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MURB1620CTT4

MURB1620CTT4

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO263

  • 描述:

    RECTIFIER DIODE

  • 数据手册
  • 价格&库存
MURB1620CTT4 数据手册
MURB1620CT Preferred Device SWITCHMODEt Power Rectifier D2PAK Power Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features • • • • • • • • • http://onsemi.com ULTRAFAST RECTIFIER 16 AMPERES, 200 VOLTS Package Designed for Power Surface Mount Applications Ultrafast 35 Nanosecond Recovery Times 175°C Operating Junction Temperature Epoxy Meets UL 94 V−0 @ 0.125 in High Temperature Glass Passivated Junction Low Leakage Specified @ 150°C Case Temperature Short Heat Sink Tab Manufactured − Not Sheared! Similar in Size to Industrial Standard TO−220 Package Pb−Free Packages are Available 1 4 3 4 1 D2PAK CASE 418B STYLE 3 3 Mechanical Characteristics: • Case: Epoxy, Molded, Epoxy Meets UL 94, V−0 • Weight: 1.7Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal MARKING DIAGRAM Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • AY WW U1620G AKA 260°C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (>400 V) Human Body Model, 3B (>8000 V) MAXIMUM RATINGS (Per Leg) Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (Rated VR, TC = 150°C) Total Device IF(AV) 8.0 16 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 150°C) IFM 16 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 100 A Operating Junction and Storage Temperature Range TJ, Tstg February, 2006 − Rev. 5 = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION Package Shipping† D2PAK 50 Units/Rail MURB1620CTG D2PAK (Pb−Free) 50 Units/Rail MURB1620CTT4 D2PAK 800/Tape & Reel MURB1620CTT4G D2PAK 800/Tape & Reel Device −65 to +175 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2006 A Y WW U1620 G AKA 1 MURB1620CT (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MURB1620CT/D MURB1620CT THERMAL CHARACTERISTICS (Per Leg) Rating Symbol Value Unit Maximum Thermal Resistance, Junction−to−Case RqJC 3 °C/W Maximum Thermal Resistance, Junction−to−Ambient RqJA 50 °C/W TL 260 °C Symbol Max Unit Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 8 A, TC = 150°C) (iF = 8 A, TC = 25°C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TC = 150°C) (Rated DC Voltage, TC = 25°C) iR Maximum Reverse Recovery Time (IF = 1 A, di/dt = 50 A/ms) (IF = 0.5 A, iR = 1 A, IREC = 0.25 A) trr V 0.895 0.975 mA 250 5 ns 35 25 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0% 10 K 50 1.0 K 400 I R, REVERSE CURRENT (A) μ i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 100 20 100 10 5.0 2.0 1.0 0.7 TJ = 175°C 100°C 25°C 0.3 0.1 0.2 TJ = 175°C 20 4 100°C 1 25°C 0.2 0.04 0.4 0.6 0.8 vF, INSTANTANEOUS VOLTAGE (V) 1 1.2 0.01 0 10 RATED VR APPLIED RqJC = 3°C/W 9.0 8.0 DC 7.0 6.0 5.0 4.0 SQUARE WAVE 3.0 2.0 1.0 0 140 150 180 160 170 TC, CASE TEMPERATURE (°C) 40 60 100 120 140 80 VR, REVERSE VOLTAGE (V) 160 180 200 Figure 2. Typical Reverse Current, Per Leg* PF(AV), AVERAGE POWER DISSIPATION (WATTS) I F(AV), AVERAGE POWER DISSIPATION (WATTS) Figure 1. Typical Forward Voltage, Per Leg 20 10 9.0 TJ = 175°C 8.0 7.0 SQUARE WAVE 6.0 DC 5.0 4.0 3.0 2.0 1.0 0 0 Figure 3. Current Derating Case, Per Leg 1 2 3 4 5 6 7 8 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 4. Power Dissipation, Per Leg http://onsemi.com 2 9 10 1 D = 0.5 0.5 0.2 P(pk) 0.1 0.1 0.05 0.01 0.05 ZqJC(t) = r(t) RqJC D curves apply for power pulse train shown read time at T1 t1 t2 Duty Cycle, D = t1/t2TJ(pk) − TC = P(pk) ZqJC(t) SINGLE PULSE 0.02 0.01 0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10 20 50 t, TIME (ms) Figure 5. Thermal Response 1K C, CAPACITANCE (pF) r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) MURB1620CT 300 TJ = 25°C 100 30 10 1 10 VR, REVERSE VOLTAGE (V) Figure 6. Typical Capacitance, Per Leg http://onsemi.com 3 100 100 200 500 1K MURB1620CT PACKAGE DIMENSIONS D2PAK 3 CASE 418B−04 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. C E V W −B− 4 INCHES DIM MIN MAX A 0.340 0.380 B 0.380 0.405 C 0.160 0.190 D 0.020 0.035 E 0.045 0.055 F 0.310 0.350 G 0.100 BSC H 0.080 0.110 J 0.018 0.025 K 0.090 0.110 L 0.052 0.072 M 0.280 0.320 N 0.197 REF P 0.079 REF R 0.039 REF S 0.575 0.625 V 0.045 0.055 STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE A 1 2 S 3 −T− SEATING PLANE K W J G D 3 PL 0.13 (0.005) VARIABLE CONFIGURATION ZONE H M T B M N R P U L L M L M M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 SOLDERING FOOTPRINT* 8.38 0.33 1.016 0.04 10.66 0.42 5.08 0.20 3.05 0.12 17.02 0.67 SCALE 3:1z mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MURB1620CT SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 5 For additional information, please contact your local Sales Representative. MURB1620CT/D
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