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MUR3020WT

MUR3020WT

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO247

  • 描述:

    DIODE ARRAY GP 200V 15A TO247AC

  • 数据手册
  • 价格&库存
MUR3020WT 数据手册
MUR3020WTG, MUR3040WTG, MUR3060WTG Switch Mode Power Rectifiers http://onsemi.com These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features • • • • • • • • • • Ultrafast 35 and 60 Nanosecond Recovery Time 175°C Operating Junction Temperature Popular TO−247 Package High Voltage Capability to 600 V Low Forward Drop Low Leakage Specified @ 150°C Case Temperature Current Derating Specified @ Both Case and Ambient Temperatures Epoxy Meets UL 94 V−0 @ 0.125 in High Temperature Glass Passivated Junction These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* ULTRAFAST RECTIFIERS 30 AMPERES, 200−600 VOLTS 1 2, 4 3 1 2 TO−247 CASE 340AL 3 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 4.3 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads MARKING DIAGRAM are Readily Solderable • Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped 30 Units Per Plastic Tube MUR30x0WT AYWWG MUR30x0WT = Device Code x = 2, 4 or 6 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2014 July, 2014 − Rev. 7 1 Device Package Shipping MUR3020WTG TO−247 (Pb−Free) 30 Units/Rail MUR3040WTG TO−247 (Pb−Free) 30 Units/Rail MUR3060WTG TO−247 (Pb−Free) 30 Units/Rail Publication Order Number: MUR3020WT/D MUR3020WTG, MUR3040WTG, MUR3060WTG MAXIMUM RATINGS (Per Leg) Rating Symbol MUR3020WT MUR3040WT MUR3060WT Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 400 600 V Average Rectified Forward Current @ 145°C Total Device IF(AV) 15 30 A Peak Repetitive Surge Current (Rated VR, Square Wave, 20 kHz, TC = 145°C) IFM 30 A Nonrepetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) IFSM Operating Junction and Storage Temperature 200 TJ, Tstg 150 150 A °C − 65 to +175 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS (Per Leg) Rating Symbol MUR3020WT MUR3040WT MUR3060WT Unit °C/W Maximum Thermal Resistance, − Junction−to−Case − Junction−to−Ambient 1.5 40 RqJC RqJA ELECTRICAL CHARACTERISTICS (Per Leg) Rating Symbol MUR3020WT MUR3040WT MUR3060WT 0.85 1.05 1.12 1.25 1.4 1.7 500 10 500 10 1000 10 trr 35 60 60 IRM 0.7 Maximum Instantaneous Forward Voltage (Note 1) (IF = 15 Amp, TC = 150°C) (IF = 15 Amp, TC = 25°C) VF Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TJ = 150°C) (Rated DC Voltage, TJ = 25°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 Amps/ms) Typical Peak Reverse Recovery Current (IF = 1.0 A, di/dt = 50 A/ms) Unit V mA ns A Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. http://onsemi.com 2 MUR3020WTG, MUR3040WTG, MUR3060WTG MUR3020WT TJ = 150°C 100 100°C IR , REVERSE CURRENT ( μ A) 100 25°C 50 30 10 100°C 2 1 0.5 25°C 0.2 0.1 0.05 0.02 0.01 