MT9V124
MT9V124 1/13‐Inch
System‐On‐A‐Chip (SOC)
CMOS Digital Image Sensor
www.onsemi.com
GENERAL DESCRIPTION
ON Semiconductor’s MT9V124 is a 1/13-inch CMOS digital image
sensor with an active-pixel array of 648 (H) × 488 (V). It includes
sophisticated camera functions such as auto exposure control, auto
white balance, black level control, flicker detection and avoidance,
and defect correction. It is designed for low light performance. It is
programmable through a simple two-wire serial interface. The
MT9V124 produces extraordinarily clear, sharp digital pictures that
make it the perfect choice for a wide range of medical and industrial
applications.
ODCSP25 2.694 × 2.694
CASE 570BN
Table 1. KEY PARAMETERS
Parameter
ORDERING INFORMATION
Typical Value
See detailed ordering and shipping information on page 2 of
this data sheet.
Optical Format
1/13-inch
Active Pixels
648 × 488 = 0.3 Mp (VGA)
Pixel Size
1.75 μm
Color Filter Array
RGB Bayer
Shutter Type
Electronic Rolling Shutter (ERS)
Input Clock Range
18–44 MHz
Output
LVDS
30 fps
Responsivity
1.65 V/lux × sec
SNRMAX
33.4 dB
Supply Voltage
• Integrated Image Flow Processor (IFP) for
12-bit Packet
Frame Rate, Full Resolution
Dynamic Range
Features (continued)
•
•
58 dB
Analog
2.5–3.1 V
Digital
1.7–1.95 V
Digital I/O
1.7–1.95 V or 2.5–3.1 V
Power Consumption
55 mW
Operating Temperature (Ambient) −TA
–30°C to +70°C
Chief Ray Angle
24°
Package Options
Bare die, CSP
•
•
•
•
•
Features
•
•
•
•
•
Superior Low-light Performance
Ultra-low-power
VGA Video at 30fps
Internal Master Clock Generated by On-chip Phase Locked Loop
(PLL) Oscillator
Electronic Rolling Shutter (ERS), Progressive Scan
© Semiconductor Components Industries, LLC, 2010
June, 2018 − Rev. 6
•
•
1
•
Single-die Camera Module
One-time Programmable Memory (OTPM)
Automatic Image Correction and
Enhancement, Including Four-channel Lens
Shading Correction
Image Scaling with Anti-aliasing
Supports ITU-R BT.656 Format with Odd
Timing Code
Two-wire Serial Interface Providing Access
to Registers and Microcontroller Memory
Selectable Output Data Format: YCbCr,
565RGB, and RAW8+2-bit, BT656
High Speed Serial Data Output in 12-bit
Packet
Independently Configurable Gamma
Correction
Direct XDMA Access
(Reducing Serial Commands)
Integrated Hue Rotation ±22°
Applications
• Medical Tools, Device
• Biometrics
• Industrial Application
Publication Order Number:
MT9V124/D
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
ORDERING INFORMATION
Table 2. AVAILABLE PART NUMBERS
Part Number
Product Description
Orderable Product Attribute Description †
MT9V124D00STCK22DC1−200
RGB color die
Die Sales, 200 μm Thickness
MT9V124EBKSTC−CR
CSP with 400 μm coverglass
Chip Tray without Protective Film
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
FUNCTIONAL DESCRIPTION
See the ON Semiconductor Device Nomenclature
document (TND310/D) for a full description of the naming
convention used for image sensors. For reference
documentation, including information on evaluation kits,
please visit our web site at www.onsemi.com.
ON Semiconductor’s MT9V124 is a 1/13-inch VGA
CMOS digital image sensor with an integrated advanced
camera system. This camera system features a
microcontroller (MCU), a sophisticated image flow
processor (IFP), and a serial port (using LVDS signaling).
The microcontroller manages all functions of the camera
system and sets key operation parameters for the sensor core
to optimize the quality of raw image data entering the IFP.
The sensor core consists of an active pixel array of
648 × 488 pixels with programmable timing and control
circuitry. It also includes an analog signal chain with
automatic offset correction, programmable gain, and a
10-bit analog-to-digital converter (ADC).
The entire system-on-a-chip (SOC) has an ultra-low
power operational mode and a superior low-light
performance that is particularly suitable for medical
applications. The MT9V124 features ON Semiconductor’s
breakthrough low-noise CMOS imaging technology that
achieves near-CCD image quality (based on signal-to-noise
ratio and low-light sensitivity) while maintaining the
inherent size, cost, and integration advantages of CMOS.
Architecture Overview
The MT9V124 combines a VGA sensor core with an IFP
to form a stand-alone solution for both image acquisition
and processing. Both the sensor core and the IFP have
internal registers that can be controlled by the user. In
normal operation, an integrated microcontroller
autonomously controls most aspects of operation. The
processed image data is transmitted to the external host
system through an LVDS bus. Figure 1 shows the major
functional blocks of the MT9V124.
Register Bus
VDD
VPP
VDDIO VAA
CCI Serial
Interface
PLL
RAM ROM
uControroller
F IFO
STANDBY
EXTCLK
Analog
Processing
AGND DGND
ADC
SDATA
SCLOCK
Digital Image
Processing (SOC)
Figure 1. MT9V124 Block Diagram
www.onsemi.com
2
Serializer
Column Control
Column Control
Pixel Array
(648 x 488)
Image Data Bus
LVDS_N
LVDS_P
MT9V124
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
System Control
The MT9V124 has a phase-locked loop (PLL) oscillator
that can generate the internal sensor clock from the common
system clock. The PLL adjusts the incoming clock
frequency up, allowing the MT9V124 to run at almost any
desired resolution and frame rate within the sensor’s
capabilities.
Low-power consumption is a very important requirement
for all components of wireless devices. The MT9V124
provides power-conserving features, including an internal
soft standby mode and a hard standby mode.
A two-wire serial interface bus enables read and write
access to the MT9V124’s internal registers and variables.
The internal registers control the sensor core, the color
pipeline flow, the output interface, auto white balance
(AWB) and auto exposure (AE).
Sensor Core
The MT9V124 has a color image sensor with a Bayer
color filter arrangement and a VGA active-pixel array with
electronic rolling shutter (ERS). The sensor core readout is
10 bits. The sensor core also supports separate analog and
digital gain for all four color channels (R, Gr, Gb, B).
Image Flow Processor (IFP)
The advanced IFP features and flexible programmability
of the MT9V124 can enhance and optimize the image sensor
performance. Built-in optimization algorithms enable the
MT9V124 to operate with factory settings as a fully
automatic and highly adaptable system-on-a-chip (SOC) for
most camera systems.
These algorithms include shading correction, defect
correction, color interpolation, edge detection, color
correction, aperture correction, and image formatting with
cropping and scaling.
