MURD530 SWITCHMODE Power Rectifier
DPAK Surface Mount Package
These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes.
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• • • •
Ultrafast 50 Nanosecond Recovery Time Low Forward Voltage Drop Low Leakage Pb−Free Package is Available
ULTRAFAST RECTIFIER 5.0 AMPERES, 300 VOLTS
1 3 4
Mechanical Characteristics
• Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • •
MARKING DIAGRAM
4 12 DPAK CASE 369C 3 A Y WW G = Assembly Location = Year = Work Week = Pb−Free Package AYWW U 530G
Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Available in 16 mm Tape and Reel, 2500 Units Per Reel, by Adding a “T4’’ Suffix to the Part Number
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 165°C) Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 165°C) Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) Operating Junction and Storage Temperature Range Symbol VRRM VRWM VR IF(AV) IFRM Value 300 Unit V
ORDERING INFORMATION
Device Package DPAK (Pb−Free) Shipping† 2500/Tape & Reel
5.0 10
A A
MURD530T4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
IFSM
75
A
TJ, Tstg
−65 to +175
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 3
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Publication Order Number: MURD530/D
MURD530
THERMAL CHARACTERISTICS
Rating Thermal Resistance − Junction−to−Case (Note 1) Thermal Resistance − Junction−to−Ambient (Note 2) Thermal Resistance − Junction−to−Ambient (Note 3) Symbol RqJC RqJA RqJA Value 3 92 57 Unit °C/W °C/W °C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage Drop (Note 4) (iF = 3 A, TJ = 25°C) (iF = 3 A, TJ = 125°C) (iF = 5 A, TJ = 25°C) (iF = 5 A, TJ = 125°C) Maximum Instantaneous Reverse Current (Note 4) (TJ = 25°C, Rated dc Voltage) (TJ = 125°C, Rated dc Voltage) Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 A/ms, VR = 30 V, TJ = 25°C) 1. 2. 3. 4. Rating applies for one diode leg. Rating applies when for both diode legs when mounted on 130 mm2 pad size. Rating applies for both diode legs when mounted on 1 in pad size. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. 100 IF, FORARD CURRENT (A) IF, FORARD CURRENT (A) 100 vF 0.95 0.80 1.05 0.90 5.0 150 50 Volts
iR
mA
trr
ns
10
TJ = 175°C
10
175°C 125°C 85°C
125°C 1 −40°C 0.1 0 0.5 1.0
85°C 25°C
1
25°C −40°C
1.5
2.0
0.1
0
0.5
1.0
1.5
2.0
vF, INSTANTANEOUS VOLTAGE (V)
vF, INSTANTANEOUS VOLTAGE (V)
Figure 1. Maximum Forward Voltage
1000 IR, REVERSE CURRENT (mA) 100 10 1.0 0.1 0.01 25°C 175°C 125°C 85°C IR, REVERSE CURRENT (A) 1000 100 10 1.0 0.1 0.01 0.001 0 0
Figure 2. Typical Forward Voltage
175°C 125°C 85°C
25°C −40°C
−40°C
0.001 0 0 50 100 150 200 vR, REVERSEE VOLTAGE (V) 250 300
50
100 150 200 250 vR, REVERSEE VOLTAGE (V)
300
Figure 3. Maximum Reverse Voltage
Figure 4. Typical Reverse Voltage
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MURD530
15 IF, AVERAGE FORWARD CURRENT (mA) IF, AVERAGE FORWARD CURRENT (mA) Rated Voltage Applied RqJA = 3°C/W 5 Rated Voltage Applied RqJA = 57°C/W
10 dc SQUARE WAVE
5
dc SQUARE WAVE
0
80
90
100 110 120 130 140 150 160 170 180 TC, CASE TEMPERATURE (°C)
0
80
90
100 110 120 130 140 150 160 170 18 TA, AMBIENT TEMPERATURE (°C)
Figure 5. Typical Current Derating, Case
PFO, AVERAGE POWER DISSIPATION (W) 8 7 C, CAPACITANCE (pF) 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 1 0 SQUARE WAVE dc 1000
Figure 6. Typical Current Derating, Ambient
TJ = 25°C
100
10
50
100
150
200
250
IO, AVERAGE FORWARD CURRENT (A)
VR, REVERSE VOLTAGE (V)
Figure 7. Forward Power Dissipation
Figure 8. Typical Capacitance
10
D = 0.5 R(t), (°C/W) 1 0.2 0.1 0.05 0.1 0.01 Single Pulse 0.01 0.000001
0.00001
0.0001
0.001
0.01 PULSE TIME (s)
0.1
1
10
100
1000
Figure 9. R(t) on an Infinite Heatsink Power (J1) 0.800 W Power (J2) 0.800 W
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MURD530
100 10 R(t), (°C/W) 1 0.1 0.01 0.001 0.000001 D = 0.5 0.2 0.1 0.05 0.01 Single Pulse
0.00001
0.0001
0.001
0.01 PULSE TIME (s)
0.1
1
10
100
1000
Figure 10. PCB Cu Area 650 mm2 PCB Cu thk 1 oz Power (J1) 0.800 W Power (J2) 0.800 W
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MURD530
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE D
A B C A c2
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−−
E b3 L3
1 4
D
2 3
Z
DETAIL A
H
L4
b2 e
b 0.005 (0.13)
M
c C L2
GAUGE PLANE
H C L L1 DETAIL A
SEATING PLANE
A1
ROTATED 90 CW 5
SOLDERING FOOTPRINT*
6.20 0.244 3.00 0.118
2.58 0.102
5.80 0.228
1.60 0.063
6.17 0.243
SCALE 3:1
mm inches
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MURD530/D