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 5 3 0 1 0.5 0.3 0.2 0.1 0.2 0.4 0.6 0.8 1 1.2 vF, INSTANTANEOUS VOLTAGE (VOLTS) 1.4 1.6 14 dc 12 10 SQUARE WAVE 8 6 4 RATED VOLTAGE APPLIED 2 0 140 RqJA = 15°C/W AS OBTAINED USING A SMALL FINNED HEAT SINK. 10 SQUARE WAVE dc 4 SQUARE WAVE 2 RqJA = 40°C/W AS OBTAINED IN FREE AIR WITH NO HEAT SINK. 0 0 20 40 60 80 100 120 140 160 TA, AMBIENT TEMPERATURE (5C) 180 200 P F(AV) , AVERAGE POWER DISSIPATION (WATTS) I F(AV) , AVERAGE FORWARD CURRENT (AMPS) dc 12 150 160 170 TC, CASE TEMPERATURE (5C) 180 Figure 3. Current Derating, Case (Per Leg) 14 6 40 16 Figure 1. Typical Forward Voltage (Per Leg) 8 20 Figure 2. Typical Reverse Current (Per Leg)* 2 I F(AV) , AVERAGE FORWARD CURRENT (AMPS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 20 TJ = 150°C 50 20 10 5 16 I (RESISTIVE LOAD) PK = π IAV 14 I (CAPACITIVE LOAD) PK = 5 IAV 12 10 dc 10 8 20 6 SQUARE WAVE 4 TJ = 125°C 2 0 0 Figure 4. Current Derating, Ambient (Per Leg) 2 4 6 8 10 12 14 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 5. Power Dissipation (Per Leg) http://onsemi.com 3 16 MUR3020WTG, MUR3040WTG, MUR3060WTG MUR3040WTG 100 50 50 20 10 5 100°C TJ = 150°C 30 IR , REVERSE CURRENT ( μ A) 100 25°C 10 5 100°C 25°C 2 1 0.5 0.2 0.1 0.05 0.02 0.01 0 50 100 150 200 250 300 350 400 450 5 VR, REVERSE VOLTAGE (VOLTS) 3 *The curves shown are typical for the highest voltage device in the voltage groupin Typical reverse current for lower voltage selections can be estimated from these sam curves if VR is sufficiently below rated VR. 2 Figure 7. Typical Reverse Current (Per Leg)* 1 0.5 0.3 0.2 0.1 0.2 0.4 0.6 0.8 1 1.2 vF, INSTANTANEOUS VOLTAGE (VOLTS) 1.4 1.6 Figure 6. Typical Forward Voltage (Per Leg) I F(AV) , AVERAGE FORWARD CURRENT (AMPS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 20 TJ = 150°C 16 14 dc 12 10 SQUARE WAVE 8 6 4 RATED VOLTAGE APPLIED 2 0 140 150 160 170 TC, CASE TEMPERATURE (°C) 1 14 dc 12 10 8 6 SQUARE WAVE RθJA = 15°C/W AS OBTAINED USING A SMALL FINNED HEAT SINK. dc 4 SQUARE WAVE 2 RθJA = 40°C/W AS OBTAINED IN FREE AIR WITH NO HEAT SINK. 0 0 160 20 40 60 80 100 120 140 TA, AMBIENT TEMPERATURE (°C) 180 200 P F(AV) , AVERAGE POWER DISSIPATION (WATTS) I F(AV) , AVERAGE FORWARD CURRENT (AMPS) Figure 8. Current Derating, Case (Per Leg) 16 I (RESISTIVE-INDUCTIVE LOAD) PK = π IAV I (CAPACITIVE LOAD) PK = 5 IAV 10 14 12 dc 10 20 SQUARE WAVE 8 6 4 TJ = 125°C 2 0 0 2 4 6 8 10 12 14 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Current Derating, Ambient (Per Leg) Figure 10. Power Dissipation (Per Leg) http://onsemi.com 4 MUR3020WTG, MUR3040WTG, MUR3060WTG MUR3060WT 200 100 50 IR , REVERSE CURRENT ( μ A) 100 50 TJ = 150°C 30 100°C 25°C 10 100°C 2 1 0.5 25°C 0.2 0.1 0.05 0.02 150 5 3 2 0.5 0.3 0.2 0.1 0.2 0.4 0.6 0.8 1 1.2 vF, INSTANTANEOUS VOLTAGE (VOLTS) 