Output Interface
The output interface block can select either raw data or
processed data. Image data is provided to the host system by
an LVDS serial interface. The LVDS output port provides
8-bit YCbCr, YUV, 565 RGB, BT656, processed Bayer data
or extended 10-bit Bayer data achieved using 8 + 2 format.
Microcontroller Unit (MCU)
The MCU communicates with all functional blocks by
way of an internal ON Semiconductor proprietary bus
interface. The MCU firmware executes the automatic
control algorithms for exposure and white balance.
www.onsemi.com
3
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
System Interfaces
The MT9V124 provides dedicated signals for digital core
and I/O power domains that can be at different voltages. The
PLL and analog circuitry require clean power sources.
Table 3, “Pin Descriptions,” provides the signal descriptions
for the MT9V124.
Two−wire
serial interface
Active HIGH standby mode
External clock in
(18–44 MHz)
VPP
VDD_IO
RPULL−UP2
Digital
Core
(optimal)
Analog
power
VDD
OTPM
Power
(optimal)
I/O3
Power
SDATA
SCLK
VAA
Figure 2 shows typical MT9V124 device connections.
For low-noise operation, the MT9V124 requires separate
power supplies for analog and digital sections. Both power
supply rails should be decoupled from ground using
capacitors as close as possible to the die.
LVDS_N
Rt
STANDBY
EXTCLK
Serial
interface
140 Ω
LVDS_P
GND, GND_PLL
VDD_IO3, 4
VDD4
AGND
VAA4
Notes: 1. This typical configuration shows only one scenario out of multiple possible variations for this sensor.
2. ON Semiconductor recommends a 1.5 kΩ resistor value for the two-wire serial interface RPULL-UP; however, greater
values may be used for slower transmission speed.
3. All inputs must be configured with VDD_IO.
4. ON Semiconductor recommends that 0.1 μF and 1 μF decoupling capacitors for each power supply are mounted as
close as possible to the module (Low-Z path). Actual values and numbers may vary depending on layout and design
considerations, such as capacitor effective series resistance (ESR), dielectric, or power supply source impedance.
5. LVDS output requires termination resistor (140 Ω) to be placed closely at the sensor side.
Figure 2. Typical Configuration (Connection)
www.onsemi.com
4
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
Signal Descriptions
Table 3. PIN DESCRIPTIONS
MT9V124
Sensor Signal
Name
Module Signal
Name
Ball Number
Type
EXTCLK
EXTCLK
E2
Input
Input clock signal
STANDBY
STBY
A2
Input
Controls sensor’s standby mode, active HIGH
SCLK
SCLK
D4
Input
Two-wire serial interface clock
Two-wire serial interface data
Description
SDATA
SDATA
E4
I/O
LVDS_P
LVDS_P
E1
Output
LVDS positive output
LVDS_N
LVDS_N
D2
Output
LVDS negative output
VDD
VDD
C2, D5
Supply
Digital power (TYP 1.8 V)
VAA, VDD_PLL
VAA
C1
Supply
Analog and PLL power (TYP 2.8 V)
VDD_IO
VDD_IO
C3
Supply
I/O power supply (TYP 1.8 V)
DGND, GND_IO,
GND_PLL
DGND
B3, B5, D1
Supply
Digital, I/O, and PLL ground
AGND
AGND
B1
Supply
Analog ground
VPP
VPP
A1
Supply
OTPM power
DNU
DNU
A3,A4,A5,B2,B4,
C4,C5,D3,E3,E5
1
2
3
4
5
VPP
STDBY
DNU
DNU
DNU
AGND
DNU
GND
DNU
GND
VAA
VDD
VDD_IO
DNU
DNU
GND
LVDS_N
DNU
SCLK
VDD
LVDS_P EXTCLK
DNU
SDATA
DNU
A
B
C
D
E
Figure 3. 25-ball Assignments (Top View)
The hard standby mode is invoked by asserting
STANDBY pin. It then disables all the digital logic within
the image sensor, and only supports being awoken by
de-asserting the STANDBY pin. The soft standby mode is
enabled by a single register access, which then disables the
sensor core and most of the digital logic. However, the
two-wire serial interface is kept alive, which allows the
image sensor to be awoken via a serial register access.
All output signal status during standby are shown in
Table 4.
Power-On Reset
The MT9V124 includes a power-on reset feature that
initiates a reset upon power-up. A soft reset is issued by
writing commands through the two-wire serial interface.
Standby
The MT9V124 supports two different standby modes:
• Hard standby mode
• Soft standby mode
www.onsemi.com
5
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
Table 4. Status of Output Signals During Reset and Standby
Signal
Reset
Post-Reset
Standby
LVDS_P
High−Z
High−Z
High−Z
LVDS_N
High−Z
High−Z
High−Z
core. It includes the VGA active-pixel array. The timing and
control circuitry sequences through the rows of the array,
resetting and then reading each row in turn. In the time
interval between resetting a row and reading that row, the
pixels in the row integrate incident light. The exposure is
controlled by varying the time interval between reset and
readout. Once a row has been selected, the data from each
column is sequenced through an analog signal chain,
including offset correction, gain adjustment, and ADC. The
final stage of sensor core converts the output of the ADC into
10-bit data for each pixel in the array.
The pixel array contains optically active and
light-shielded (dark) pixels. The dark pixels are used to
provide data for the offset-correction algorithms (black level
control).
The sensor core contains a set of control and status
registers that can be used to control many aspects of the
sensor behavior including the frame size, exposure, and gain
setting. These registers are controlled by the MCU firmware
and are also accessible by the host processor through the
two-wire serial interface.
The output from the sensor core is a Bayer pattern;
alternate rows are a sequence of either green and red pixels
or blue and green pixels. The offset and gain stages of the
analog signal chain provide per-color control of the pixel
data.
Module ID
The MT9V124 provides 4 bits of module ID that can be
read by the host processor from register 0x001A[15:12].
The module ID is programmed through the OTPM.
Image Data Output Interface
The High Speed LVDS output port on MT9V124 can
transmit the sensor image data to the host system over a
lengthy differential twisted pair cable.
The MT9V124 provides a serial high-speed output port,
which is able for driving standard IEEE 1596.3−1996 LVDS
receiver/deserializers such as the DS92LV1212A LVDS
Deserializer by National Semiconductor.
Image data is provided to the host system by the serial
LVDS interface. The Start bit, 8-bit image data, LV, FV, and
Stop bit are packetized in a 12-bit packet. The output
interface block can select either raw data or processed data.
Processed data format includes YCbCr, RGB-565, and
BT656 with odd SAV/EAV code. It also supports the SOC
Bypass 8 + 2 data format over the 12-bit packet.
The LVDS port is disabled when Hard Standby or Soft
Standby is asserted.
