MUR260
Preferred Device
SWITCHMODEt
Power Rectifier
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
•
•
•
•
•
•
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Ultrafast 50 Nanosecond Recovery Times
175°C Operating Junction Temperature
Low Forward Voltage
Low Leakage Current
High Temperature Glass Passivated Junction
These are Pb−Free Devices*
ULTRAFAST RECTIFIER
2.0 AMPERES, 600 VOLTS
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Shipped in Plastic Bags; 1,000 per Bag
Available Tape and Reel; 5,000 per Reel, by Adding a “RL’’ Suffix to
the Part Number
PLASTIC
AXIAL LEAD
CASE 59
MARKING DIAGRAM
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
600
−
V
Average Rectified Forward Current (Note 1)
(Square Wave Mounting Method #3 Per Note 3)
IF(AV)
2.0 @
TA = 60°C
A
Non-Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
IFSM
35
A
TJ, Tstg
−65 to
+175
°C
Operating Junction Temperature and Storage
Temperature Range
A
MUR260
YYWW G
G
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
THERMAL CHARACTERISTICS
Characteristics
Maximum Thermal Resistance,
Junction−to−Ambient
Symbol
Value
Unit
RqJA
See
Note 3
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 4
1
Package
Shipping †
MUR260
Axial Lead**
1000 Units/Bag
MUR260G
Axial Lead**
1000 Units/Bag
MUR260RL
Axial Lead**
5000/Tape & Reel
MUR260RLG
Axial Lead**
5000/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
**This package is inherently Pb−Free.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MUR260/D
MUR260
ELECTRICAL CHARACTERISTICS
Characteristics
Symbol
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 2.0 Amp, TJ = 150°C)
(IF = 2.0 Amp, TJ = 25°C)
vF
Maximum Instantaneous Reverse Current (Note 2)
(Rated dc Voltage, TJ = 150°C)
(Rated dc Voltage, TJ = 25°C)
iR
Maximum Reverse Recovery Time
(IF = 1.0 Amp, di/dt = 50 Amp/ms)
(IF = 0.5 Amp, IR = 1.0 Amp, IREC = 0.25 A)
trr
Maximum Forward Recovery Time
(IF = 1.0 A, di/dt = 100 A/ms, IREC to 1.0 V)
tfr
Value
Unit
V
1.15
1.35
mA
150
5.0
ns
75
50
50
ns
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
10
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
I F , INSTANTANEOUS FORWARD CURRENT (AMPS)
10
VF @ 150°C
1.0
VF @ 150°C
1.0
125°C
125°C
75°C
75°C
25°C
25°C
0.1
0.1
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
0.5
0.7
0.9
1.1
1.3
1.5
1.7
VF, INSTANTANEOUS VOLTAGE (VOLTS)
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Maximum Forward Voltage
Figure 2. Typical Forward Voltage
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2
1.9
2.1
MUR260
100
100
IR @ 150°C
IR, REVERSE CURRENT (m A)
IR, REVERSE CURRENT (m A)
TJ = 150°C
125°C
75°C
10
1.0
25°C
0.1
10
125°C
1.0
75°C
0.1
25°C
0.01
0.001
0
20
40
60
80
100
120
140
160
180
200
0
75
150
PF(AV), AVERAGE POWER DISSIPATION (WATTS)
3.0
dc
1.0
SQUARE WAVE
50
100
450
525
150
200
SQUARE WAVE
dc
2.0
1.0
0
0.5
0
1.0
1.5
2.0
2.5
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Power Dissipation
50
TJ = 25°C
30
20
10
7.0
5.0
0
10
600
3.0
TA, AMBIENT TEMPERATURE (°C)
C, CAPACITANCE (pF)
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
4.0
0
375
Figure 4. Typical Reverse Current
5.0
0
300
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Maximum Reverse Current
2.0
225
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Typical Capacitance
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3
50
3.0
MUR260
NOTE 3 — AMBIENT MOUNTING DATA
Data shown for thermal resistance, junction−to−ambient
(RqJA) for the mountings shown is to be used as typical
guideline values for preliminary engineering or in case the
tie point temperature cannot be measured.
TYPICAL VALUES FOR RqJA IN STILL AIR
Lead
1/8
52
67
Mounting
Method
1
2
RqJA
3
Length, L
1/4
1/2
65
72
80
87
Units
°C/W
°C/W
50
°C/W
MOUNTING METHOD 1
L
L
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
MOUNTING METHOD 2
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
L
L
Vector Pin Mounting
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
MOUNTING METHOD 3
L = 3/8 ″
Board Ground Plane
P.C. Board with
1−1/2 ″ X 1−1/2″ Copper Surface
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 59−10
ISSUE U
DATE 15 FEB 2005
B
K
STYLE 1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. ALL RULES AND NOTES ASSOCIATED WITH
JEDEC DO−41 OUTLINE SHALL APPLY
4. POLARITY DENOTED BY CATHODE BAND.
5. LEAD DIAMETER NOT CONTROLLED WITHIN F
DIMENSION.
D
STYLE 2
F
A
SCALE 1:1
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
F
K
DIM
A
B
D
F
K
INCHES
MIN
MAX
0.161 0.205
0.079 0.106
0.028 0.034
−−− 0.050
1.000
−−−
MILLIMETERS
MIN
MAX
4.10
5.20
2.00
2.70
0.71
0.86
−−−
1.27
25.40
−−−
GENERIC
MARKING DIAGRAM*
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
STYLE 2:
NO POLARITY
A
xxx
xxx
YYWW
STYLE 1
xxx
A
YY
WW
A
xxx
xxx
YYWW
STYLE 2
= Specific Device Code
= Assembly Location
= Year
= Work Week
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42045B
AXIAL LEAD
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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