltage (IE = 10 mA, IE = 0) Collector−Base Cutoff Current (VCB = 25 V, IE = 0) DC Current Gain (Note 1) MSD1328−RT1 (VCE = 2.0 V, IC = 500 mA) MSD1328−ST1 Collector−Emitter Saturation Voltage (IC = 500 mA, IB = 20 mA) Base−Emitter Saturation Voltage (IC = 500 mA, IB = 50 mA) Symbol V(BR)CEO V(BR)CBO V(BR)EBO ICBO hFE 200 300 VCE(sat) VBE(sat) − − 350 500 0.4 1.2 V V MSD1328−ST1 MSD1328−ST1G Min 20 25 12 − Max − − − 0.1 Unit V V V 1Mx M x = R for RT1 S for ST1 M = Date Code ORDERING INFORMATION mA − Device MSD1328−RT1 MSD1328−RT1G Package SC−59 SC−59 (Pb−Free) SC−59 SC−59 (Pb−Free) Shipping† 3000 Tape & Reel 3000 Tape & Reel 3000 Tape & Reel 3000 Tape & Reel 1. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2004 1 November, 2004 − Rev. 4 Publication Order Number: MSD1328−RT1/D MSD1328−RT1, MSD1328−ST1 PACKAGE DIMENSIONS SC−59 CASE 318D−04 ISSUE F A L 3 2 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. S B D G C H K J DIM A B C D G H J K L S MILLIMETERS MIN MAX 2.70 3.10 1.30 1.70 1.00 1.30 0.35 0.50 1.70 2.10 0.013 0.100 0.09 0.18 0.20 0.60 1.25 1.65 2.50 3.00 INCHES MIN MAX 0.1063 0.1220 0.0512 0.0669 0.0394 0.0511 0.0138 0.0196 0.0670 0.0826 0.0005 0.0040 0.0034 0.0070 0.0079 0.0236 0.0493 0.0649 0.0985 0.1181 STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.4 0.094 1.0 0.039 0.8 0.031 mm inches SCALE 10:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 2 MSD1328−RT1/D
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