Sensor Control
The sensor core of the MT9V124 is a progressive-scan
sensor that generates a stream of pixel data at a constant
frame rate. Figure 4 shows a block diagram of the sensor
Control Registers
System Control
Timing
and
Control
VGA
Active−Pixel
Sensor (APS)
Array
Green1/Green2
Channel
Analog
Processing
G1/G2
R/B
ADC
Red/Blue
Channel
Sensor Core
Figure 4. Sensor Core Block Diagram
www.onsemi.com
6
G1/G2
R/B
Digital
Processing
10−Bit
Data Out
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
The sensor core uses a Bayer color pattern, as shown in
Figure 5. The even-numbered rows contain green and red
pixels; odd-numbered rows contain blue and green pixels.
Even-numbered columns contain green and blue pixels;
odd-numbered columns contain red and green pixels.
Column readout direction
First clear
pixel
B Gb B Gb B Gb B Gb B Gb B
Gr R Gr R Gr R Gr R Gr R Gr
B Gb B Gb B Gb B Gb B Gb B
Gr R Gr R Gr R Gr R Gr R Gr
B Gb B Gb B Gb B Gb B Gb B
Row readout
direction
Gr R Gr R Gr R Gr R Gr R Gr
B Gb B Gb B Gb B Gb B Gb B
Gr R Gr R Gr R Gr R Gr R Gr
Black pixels
Figure 5. Pixel Color Pattern Detail
When the image is read out of the sensor, it is read one row
at a time, with the rows and columns sequenced.
The MT9V124 sensor core pixel array is shown with pixel
(0,0) in the bottom right corner, which reflects the actual
layout of the array on the die. Figure 6 shows the image
shown in the sensor during normal operation.
Lens
Scene
Sensor (rear view)
Row
Readout
Order
Column Readout Order
Pixel (0,0)
Figure 6. Imaging a Scene
The sensor core supports different readout options to
modify the image before it is sent to the IFP. The readout can
be limited to a specific window size of the original pixel
array.
By changing the readout order, the image can be mirrored
in the horizontal direction.
The image output size is set by programming row and
column start and end address registers. The edge pixels in the
648 × 488 array are present to avoid edge effects and should
not be included in the visible window.
www.onsemi.com
7
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
When the sensor is configured to mirror the image
horizontally, the order of pixel readout within a row is
reversed, so that readout starts from the last column address
and ends at the first column address. Figure 7 shows a
sequence of 6 pixels being read out with normal readout and
reverse readout. This change in sensor core output is
corrected by the IFP.
LINE_VALID
Normal readout
DOUT [9:0]
G0
(9:0)
R0
(9:0)
G1
(9:0)
R1
(9:0)
G2
(9:0)
R2
(9:0)
R2
(9:0)
G2
(9:0)
R1
(9:0)
G1
(9:0)
R0
(9:0)
G0
(9:0)
Reverse readout
DOUT[9:0]
Figure 7. Six Pixels in Normal and Column Mirror Readout Mode
(Internal Data Format before Serializer)
LINE_VALID
Normal readout
DOUT [9:0]
G0
(9:0)
R0
(9:0)
G1
(9:0)
R1
(9:0)
G0
(9:0)
R0
(9:0)
G2
(9:0)
R2
(9:0)
G2
(9:0)
R2
(9:0)
G3
(9:0)
R3
(9:0)
LINE_VALID
Column skip readout
DOUT[9:0]
Figure 8. Eight Pixels in Normal and Column Skip 2X Readout Mode
(Internal Data Format before Serializer)
Figure 9 through Figure 11 show the different skipping
modes supported in MT9V124.
X incrementing
Y incrementing
Y incrementing
X incrementing
Figure 9. Pixel Readout (no skipping)
Figure 10. Pixel Readout
(x_odd_inc = 3, y_odd_inc = 1)
www.onsemi.com
8
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
Image Flow Processor
operation, the microcontroller automatically adjusts the
operational parameters of the IFP. Figure 11 shows the
image data processing flow within the IFP.
Image control processing in the MT9V124 is
implemented in the IFP hardware logic. The IFP registers
can be programmed by the host processor. For normal
RAW 10
VGA
Pixel Array
ADC
Test Pattern
Raw Data
IFP
Digital
Gain
Control,
Shading
Correction
MUX
Defect Correction,
Nosie Reduction,
Color Interpolation,
Statistics
Engine
8−bit
RGB
RGB to YUV
10/12−Bit
RGB
8-bit
YUV
Color Correction
Color Kill
Scaler
Aperture
Correction
Hue Rotate
Gamma
Correction
(10−to−8 Lookup)
Output
Interface
Output
Formatting
YUV to RGB
TX
FIFO
Serializer
LVDS Output
Figure 11. Image Flow Processor
www.onsemi.com
9
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
For normal operation of the MT9V124, streams of raw
image data from the sensor core are continuously fed into the
color pipeline. The MT9V124 features an automatic color
bar test pattern generation function to emulate sensor images
as shown in Figure 12.
Color bar test pattern generation can be selected by
programming a register.
Example
Test Pattern
REG= 0x8400, 0x15 // SEQ_CMD
REG= 0x8400, 0x16 // SEQ_CMD
REG= 0x8400, 0x17 // SEQ_CMD
REG= 0x8400, 0x18 // SEQ_CMD
REG= 0x8400, 0x19 // SEQ_CMD
Figure 12. Color Bar Test Pattern
www.onsemi.com
10
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
To increase image sharpness, a programmable 2D
aperture correction (sharpening filter) is applied to
color-corrected image data. The gain and threshold for 2D
correction can be defined through variable settings.
Image Corrections
Image stream processing starts with multiplication of all
pixel values by a programmable digital gain. This can be
independently set to separate values for each color channel
(R, Gr, Gb, B). Independent color channel digital gain can
be adjusted with variables.
Lenses tend to produce images whose brightness is
significantly attenuated near the edges. There are also other
factors causing fixed pattern signal gradients in images
captured by image sensors. The cumulative result of all these
factors is known as image shading. The MT9V124 has an
embedded shading correction module that can be
programmed to counter the shading effects on each
individual R, Gb, Gr, and B color signal.
The IFP performs continuous defect correction that can
mask pixel array defects such as high dark-current (hot)
pixels and pixels that are darker or brighter than their
neighbors due to photoresponse nonuniformity. The module
is edge-aware with exposure that is based on configurable
thresholds. The thresholds are changed continuously based
on the brightness of the current scene. Enabling and
disabling noise reduction, and setting thresholds can be
defined through variable settings.
Gamma Correction
The gamma correction curve (as shown in Figure 13) is
implemented as a piecewise linear function with 19 knee
points, taking 12-bit arguments and mapping them to 8-bit
output. The abscissas of the knee points are fixed at 0, 64,
128, 256, 512, 768, 1024, 1280, 1536, 1792, 2048, 2304,
2560, 2816, 3072, 3328, 3584, 3840, and 4096.