1.4 1.6 dc 8 P F(AV) , AVERAGE POWER DISSIPATION (WATTS) I F(AV) , AVERAGE FORWARD CURRENT (AMPS) 350 400 450 500 550 600 650 14 dc 12 SQUARE WAVE 10 8 6 4 RATED VOLTAGE APPLIED 2 0 140 RqJA = 16°C/W AS OBTAINED FROM A SMALL TO-220 HEAT SINK. SQUARE WAVE 6 5 dc 3 SQUARE WAVE RqJA = 60°C/W 1 AS OBTAINED IN FREE AIR WITH NO HEAT SINK. 0 0 20 40 60 80 100 120 140 TA, AMBIENT TEMPERATURE (5C) 2 160 180 150 160 170 TC, CASE TEMPERATURE (5C) 180 Figure 13. Current Derating, Case (Per Leg) 10 4 300 16 Figure 11. Typical Forward Voltage (Per Leg) 7 250 Figure 12. Typical Reverse Current (Per Leg)* 1 9 200 VR, REVERSE VOLTAGE (VOLTS) *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. I F(AV) , AVERAGE FORWARD CURRENT (AMPS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 20 TJ = 150°C 20 10 5 200 16 I (CAPACITIVE LOAD) PK = 5 IAV 14 dc 10 12 10 20 SQUARE WAVE 8 (RESISTIVE-INDUCTIVE LOAD) IPK = π I AV TJ = 125°C 6 4 2 0 0 Figure 14. Current Derating, Ambient (Per Leg) 2 4 6 8 10 12 14 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 15. Power Dissipation (Per Leg) http://onsemi.com 5 16 1 D = 0.5 0.5 0.2 0.1 0.1 0.05 0.01 0.05 t1 t2 SINGLE PULSE DUTY CYCLE, D = t1/t2 0.02 0.01 0.01 0.02 0.05 ZqJC(t) = r(t) RqJC RqJC = 1.5°C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT T1 P(pk) 0.1 0.2 0.5 1 2 5 t, TIME (ms) 10 TJ(pk) - TC = P(pk) ZqJC(t) 20 50 Figure 16. Thermal Response 1K 500 C, CAPACITANCE (pF) r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) MUR3020WTG, MUR3040WTG, MUR3060WTG TJ = 25°C 200 100 50 20 10 1 2 5 10 20 VR, REVERSE VOLTAGE (VOLTS) 50 Figure 17. Typical Capacitance (Per Leg) http://onsemi.com 6 100 100 200 500 1K MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−247 CASE 340AL ISSUE D DATE 17 MAR 2017 SCALE 1:1 E E2/2 D SEATING PLANE Q 2X 2 M B A M NOTE 6 S NOTE 3 1 0.635 P A E2 NOTE 4 4 DIM A A1 b b2 b4 c D E E2 e F L L1 P Q S 3 L1 F NOTE 5 L 2X B A NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. SLOT REQUIRED, NOTCH MAY BE ROUNDED. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE MEASURED AT THE OUTERMOST EXTREME OF THE PLASTIC BODY. 5. LEAD FINISH IS UNCONTROLLED IN THE REGION DEFINED BY L1. 6. ∅P SHALL HAVE A MAXIMUM DRAFT ANGLE OF 1.5° TO THE TOP OF THE PART WITH A MAXIMUM DIAMETER OF 3.91. 7. DIMENSION A1 TO BE MEASURED IN THE REGION DEFINED BY L1. b2 c b4 3X e b 0.25 A1 NOTE 7 M B A M MILLIMETERS MIN MAX 4.70 5.30 2.20 2.60 1.07 1.33 1.65 2.35 2.60 3.40 0.45 0.68 20.80 21.34 15.50 16.25 4.32 5.49 5.45 BSC 2.655 --19.80 20.80 3.81 4.32 3.55 3.65 5.40 6.20 6.15 BSC GENERIC MARKING DIAGRAM* XXXXXXXXX AYWWG XXXXX A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DOCUMENT NUMBER: DESCRIPTION: 98AON16119F TO−247 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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