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or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
MUR490E, MUR4100E
MUR4100E is a Preferred Device
SWITCHMODEt
Power Rectifiers
Ultrafast “E’’ Series with High Reverse
Energy Capability
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These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
ULTRAFAST RECTIFIERS
4.0 AMPS, 900 − 1000 VOLTS
Features
• 20 mJ Avalanche Energy Guaranteed
• Excellent Protection Against Voltage Transients in Switching
•
•
•
•
•
•
•
Inductive Load Circuits
Ultrafast 75 Nanosecond Recovery Time
175°C Operating Junction Temperature
Low Forward Voltage
Low Leakage Current
High Temperature Glass Passivated Junction
Reverse Voltage to 1000 V
These are Pb−Free Devices
AXIAL LEAD
CASE 267−05
STYLE 1
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.1 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
MARKING DIAGRAM
A
MUR
4xxxE
YYWW G
G
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
•
220°C Max for 10 Seconds, 1/16″ from Case
Polarity: Cathode Indicated by Polarity Band
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
MUR490E
MUR4100E
VRRM
VRWM
VR
Average Rectified Forward Current (Sq. Wave)
(Mounting Method #3 Per Note 1)
IF(AV)
4.0 @
TA = 35°C
A
Nonrepetitive Peak Surge Current
(Surge Applied at Rated Load Conditions,
Halfwave, Single Phase, 60 Hz)
IFSM
70
A
Operating Junction Storage Temperature
TJ, Tstg
−65 to +175
V
900
1000
Thermal Resistance, Junction−to−Case
ORDERING INFORMATION
Package
Shipping †
MUR490E
Axial Lead*
500 Units / Bulk
MUR4100E
Axial Lead*
500 Units / Bulk
MUR4100EG
Axial Lead*
500 Units / Bulk
MUR4100ERL
Axial Lead*
1,500/Tape & Reel
MUR4100ERLG
Axial Lead*
1,500/Tape & Reel
Device
°C
THERMAL CHARACTERISTICS
Characteristic
A
= Assembly Location
MUR4xxxE = Device Code
xxx = 90 or 100
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Symbol
Max
Unit
RqJC
See Note 1
°C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*This package is inherently Pb−Free.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 3
1
Publication Order Number:
MUR490E/D
MUR490E, MUR4100E
ELECTRICAL CHARACTERISTICS
Characteristics
Symbol
Value
Unit
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 3.0 Amps, TJ = 150°C)
(iF = 3.0 Amps, TJ = 25°C)
(iF = 4.0 Amps, TJ = 25°C)
vF
V
Maximum Instantaneous Reverse Current (1)
(Rated dc Voltage, TJ = 100°C)
(Rated dc Voltage, TJ = 25°C)
iR
Maximum Reverse Recovery Time
(IF = 1.0 Amp, di/dt = 50 Amp/ms)
(IF = 0.5 Amp, iR = 1.0 Amp, IREC = 0.25 Amp)
trr
Maximum Forward Recovery Time
(IF = 1.0 Amp, di/dt = 100 Amp/ms, Recovery to 1.0 V)
tfr
75
ns
WAVAL
20
mJ
1.53
1.75
1.85
mA
900
25
ns
100
75
Controlled Avalanche Energy
(See Test Circuit in Figure 6)
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%.
IR, REVERSE CURRENT (m A)
20
25°C
TJ = 175°C
10
100°C
7.0
3.0
2.0
TJ = 175°C
100°C
25°C
*The curves shown are typical for the highest voltage
device in the voltage grouping. Typical reverse current
for lower voltage selections can be estimated from these
same curves if VR is sufficiently below rated VR.
0
100
200
300
400
500
600
700
800
1.0
VR, REVERSE VOLTAGE (VOLTS)
0.7
Figure 2. Typical Reverse Current*
0.5
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)
5.0
1000
400
200
100
40
20
10
4.0
2.0
1.0
0.4
0.2
0.1
0.04
0.02
0.01
0.004
0.002
0.001
0.3
0.2
0.1
0.07
0.05
0.03
10
Rated VR
RqJA = 28°C/W
8.0
6.0
dc
4.0
SQUARE WAVE
2.0
0
0
0.02
0
0.2
0.4 0.6
0.8 1.0 1.2 1.4 1.6
vF, INSTANTANEOUS VOLTAGE (VOLTS)
1.8
50
100
150
200
TA, AMBIENT TEMPERATURE (°C)
2
Figure 3. Current Derating
(Mounting Method #3 Per Note 1)
Figure 1. Typical Forward Voltage
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2
900 1000
2
10
70
60
50
TJ = 175°C
9.0
8.0
5.0
7.0
6.0
C, CAPACITANCE (pF)
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
MUR490E, MUR4100E
10
5.0
(Capacitive IPK =20
IAV
Load)
4.0
dc
3.0
SQUAREWAVE
2.0
0
1.0
2.0
3.0
5.0
4.0
TJ = 25°C
30
20
10
9.0
8.0
7.0
1.0
0
40
0
10
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 4. Power Dissipation
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
50
Figure 5. Typical Capacitance
+VDD
IL
40 mH COIL
BVDUT
VD
MERCURY
SWITCH
ID
ID
IL
DUT
S1
VDD
t0
Figure 6. Test Circuit
t1
t2
t
Figure 7. Current−Voltage Waveforms
The unclamped inductive switching circuit shown in
Figure 6 was used to demonstrate the controlled avalanche
capability of the new “E’’ series Ultrafast rectifiers. A
mercury switch was used instead of an electronic switch to
simulate a noisy environment when the switch was being
opened.