The MT9V124 IFP includes a block for gamma correction
that has the capability to adjust its shape, based on
brightness, to enhance the performance under certain
lighting conditions. Two custom gamma correction tables
may be uploaded, one corresponding to a brighter lighting
condition, the other one corresponding to a darker lighting
condition. The final gamma correction table used depends
on the brightness of the scene and can take the form of either
uploaded tables or an interpolated version of the two tables.
A single (non-adjusting) table for all conditions can also be
used.
Gamma Correction
Color Interpolation and Edge Detection
In the raw data stream fed by the sensor core to the IFP,
each pixel is represented by a 10-bit integer, which can be
considered proportional to the pixel’s response to a
one-color light stimulus, red, green, or blue, depending on
the pixel’s position under the color filter array. Initial data
processing steps, up to and including the defect correction,
preserve the one-color-per-pixel nature of the data stream,
but after the defect correction it must be converted to a
three-colors-per-pixel stream appropriate for standard color
processing. The conversion is done by an edge-sensitive
color interpolation module. The module adds the incomplete
color information available for each pixel with information
extracted from an appropriate set of neighboring pixels. The
algorithm used to select this set and extract the information
seeks the best compromise between preserving edges and
filtering out high-frequency noise in flat field areas. The
edge threshold can be set through variable settings.
Output RGB, 8−bit
300
250
200
150
0.45
100
50
0
0
1000
2000
3000
4000
Input RGB, 12−bit
Figure 13. Gamma Correction Curve
Special effects like negative image, sepia, or B/W can be
applied to the data stream at this point. These effects can be
enabled and selected by registers.
To remove high- or low-light color artifacts, a color kill
circuit is included. It affects only pixels whose luminance
exceeds a certain preprogrammed threshold. The U and V
values of those pixels are attenuated proportionally to the
difference between their luminance and the threshold.
Color Correction and Aperture Correction
To achieve good color fidelity of the IFP output,
interpolated RGB values of all pixels are subjected to color
correction. The IFP multiplies each vector of three pixel
colors by a 3 × 3 color correction matrix. The color
correction matrix can either be programmed by the user or
automatically selected by the AWB algorithm implemented
in the IFP. Color correction should ideally produce output
colors that are independent of the spectral sensitivity and
color crosstalk characteristics of the image sensor. The
optimal values of the color correction matrix elements
depend on those sensor characteristics. The color correction
variables can be adjusted through variable settings.
Image Scaling and Cropping
To ensure that the size of images output by the MT9V124
can be tailored to the needs of all users, the IFP includes a
scaler module. When enabled, this module performs
rescaling of incoming images-shrinks them to selected
width and height without reducing the field of view and
without discarding any pixel values. The scaler ratios are
computed from image output size and the FOV. The scaled
www.onsemi.com
11
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
output must not be greater than 352. Output widths greater
than this must not use the scaler.
By configuring the cropped and output windows to
various sizes, different zooming levels for 4X, 2X, and 1X
can be achieved. The height and width definitions for the
output window must be equal to or smaller than the cropped
image. The image cropping and scaler module can be used
together to implement a digital zoom.
Hue Rotate
The MT9V124 has integrated hue rotate. This feature will
help for improving the color image quality and give
customers the flexibility for fine color adjustment and
special color effects.
REG= 0xA00F, 0x00 // CAM_HUE_ANGLE
Figure 14. 05 Hue
REG= 0xA00F, 0xEA // CAM_HUE_ANGLE
Figure 15. −225 Hue
www.onsemi.com
12
MT9V124
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
REG= 0xA00F, 0x16 // CAM_HUE_ANGLE
Figure 16. +225 Hue
Auto Exposure
display in which grey and white surfaces are reproduced
faithfully. This usually means that R,G,B are roughly equal
for these surfaces hence the word “balance”.
The AWB algorithm uses statistics collected from the last
frame to calculate the required B/G and R/G ratios and set
the blue and red analog sensor gains and digital SOC gains
to reproduce the most accurate grey and white surfaces
The AE algorithm performs automatic adjustments of the
image brightness by controlling exposure time, and analog
gains of the sensor core as well as digital gains applied to the
image.
The AE algorithm analyzes image statistics collected by
the exposure measurement engine, and then programs the
sensor core and color pipeline to achieve the desired
exposure. AE uses 4 × 4 exposure statistics windows, which
can be scaled in size to cover any portion of the image.
The MT9V124 uses Average Brightness Tracking
(Average Y), which uses a constant average tracking
algorithm where a target brightness value is compared to a
current brightness value, and the gain and integration time
are adjusted accordingly to meet the target requirement. The
MT9V124 also has a weighted AE algorithm that allows the
sensor to be configured to respond to scene illuminance
based on each of the weights in the windows.
The auto exposure can be configured to respond to scene
illuminance based on certain criteria by adjusting gains and
integration time based on scene brightness.
Flicker Detection and Avoidance
Flicker occurs when the integration time is not an integer
multiple of the period of the light intensity. The automatic
flicker detection module does not compensate for the flicker,
but rather avoids it by detecting the flicker frequency and
adjusting the integration time. For integration times below
the light intensity period (10 ms for 50 Hz environment,
8.33 ms for 60 Hz environment), flicker cannot be avoided.
While this fast flickering is marginally detectable by the
human eye, it is very noticeable in digital images because the
flicker period of the light source is very close to the range of
digital images’ exposure times.
Many CMOS sensors use a “rolling shutter” readout
mechanism that greatly improves sensor data readout times.
This allows pixel data to be read out much sooner than other
methods that wait until the entire exposure is complete
before reading out the first pixel data. The rolling shutter
mechanism exposes a range of pixel rows at a time. This
range of exposed pixels starts at the top of the image and then
“rolls” down to the bottom during the exposure period of the
frame. As each pixel row completes its exposure, it is ready
to be read out. If the light source oscillates (flickers) during
this rolling shutter exposure period, the image appears to
have alternating light and dark horizontal bands.
If the sensor uses the traditional snapshot readout
mechanism, in which all pixels are exposed at the same time
and then the pixel data is read out, then the image may appear
overexposed or underexposed due to light fluctuations from
Auto White Balance
The MT9V124 has a built-in AWB algorithm designed to
compensate for the effects of changing spectra of the scene
illumination on the quality of the color rendition. The
algorithm consists of two major parts: a measurement
engine performing statistical analysis of the image and a
module performing the selection of the optimal color
correction matrix, digital, and sensor core analog gains.
While default settings of these algorithms are adequate in
most situations, the user can reprogram base color correction
matrices and place limits on color channel gains.
The AWB algorithm estimates the dominant color
temperature of a light source in a scene and adjusts the B/G,
R/G gain ratios accordingly to produce an image for sRGB
www.onsemi.com
13
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
the flickering light source. Lights operating on AC electric
systems produce light flickering at a frequency of 100 Hz or
120 Hz, twice the frequency of the power line.
To avoid this flicker effect, the exposure times must be
multiples of the light source flicker periods. For example, in
a scene lit by 120 Hz lighting, the available exposure times
are 8.33 ms, 16.67 ms, 25 ms, 33.33 ms, and so on. (The need
for an exposure time less than 8.33 ms under artificial light
is extremely rare.)
