MURA160T3

MURA160T3 Preferred Device Surface Mount Ultrafast Power Rectifier Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. http://onsemi.com Features • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (1.05 V Max @ 1.0 A, TJ = 150°C) Pb−Free Package is Available ULTRAFAST RECTIFIER 1 AMPERE, 600 VOLTS Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 70 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) Machine Model > 400 V (Class C) SMA CASE 403D PLASTIC MARKING DIAGRAM MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current @ TL = 145°C @ TL = 110°C Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction Temperature Range Symbol VRRM VRWM VR IF(AV) 1.0 2.0 IFSM 30 A Value 600 Unit V U4J A Y WW G = = = = = U4J AYWW G A Device Code Assembly Location Year Work Week Pb−Free Package ORDERING INFORMATION TJ −65 to +175 °C Device MURA160T3 Symbol PsiJL (Note 2) RqJA Max 24 216 Unit °C/W MURA160T3G Package SMA SMA (Pb−Free) Shipping † 5000/Tape & Reel 5000/Tape & Reel THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL. © Semiconductor Components Industries, LLC, 2006 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. 1 February, 2006 − Rev. 4 Publication Order Number: MURA160T3/D MURA160T3 ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A, TJ = 25°C) (iF = 1.0 A, TJ = 150°C) Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 150°C) Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. Symbol vF 1.25 1.05 iR 5.0 150 trr 75 ns mA Max Unit V 100 IR, REVERSE CURRENT (mA) IR, REVERSE CURRENT (mA) TJ = 175°C 1000 10 TJ = 100°C 1 TJ = 175°C 100 10 TJ = 100°C 0.1 TJ = 25°C TJ = 25°C 1 0 100 200 300 400 500 600 0.01 0 100 200 300 400 500 600 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) Figure 2. Maximum Reverse Current 10 TC = 175°C 100°C 25°C 10 TC = 175°C 100°C 25°C 1 1 0.1 0.1 0.01 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.01 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 3. Typical Forward Voltage Figure 4. Maximum Forward Voltage http://onsemi.com 2 MURA160T3 25 NOTE: TYPICAL CAPACITANCE AT 0 V = 24 pF 30 25 20 15 10 5 0 0 4 8 12 16 20 24 28 32 36 40 0 4 8 12 16 20 24 28 32 36 40 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) NOTE: MAXIMUM CAPACITANCE AT 0 V = 27 pF C, CAPACITANCE (pF) 15 10 5 0 Figure 5. Typical Capacitance C, CAPACITANCE (pF) 20 Figure 6. Maximum Capacitance IF(AV), AVERAGE FORWARD CURRENT (A) IF(AV), AVERAGE FORWARD CURRENT (A) 5 1 0.9 0.8 0.7 0.6 SQUARE WAVE 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 100 120 140 160 180 TA, AMBIENT TEMPERATURE (°C) dc 4 dc 3 SQUARE WAVE 2 1 0 60 80 100 120 140 160 180 TL, LEAD TEMPERATURE (°C) Figure 7. Current Derating, Lead Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad) PF, AVERAGE POWER DISSIPATION (W) 4.5 4 dc 3.5 3 SQUARE WAVE 2.5 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 3 MURA160T3 PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE C HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. DIM A A1 b c D E HE L MIN 1.91 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.16 2.41 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.075 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.085 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.095 0.006 0.064 0.016 0.115 0.180 0.220 0.060 b D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE A L c A1 SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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