MURD620CT_11

MURD620CT SWITCHMODE Power Rectifier DPAK Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features http://onsemi.com • • • • Ultrafast 35 Nanosecond Recovery Time Low Forward Voltage Drop Low Leakage Pb−Free Packages are Available ULTRAFAST RECTIFIER 6.0 AMPERES 200 VOLTS 1 4 3 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds MARKING DIAGRAM 4 12 DPAK CASE 369C 3 A Y WW U620T G AYWW U 620TG MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 140°C) Per Diode Per Device Peak Repetitive Forward Current (Rated VR, Square Wave, Per Diode 20 kHz, TC = 145°C) Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) Operating Junction and Storage Temperature Range Symbol VRRM VRWM VR IF(AV) Value 200 Unit V = Assembly Location = Year = Work Week = Device Code = Pb−Free Package 3.0 6.0 6.0 A ORDERING INFORMATION A Device MURD620CT Package DPAK DPAK (Pb−Free) DPAK DPAK (Pb−Free) Shipping† 75 Units/Rail 75 Units/Rail 2500/Tape & Reel 2500/Tape & Reel IF IFSM 50 A MURD620CTG MURD620CTT4 MURD620CTT4G TJ, Tstg −65 to +175 °C THERMAL CHARACTERISTICS (Per Diode) Rating Thermal Resistance, Junction−to−Case Thermal Resistance, Junction−to−Ambient (Note 1) Symbol RqJC RqJA Value 9 80 Unit °C/W °C/W †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Rating applies when surface mounted on the minimum pad sizes recommended. © Semiconductor Components Industries, LLC, 2011 January, 2011 − Rev. 9 1 Publication Order Number: MURD620CT/D MURD620CT ELECTRICAL CHARACTERISTICS (Per Diode) Rating Maximum Instantaneous Forward Voltage Drop (Note 2) (iF = 3 Amps, TC = 25°C) (iF = 3 Amps, TC = 125°C) (iF = 6 Amps, TC = 25°C) (iF = 6 Amps, TC = 125°C) Maximum Instantaneous Reverse Current (Note 2) (TJ = 25°C, Rated dc Voltage) (TJ = 125°C, Rated dc Voltage) Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25°C) (IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25°C) 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. Symbol vF Value 1 0.96 1.2 1.13 5 250 35 25 mA Unit V iR trr ns 100 IR, REVERSE CURRENT (mA) 70 50 30 i , INSTANTANEOUS FORWARD CURRENT (AMPS) F 20 100 10 1 0.1 0.01 0.001 150°C TJ = 175°C 100°C 25°C 10 7.0 5.0 3.0 2.0 175°C TJ = 25°C 0.0001 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) Figure 2. Typical Leakage Current* (Per Leg) * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficiently below rated VR. PF(AV) , AVERAGE POWER DISSIPATION (WATTS) 14 13 12 11 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 5.0 10 IPK/IAV = 20 SINE WAVE dc 150°C 1.0 0.7 0.5 0.3 0.2 100°C SQUARE WAVE TJ = 175°C 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 vF, INSTANTANEOUS VOLTAGE (V) 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 Figure 1. Typical Forward Voltage (Per Leg) IF(AV), AVERAGE FORWARD CURRENT (A) Figure 3. Average Power Dissipation (Per Leg) http://onsemi.com 2 MURD620CT IF(AV) , AVERAGE FORWARD CURRENT (AMPS) RATED VOLTAGE APPLIED RqJC = 9°C/W TJ = 175°C dc 4.0 3.0 2.0 1.0 0 100 110 120 130 140 150 160 170 180 TC, CASE TEMPERATURE (°C) SINE WAVE OR SQUARE WAVE IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 8.0 7.0 6.0 5.0 4.0 3.5 3.0 2.5 2.0 dc 1.5 1.0 0.5 0 0 20 40 60 80 100 120 140 160 180 200 TA, AMBIENT TEMPERATURE (°C) SINE WAVE OR SQUARE WAVE TJ = 175°C SURFACE MOUNTED ON MIN. PAD SIZE RECOMMENDED RATED VOLTAGE APPLIED RqJA = 80°C/W Figure 4. Current Derating, Case (Per Leg) Figure 5. Current Derating, Ambient (Per Leg) 100 TJ = 25°C C, CAPACITANCE (pF) 10 1 0 10 20 30 40 50 60 70 80 90 100 VR, REVERSE VOLTAGE (V) Figure 6. Typical Capacitance (Per Leg) http://onsemi.com 3 MURD620CT PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE D A B C A c2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− E b3 L3 1 4 D 2 3 Z DETAIL A H L4 b2 e b 0.005 (0.13) M c C L2 GAUGE PLANE H C L L1 DETAIL A SEATING PLANE A1 ROTATED 90 CW 5 SOLDERING FOOTPRINT* 6.20 0.244 3.00 0.118 2.58 0.102 5.80 0.228 1.60 0.063 6.17 0.243 SCALE 3:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 MURD620CT/D