In this case, the AE algorithm must limit the integration
time to an integer multiple of the light’s flicker period.
By default, the MT9V124 does all of this automatically,
ensuring that all exposure times avoid any noticeable light
flicker in the scene. The MT9V124 AE algorithm is always
setting exposure times to be integer multipliers of either 100
Hz or 120 Hz. The flicker detection module keeps
monitoring the incoming frames to detect whether the
scene’s lighting has changed to the other of the two light
source frequencies. A 50 Hz/60 Hz Tungsten lamp can be
used to calibrate the flicker detect settings.
VȀ + 0.713
Y’Cb’Cr’ Using sRGB Formulas:
The MT9V124 implements the sRGB standard. This
option provides YCbCr coefficients for a correct 4:2:2
transmission.
NOTE: 16 < Y601< 235; 16 < Cb < 240; 16 < Cr < 240;
and 0 < = RGB < = 255
YȀ + (0.2126
CbȀ + 0.5389
CrȀ + 0.635
UȀ + 0.564
(BȀ * YȀ) ) 128
BȀ)
(eq. 4)
(BȀ * YȀ)
(RȀ * YȀ)
YȀ + 0.2126
) 128
(eq. 5)
(224ń256) ) 128
(eq. 6)
(224ń256) ) 128
RȀ ) 0.7152
GȀ ) 0.0722
UȀ + 0.5389 (BȀ * YȀ) ) 128 +
+ * 0.1146 RȀ * 0.3854
GȀ ) 0.5
VȀ + 0.635
+ 0.5
BȀ )
(eq. 8)
BȀ ) 128
(RȀ * YȀ) ) 128 +
RȀ * 0.4542
GȀ * 0.0458
(eq. 7)
(eq. 9)
BȀ ) 128
There is an option to disable adding 128 to U’V’. The
reverse transform is as follows:
Y’U’V’:
This conversion is BT 601 scaled to make YUV range
from 0 through 255. This setting is recommended for JPEG
encoding and is the most popular, although it is not well
defined and often misused in various operating systems.
BȀ
GȀ ) 0.0722
Y’U’V’ Using sRGB Formulas:
These are similar to the previous set of formulas, but have
YUV spanning a range of 0 through 255.
Color Conversion Formulas
GȀ ) 0.114
RȀ ) 0.7152
(219ń256) ) 16
The YUV data stream can either exit the color pipeline as
is or be converted before exit to an alternative YUV or RGB
data format.
RȀ ) 0.587
(eq. 3)
There is an option where 128 is not added to U’V’.
Output Conversion and Formatting
YȀ + 0.299
(RȀ * YȀ) ) 128
(eq. 1)
RȀ + Y ) 1.5748
(V * 128)
GȀ + Y * 0.1873
(U * 128) * 0.4681
BȀ + Y ) 1.8556
(U * 128)
(eq. 10)
(V * 128) (eq. 11)
(eq. 12)
Uncompressed YUV/RGB Data Ordering
The MT9V124 supports swapping YCbCr mode, as
illustrated in Table 5.
(eq. 2)
Table 5. YCbCr OUTPUT DATA ORDERING
Mode
Data Sequence
Default (no Swap)
Cbi
Yi
Cri
Yi+1
Swapped CrCb
Cri
Yi
Cbi
Yi+1
Swapped YC
Yi
Cbi
Yi+1
Cri
Swapped CrCb, YC
Yi
Cri
Yi+1
Cbi
The RGB output data ordering in default mode is shown
in Table 6. The odd and even bytes are swapped when
luma/chroma swap is enabled. R and B channels are bitwise
swapped when chroma swap is enabled.
Table 6. RGB ORDERING IN DEFAULT MODE
Mode (Swap Disabled)
Byte
D7 D6 D5 D4 D3 D2 D1 D0
565RGB
Odd
R7 R6 R5 R4 R3 G 7 G 6 G 5
Even
G4G3G2B7B6B5B4B3
www.onsemi.com
14
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
Uncompressed 10-Bit Bypass Output
Raw 10-bit Bayer data from the sensor core can be output
in bypass mode by using DOUT[7:0] with a special 8 + 2 data
format, shown in Table 7.
Table 7. 2-BYTE BAYER FORMAT
Byte
Bits Used
Bit Sequence
Odd Bytes
8 Data Bits
D9 D8 D7 D6 D5 D4 D3 D2
Even Bytes
2 Data Bits + 6 Unused Bits
0 0 0 0 0 0 D1D0
progressive data and not interlaced (R0x3C00[5] = 1).
Figure 17 depicts the data format before the serializer
internal to the device, or after the external deserializer.
BT656
YUV data can also be output in BT656 format with only
Odd field SAV/EAV codes. The BT656 data output will be
Data[7:0]
80 10 80 10 80 10 80 10 FF 00 00 80 Cb Y Cr Y
Blanking
H Blank
SAV
Cb Y Cr Y FF 00 00 9D 80 10 80 10
Image
80 10 80 10 FF 00 00 80 Cb Y Cr Y
Blanking
H Blank
Active Video
EAV
SAV
Cb Y Cr Y FF 00 00 B6 80 10 80 10
Image
EAV
Blanking
H Blank
Figure 17. BT656 Image Data with Odd SAV/EAV Codes
REGISTER AND VARIABLE DESCRIPTION
To change internal registers and RAM variables of
MT9V124, use the two-wire serial interface through the
external host device.
The sequencer is responsible for coordinating all events
triggered by the user.
The sequencer provides the high-level control of the
MT9V124. Commands are written to the command variable
to start streaming, stop streaming, and to select test pattern
modes. Command execution is confirmed by reading back
the command variable with a value of zero. The sequencer
state variable can also be checked for transition to the
desired state. All configuration of the sensor (start/stop
row/column, mirror, skipping) and the SOC (image size,
format) and automatic algorithms for AE, AWB, low light,
are performed when the sequencer is in the stopped state.
When the sequencer is in the idle or test pattern state the
algorithms and register updates are not performed, allowing
the host complete manual control
Table 8. SUMMARY OF MT9V124 VARIABLES
Name
Monitor Variables
General Information
Sequencer Variables
Programming Control Interface
FD Variables
Flicker Detect
AE_Track Variables
Auto Exposure
AWB Variables
Auto White Balance
Stat Variables
Statistics
Low Light Variables
Low Light
Cam Variables
Sensor Specific Settings
www.onsemi.com
15
Variable Description
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
SERIAL LOW VOLTAGE DIFFERENTIAL SIGNALING (LVDS) OUTPUT
be transported via a lengthy (several meters) twisted pair
The MT9V124 provides a serial high-speed output port
cable.
which supports all the data formats. MT9V124 is intended
The LVDS output requires a differential termination
to drive standard IEEE 1596.3−1996 LVDS
resistor (Rtx_term = 140 Ω ±1%) that must be provided
receiver/deserializers. The internal serializer transforms the
off-chip and close to the LVDS pins.
parallel data into serial in a 12-bit packet, allowing the data
100 Ω
140 Ω±1%
100 Ω twisted-pair
LVDS
DRIVER
LVDS
RECEIVER
Figure 18. LVDS Typical Serial Interface
LVDS Data Packet Format
Table 9 describes the LVDS packet format; Figure 19
shows the LVDS data timing.