When S1 is closed at t0 the current in the inductor IL ramps
up linearly; and energy is stored in the coil. At t1 the switch
is opened and the voltage across the diode under test begins
to rise rapidly, due to di/dt effects, when this induced voltage
reaches the breakdown voltage of the diode, it is clamped at
BVDUT and the diode begins to conduct the full load current
which now starts to decay linearly through the diode, and
goes to zero at t2.
By solving the loop equation at the point in time when S1
is opened; and calculating the energy that is transferred to
the diode it can be shown that the total energy transferred is
equal to the energy stored in the inductor plus a finite amount
of energy from the VDD power supply while the diode is in
breakdown (from t1 to t2) minus any losses due to finite
component resistances. Assuming the component resistive
elements are small Equation (1) approximates the total
energy transferred to the diode. It can be seen from this
equation that if the VDD voltage is low compared to the
breakdown voltage of the device, the amount of energy
contributed by the supply during breakdown is small and the
total energy can be assumed to be nearly equal to the energy
stored in the coil during the time when S1 was closed,
Equation (2).
The oscilloscope picture in Figure 8, shows the
information obtained for the MUR8100E (similar die
construction as the MUR4100E Series) in this test circuit
conducting a peak current of one ampere at a breakdown
voltage of 1300 V, and using Equation (2) the energy
absorbed by the MUR8100E is approximately 20 mjoules.
Although it is not recommended to design for this
condition, the new “E’’ series provides added protection
against those unforeseen transient viruses that can produce
unexplained random failures in unfriendly environments.
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3
MUR490E, MUR4100E
EQUATION (1):
ǒ
BV
2
DUT
W
[ 1 LI LPK
AVAL
2
BV
–V
DUT DD
Ǔ
CH1
CH2
500V
50mV
A
20ms
953 V
VERT
CHANNEL 2:
IL
0.5 AMPS/DIV.
CHANNEL 1:
VDUT
500 VOLTS/DIV.
EQUATION (2):
2
W
[ 1 LI LPK
AVAL
2
TIME BASE:
20 ms/DIV.
1
CH1
ACQUISITIONS
SAVEREF SOURCE
CH2
217:33 HRS
STACK
REF
REF
Figure 8. Current−Voltage Waveforms
NOTE 1 — AMBIENT MOUNTING DATA
Data shown for thermal resistance junction−to−ambient (RqJA) for the mountings shown is to be used as typical guideline
values for preliminary engineering or in case the tie point temperature cannot be measured.
TYPICAL VALUES FOR RqJA IN STILL AIR
Mounting
Method
1
2
RqJA
Lead Length, L (IN)
1/8
1/4
1/2
3/4
50
51
53
55
58
59
61
63
Units
°C/W
°C/W
28
°C/W
3
MOUNTING METHOD 1
MOUNTING METHOD 2
P.C. Board Where Available Copper
Surface area is small.
L
Vector Push−In Terminals T−28
L
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
L
MOUNTING METHOD 3
É
É
É
É
É
É
É
P.C. Board with
1−1/2 ″ x 1−1/2 ″ Copper Surface
L = 1/2 ″
Board Ground Plane
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4
L
MUR490E, MUR4100E
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267−05
ISSUE G
K
D
A
1
B
2
K
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 267−04 OBSOLETE, NEW STANDARD 267−05.
DIM
A
B
D
K
INCHES
MIN
MAX
0.287
0.374
0.189
0.209
0.047
0.051
1.000
−−−
MILLIMETERS
MIN
MAX
7.30
9.50
4.80
5.30
1.20
1.30
25.40
−−−
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
SWITCHMODE registered trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: orderlit@onsemi.com
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5
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MUR490E/D