MURA115T3, MURA120T3
Preferred Devices
Surface Mount Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system.
http://onsemi.com Features
• • • • •
Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.71 V Max @ 1.0 A, TJ = 150°C) Pb−Free Packages are Available
ULTRAFAST RECTIFIERS 1 AMPERE, 100−200 VOLTS
Mechanical Characteristics:
• Case: Epoxy, Molded • Weight: 70 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • •
Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) Machine Model > 400 V (Class C
SMA CASE 403D PLASTIC
MARKING DIAGRAM
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA115T3 MURA120T3 Average Rectified Forward Current @ TL = 155°C @ TL = 135°C Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction Temperature Range Symbol VRRM VRWM VR IF(AV) 1.0 2.0 IFSM 40 A Value Unit V 150 200 A
U4x AYWW G
U4x = Device Code x = C for MURA115T3 = D for MURA120T3 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package
ORDERING INFORMATION
TJ −65 to +175 °C Device MURA115T3 Symbol PsiJL (Note 2) RqJA Max 24 216 Unit °C/W MURA115T3G MURA120T3 MURA120T3G Package SMA SMA (Pb−Free) SMA SMA (Pb−Free) Shipping † 5000/Tape & Reel 5000/Tape & Reel 5000/Tape & Reel 5000/Tape & Reel
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL.
© Semiconductor Components Industries, LLC, 2006
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
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February, 2006 − Rev. 5
Publication Order Number: MURA115T3/D
MURA115T3, MURA120T3
ELECTRICAL CHARACTERISTICS
Characteristic Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A, TJ = 25°C) (iF = 1.0 A, TJ = 150°C) Maximum Instantaneous Reverse Current (Note 3) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. Symbol vF 0.875 0.71 iR 2.0 50 trr 35 ns mA Max Unit V
100 IR, REVERSE CURRENT (mA) TJ = 175°C 10 IR, REVERSE CURRENT (mA)
100 TJ = 175°C
10 TJ = 100°C TJ = 25°C
1
TJ = 100°C
0.1 TJ = 25°C
1
0.01
0.001 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS)
0.1 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Reverse Current
IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A)
Figure 2. Maximum Reverse Current
10 TC = 175°C
100°C 25°C
10 TC = 175°C
100°C 25°C
1
1
0.1
0.1
0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 3. Typical Forward Voltage
Figure 4. Maximum Forward Voltage
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MURA115T3, MURA120T3
50 45 C, CAPACITANCE (pF) 40 35 30 25 20 15 10 5 0 0 4 8 12 16 20 24 28 32 36 40 NOTE: TYPICAL CAPACITANCE AT 0 V = 45 pF 50 45 C, CAPACITANCE (pF) 40 35 30 25 20 15 10 5 0 0 4 8 12 16 20 24 28 32 36 40 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) NOTE: MAXIMUM CAPACITANCE AT 0 V = 47 pF
Figure 5. Typical Capacitance
Figure 6. Maximum Capacitance
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IF(AV), AVERAGE FORWARD CURRENT (A)
IF(AV), AVERAGE FORWARD CURRENT (A)
1.5 1.25 dc 1 0.75 SQUARE WAVE 0.5 0.25 0 0 20 40 60 80 100 120 140 160 180 TA, AMBIENT TEMPERATURE (°C)
4 dc 3 SQUARE WAVE 2
1 0 80 90 100 110 120 130 140 150 160 170 180 TL, LEAD TEMPERATURE (°C)
Figure 7. Current Derating, Lead
Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad)
PF, AVERAGE POWER DISSIPATION (W)
3 2.5 dc 2 SQUARE WAVE 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 9. Power Dissipation
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MURA115T3, MURA120T3
PACKAGE DIMENSIONS
SMA CASE 403D−02 ISSUE C
HE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. DIM A A1 b c D E HE L MIN 1.91 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.16 2.41 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.075 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.085 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.095 0.006 0.064 0.016 0.115 0.180 0.220 0.060
b
D
POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES)
STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE
A
L
c
A1
SOLDERING FOOTPRINT*
4.0 0.157
2.0 0.0787
2.0 0.0787
SCALE 8:1 mm inches
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MURA115T3/D