The LVDS output is the standard 12-bit package with start
bit, 10-bit payload and stop bit supported by many off the
shelf deserializers.
Table 9. LVDS PACKET FORMAT
12-Bit Packet
Data Format
Bit[0]
START BIT “1”
Bit[1]
PixelData[0]
Bit[2]
PixelData[1]
Bit[3]
PixelData[2]
Bit[4]
PixelData[3]
Bit[5]
PixelData[4]
Bit[6]
PixelData[5]
Bit[7]
PixelData[6]
Bit[8]
PixelData[7]
Bit[9]
LINEVALID (LV)
Bit[10]
FRAMEVALID (FV)
Bit[11]
STOP BIT “0”
Internal Shift Clock
LVDS Serial Out
START
(0)
D0
D1
D2
D3
D4
D5
D6
tDW
Figure 19. LVDS Serial Output Timing
www.onsemi.com
16
D7
LV
FV
STOP
(0)
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
Table 10. LVDS SERIAL OUTPUT DATA TIMING (FOR EXTCLK = 22 MHz)
Name
Min
Typical
Max
Unit
tDW
3.78
3.78
4.629
nS
1/tDW
216
264
264
Mbps
Table 11. EXTCLK INPUT RANGE
Name
Min
Typical
Max
Unit
EXTCLK
18
22
44
MHz
If EXTCLK is greater than 22 MHz, the PLL must be set
to obtain an equivalent internal pixel clock to 22 MHz. The
internal pixel clock is multiplied by 12 to achieve the
serializer output frequency of maximum 264 MHz.
TWO-WIRE SERIAL INTERFACE
The two-wire serial interface bus enables read and write
access to control and status registers within the MT9V124.
The interface protocol uses a master/slave model in which
a master controls one or more slave devices. The MT9V124
always operates in slave mode. The host (master) generates
a clock (SCLK) that is an input to the MT9V124 and is used
to synchronize transfers. Data is transferred between the
master and the slave on a bidirectional signal (SDATA).
change when SCLK is LOW and must be stable while SCLK
is HIGH.
MT9V124 Slave Address
Bits [7:1] of this byte represent the device slave address
and bit [0] indicates the data transfer direction. A “0” in bit
[0] indicates a WRITE, and a “1” indicates a READ. The
slave address default is 0x7A.
Messages
Message bytes are used for sending MT9V124 internal
register addresses and data. The host should always use
16-bit address (two bytes) and 16-bit data to access internal
registers. Refer to READ and WRITE cycles in Figure 20
through Figure 24.
Each 8-bit data transfer is followed by an acknowledge bit
or a no-acknowledge bit in the SCLK clock period following
the data transfer. The transmitter (which is the master when
writing, or the slave when reading) releases SDATA. The
receiver indicates an acknowledge bit by driving SDATA
LOW. For data transfers, SDATA can change when SCLK is
LOW and must be stable while SCLK is HIGH.
The no-acknowledge bit is generated when the receiver
does not drive SDATA low during the SCLK clock period
following a data transfer. A no-acknowledge bit is used to
terminate a read sequence.
Protocol
Data transfers on the two-wire serial interface bus are
performed by a sequence of low-level protocol elements, as
follows:
1. a (repeated) start condition
2. a slave address/data direction byte
3. a 16-bit register address
(8-bit addresses are not supported)
4. an (a no) acknowledge bit
5. a 16-bit data transfer
(8-bit data transfers are supported using XDMA
byte access)
6. a stop condition
The bus is idle when both SCLK and SDATA are HIGH.
Control of the bus is initiated with a start condition, and the
bus is released with a stop condition. Only the master can
generate the start and stop conditions.
A start condition is defined as a HIGH-to-LOW transition
on SDATA while SCLK is HIGH.
At the end of a transfer, the master can generate a start
condition without previously generating a stop condition;
this is known as a repeated start or restart condition.
A stop condition is defined as a LOW-to-HIGH transition
on SDATA while SCLK is HIGH.
Data is transferred serially, 8 bits at a time, with the most
significant bit (MSB) transmitted first. Each byte of data is
followed by an acknowledge bit or a no-acknowledge bit.
This data transfer mechanism is used for the slave
address/data direction byte and for message bytes. One data
bit is transferred during each SCLK clock period. SDATA can
Typical Operation
A typical READ or WRITE sequence begins by the
master generating a start condition on the bus. After the start
condition, the master sends the 8-bit slave address/data
direction byte. The last bit indicates whether the request is
for a READ or a WRITE, where a “0” indicates a WRITE
and a “1” indicates a READ. If the address matches the
address of the slave device, the slave device acknowledges
receipt of the address by generating an acknowledge bit on
the bus.
If the request was a WRITE, the master then transfers the
16-bit register address to which a WRITE will take place.
This transfer takes place as two 8-bit sequences and the slave
www.onsemi.com
17
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
register data, 8 bits at a time. The master generates an
acknowledge bit after each 8-bit transfer. The data transfer
is stopped when the master sends a no-acknowledge bit.
sends an acknowledge bit after each sequence to indicate
that the byte has been received. The master will then transfer
the 16-bit data, as two 8-bit sequences and the slave sends an
acknowledge bit after each sequence to indicate that the byte
has been received. The master stops writing by generating
a (re)start or stop condition. If the request was a READ, the
master sends the 8-bit write slave address/data direction byte
and 16-bit register address, just as in the WRITE request.
The master then generates a (re)start condition and the 8-bit
read slave address/data direction byte, and clocks out the
Single READ from Random Location
Figure 20 shows the typical READ cycle of the host to
MT9V124. The first 2 bytes sent by the host are an internal
16-bit register address. The following 2-byte READ cycle
sends the contents of the registers to host.
Previous Reg Address, N
S
Slave
Address
0 A
S = Start Condition
P = Stop Condition
Sr = Restart Condition
A = Acknowledge
A = No-acknowledge
Reg
Address[15:8]
Reg Address, M
Reg
Address[7:0]
A
A Sr
1 A
Slave Address
M+1
A
Read Data
P
Slave to Master
Master to Slave
Figure 20. Single READ from Random Location
Single READ from Current Location
Figure 21 shows the single READ cycle without writing
the address. The internal address will use the previous
address value written to the register.
Previous Reg Address, N
S Slave Address 1 A
N+1
Read Data
A
N+2
Read Data
A
N+L−1
Read Data
A
Read Data
N+L
A
P
Figure 21. Single Read from Current Location
Sequential READ, Start from Random Location
has been transferred, the master generates an acknowledge
bit and continues to perform byte READs until “L” bytes
have been read.
This sequence (Figure 22) starts in the same way as the
single READ from random location (Figure 20). Instead of
generating a no-acknowledge bit after the first byte of data
Previous Reg Address, N
S
Slave Address
0 A Reg Address[15:8]
M+1
Read Data
A Reg Address[7:0]
M+2
A
Read Data
Reg Address, M
M+3
A Sr
Slave Address
M+L−2
A
Read Data
1 A
M+L−1
A
Read Data
Figure 22. Sequential READ, Start from Random Location
www.onsemi.com
18
M+1
Read Data
M+L
A S
A
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
Sequential READ, Start from Current Location
has been transferred, the master generates an acknowledge
bit and continues to perform byte reads until “L” bytes have
been read.
This sequence (Figure 23) starts in the same way as the
single READ from current location (Figure 21). Instead of
generating a no-acknowledge bit after the first byte of data
Previous Reg Address, N
S Slave Address 1 A
N+1
Read Data
A
N+2
Read Data
A
N+L−1
Read Data
A
N+L
Read Data
A
S
Figure 23. Sequential READ, Start from Current Location
of the internal registers with most-significant byte first. The
following 2 bytes indicate the 16-bit data.
Single Write to Random Location
Figure 24 shows the typical WRITE cycle from the host
to the MT9V124. The first 2 bytes indicate a 16-bit address
Previous Reg Address, N
S
Slave Address
0 A
Reg Address[15:8]
Reg Address, M
A
A
Reg Address[7:0]
M+1
A
A
Write Data
P
Figure 24. Single WRITE to Random Location
Sequential WRITE, Start at Random Location
has been transferred, the master generates an acknowledge
bit and continues to perform byte writes until “L” bytes have
been written. The WRITE is terminated by the master
generating a stop condition.
This sequence (Figure 25) starts in the same way as the
single WRITE to random location (Figure 24). Instead of
generating a no-acknowledge bit after the first byte of data
Previous Reg Address, N
S
Slave Address
0 A
M+1
Write Data
Reg Address[15:8]
A
M+2
A
Write Data
Reg Address, M
Reg Address[7:0]
M+3
A
Write Data
M+L−2
A
Write Data
M+1
A
M+L−1
A
Write Data
M+L
A
A
S
Figure 25. Sequential WRITE, Start at Random Location
One-Time Programming Memory (OTPM)
The MT9V124 has one-time programmable memory
(OTPM) for supporting defect correction, module ID, and
other customer-related information. There are 2784 bits of
OTPM available for features such as Lens Shading
Correction, Color Correction Matrix, White Balance
Weight, and user-defined information. The OTPM
programming requires the data to be first placed in OTPM
buffer and the presence of VPP. The proper procedure and
timing must be followed.
www.onsemi.com
19
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
SPECTRAL CHARACTERISTICS
Image Height
(%)
CRA vs. Image Height Plot
30
28
CRA
(deg)
0
0
0
5
0.035
1.23
10
0.070
2.46
15
0.105
3.70
24
20
0.140
4.94
20
25
0.175
6.18
20
30
0.210
7.43
18
35
0.245
8.67
16
40
0.280
9.90
45
0.315
11.13
50
0.350
12.36
55
0.385
13.57
60
0.420
14.77
8
65
0.455
15.97
6
70
0.490
17.14
4
75
0.525
18.31
2
80
0.560
19.45
85
0.595
20.58
90
0.630
21.69
95
0.665
22.77
100
0.700
23.83
14
12
10
0
10
0
20
30
40
50
60
70
Image Height (%)
80
90
100
110
Figure 26. Chief Ray Angle (CRA) vs. Image Height
50
40
Quantum Efficiency (%)
CRA (deg)
26
(mm)
30
20
10
0
350
400
450
500
550
600
Wavelength (nm)
Figure 27. Quantum Efficiency
www.onsemi.com
20
650
700
750
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
ELECTRICAL SPECIFICATIONS
Table 12. ABSOLUTE MAXIMUM RATINGS
Rating
Min
Max
Unit
Core Digital Voltage
–0.3
2.4
V
I/O Digital Voltage
–0.3
4.0
V
Symbol
VDD
VDD_IO
VAA
Parameter
Analog Voltage
–0.3
4.0
V
VAA_PIX
Pixel Supply Voltage
–0.3
4.0
V
VPP
OTPM Power Supply
7.5
9.5
V
VIN
Input Voltage
–0.3
VDD_IO + 0.3
V
TOP
Operating Temperature (Measure at Junction)
–30
70
°C
Storage Temperature
–40
85
°C
TSTG (Note 1)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the product
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Table 13. OPERATING CONDITIONS
Symbol
Min
Typ
Max
Units
Core Digital Voltage
1.7
1.8
1.95
V
I/O Digital Voltage
2.5
2.8
3.1
V
1.7
1.8
1.95
V
Analog Voltage
2.5
2.8
3.1
V
VAA_PIX
Pixel Supply Voltage
2.5
2.8
3.1
V
VDD_PLL
PLL Supply Voltage
2.5
2.8
3.1
V
OTPM Power Supply
8.5
8.5
9
V
Operating Temperature (at Junction)
–30
55
70
°C
VDD
VDD_IO
VAA
VPP
TJ
Parameter
Table 14. DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VIH
Condition
Min
Max
Unit
Input HIGH Voltage
0.7 * VDD_IO
VDD_IO + 0.5
V
VIL
Input LOW Voltage
–0.3
0.3 * VDD_IO
V
IIN
Input Leakage Current
VIN = 0V or VIN = VDD_IO
10
μA
VOH
Output HIGH Voltage
VDD_IO = 1.8 V, IOH = 2 mA
1.7
–
V
VDD_IO = 1.8 V, IOH = 4 mA
1.6
–
V
VDD_IO = 1.8 V, IOH = 8 mA
1.4
–
V
VDD_IO = 2.8 V, IOH = 2 mA
2.7
–
V
VDD_IO = 2.8 V, IOH = 4 mA
2.6
–
V
VDD_IO = 2.8 V, IOH = 8 mA
2.5
–
V
www.onsemi.com
21
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
Table 14. DC ELECTRICAL CHARACTERISTICS (continued)
Symbol
Parameter
Condition
Min
Max
Unit
VOL
Output LOW Voltage
VDD_IO = 1.8 V, IOH = 2 mA
–
0.1
V
VDD_IO = 1.8 V, IOH = 4 mA
–
0.2
V
VDD_IO = 1.8 V, IOH = 8 mA
–
0.4
V
VDD_IO = 2.8 V, IOH = 2 mA
–
0.1
V
VDD_IO = 2.8 V, IOH = 4 mA
–
0.2
V
VDD_IO = 2.8 V, IOH = 8 mA
–
0.4
V
Table 15. OPERATING/STANDBY CURRENT CONSUMPTION
(fEXTCLK = 44 MHz; voltages = Typ or Max; TJ = Typ or Max; excludes VDD_IO current)
Parameter
Symbol
Condition
Typ
Unit
IDD
Digital Operating Current
9.5
mA
IDD
Digital Operating Current
9.5
mA
IAA
Analog Operating Current
7
mA
PLL Supply Current
5
mA
Total Supply Current
21.5
mA
Total Power Consumption
55
mW
Total Standby Current when Asserting the
STANDBY Signal
19
μA
IDD_PLL
Hard Standby
Standby Power
Soft Standby
(Clock On)
fEXTCLK
Total Standby Current
= 44 MHz,
Soft standby mode
Standby Power
Soft Standby
(Clock Off)
Total Standby Current
Soft Standby Mode
Standby Power
44
μW
1.67
mA
3.016
mW
19
μA
44.2
μW
Table 16. LVDS OUTPUT PORT DC SPECIFICATIONS
Parameter
Symbol
Conditions
Min
Typ
Max
Units
1650
mV
Output Voltage High
Voh
Output Voltage Low
Vol
850
Differential Output Voltage
Vod
280
360
460
mV
Output Offset Voltage
Vos
1000
1192
1400
mV
Single-ended Output Resistance
See text
250
Ω
ΔRo
12
%
Δρ
8
%
Differential Output Mismatch
ΔVod
6
mV
Offset Voltage Mismatch
ΔVos
30
mV
Isa, Isb
17
mA
Isab
10
mA
Ivddio
8
mA
53
5
Output Resistance Mismatch
Reflection Coefficient Mismatch
Output Short-circuit Current
Output Short-circuit Current
Standing Power-supply Current
Ro
150
mV
See text
clock
250 MHz;
Cload = 6pF
Differential Signal Rise Time
tr
Cload = 6pF
360
ps
Differential Signal Fall Time
tf
Cload = 6pF
360
ps
Clock Signal Duty Cycle
www.onsemi.com
22
48
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
Table 16. LVDS OUTPUT PORT DC SPECIFICATIONS (continued)
Parameter
Symbol
Conditions
tp
Cload = 6pF
tskew
Cload = 6pF
Propagation Delay
Differential Skew
Min
Typ
Max
Units
2.5
ns
πΩ
Table 17. TWO-WIRE SERIAL INTERFACE TIMING DATA
(fEXTCLK = 22 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V)
Standard-Mode
Fast-Mode
Symbol
Min
Max
Min
Max
Unit
fSCL
0
100
0
400
KHz
tHD;STA
4.0
−
0.6
−
μS
LOW Period of the SCLK Clock
tLOW
4.7
−
1.3
−
μS
HIGH Period of the SCLK Clock
tHIGH
4.0
−
0.6
−
μS
tSU;STA
4.7
−
0.6
−
μS
tHD;DAT
0
(Note 4)
3.45
(Note 5)
0
(Note 6)
0.9
(Note 5)
μS
tSU;DAT
250
−
100 (Note 6)
−
nS
tr
−
1000
20 + 0.1Cb
(Note 7)
300
nS
tf
−
300
20 + 0.1Cb
(Note 7)
300
nS
tSU;STO
4.0
−
0.6
−
μS
tBUF
4.7
−
1.3
−
μS
Cb
−
400
−
400
pF
CIN_SI
−
3.3
−
3.3
pF
CLOAD_SD
−
30
−
30
pF
RSD
1.5
4.7
1.5
4.7
KΩ
Parameter
SCLK Clock Frequency
Hold Time (repeated) START Condition.
After this Period, the First Clock Pulse is Generated
Set-up Time for a Repeated START Condition
Data Hold Time
Data Set-up Time
Rise Time of Both SDATA and SCLK Signals
Fall Time of Both SDATA and SCLK Signals
Set-up Time for STOP Condition
Bus Free Time between a STOP and START Condition
Capacitive Load for Each Bus Line
Serial Interface Input Pin Capacitance
SDATA Max Load Capacitance
SDATA Pull-up Resistor
This table is based on I2C standard (v2.1 January 2000). On Semiconductor
Two-wire control is I2C−compatible
All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXCLK = 22 MHz
A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK.
The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal
A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This
will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW period
of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode
I2C-bus specification) before the SCLK line is released
7. Cb = total capacitance of one bus line in pF
1.
2.
3.
4.
5.
6.
www.onsemi.com
23
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
Write Sequence
t SDS
t SRTS
t SCLK
t SRTH
t STPS
t SHAW
t STPH
t AHSW
t SDH
SCLK
SDATA
Write Start
Write
Address
Bit 7
Write
Address
Bit 0
Read Sequence
Register
Value
Bit 7
Ack
Register
Value
Bit 0
t SDSR
t SHAR
t AHSR
t SDHR
SCLK
SDATA
Read Start
Read
Address
Bit 7
Read
Address
Bit 0
Ack
Register
Value
Bit 7
Figure 28. Two-Wire Serial Bus Timing Parameters
www.onsemi.com
24
Register
Value
Bit 0
Ack
Stop
CONFIDENTIAL AND PROPRIETARY
NOT FOR PUBLIC RELEASE
MT9V124
POWER SEQUENCE
Powering up the sensor requires the supply rails to be
applied in a particular order to ensure sensor start up in a
normal operation and prevent undesired condition such as
latch up from happening. Refer to Figure 29 and Table 18
for detailed timing requirement.
V DD
t1
VAA , VDD_IO, VDD_PHY
t2
EXTCLK
t3
Internal POR
t4
SCLK
SDATA
Figure 29. Power-Up Sequence
Table 18. POWER UP SIGNAL TIMING
Symbol
Parameter
Min
Typ
Max
Unit
t1
Delay from VDD to VAA and VDD_IO
0
–
500
ms
t2
EXTCLK Activation
t1
100
−
ms
t3
Internal POR Duration
70
−
–
EXTCLKs
t4
I2C
50
−
−
EXTCLKs
First
Write
www.onsemi.com
25
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ODCSP25 2.694x2.694
CASE 570BN
ISSUE A
DATE 17 AUG 2017
DOCUMENT NUMBER:
STATUS:
98AON94075F
ON SEMICONDUCTOR STANDARD
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
ODCSP25 2.694x2.694
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON94075F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM APTINA POD# SOC390 TO ON SEMICONDUCTOR. REQ. BY D. TRUHITTE.
30 DEC 2014
A
ADDED MISSING PACKAGE DRAWING. REQ. BY M. FORBIS.
17 AUG 2017
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2017
August, 2017 − Rev. A
Case Outline Number:
570BN
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
◊
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
工商网监
湘ICP备2023018690号
