MURF1620CT

MURF1620CT Preferred Device SWITCHMODEt Power Rectifier These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features http://onsemi.com • • • • • • • • • Ultrafast 35 Nanosecond Recovery Times 150°C Operating Junction Temperature Epoxy Meets UL 94 V−0 @ 0.125 in High Temperature Glass Passivated Junction Low Leakage Specified @ 150°C Case Temperature Current Derating @ Both Case and Ambient Temperatures Electrically Isolated. No Isolation Hardware Required. UL Recognized File #E69369 (Note 1) Pb−Free Package is Available* ULTRAFAST RECTIFIER 16 AMPERES, 200 VOLTS 1 2 3 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 1.9 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds MAXIMUM RATINGS (Per Leg) Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current Total Device, (Rated VR), TC = 150°C Total Device Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 150°C Non−repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction and Storage Temperature RMS Isolation Voltage (t = 1 second, R.H. ≤ 30%, TA = 25°C) (Note 2) Per Figure 3 Per Figure 4 (Note 1) Per Figure 5 Symbol VRRM VRWM VR IF(AV) Value 200 Unit V 1 2 3 ISOLATED TO−220 CASE 221D STYLE 3 MARKING DIAGRAM Leads are Readily Solderable AYWW U1620G AKA 8 16 16 A A Y WW U1620 G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity IFM A IFSM 100 A TJ, Tstg Viso1 Viso2 Viso3 − 65 to +150 °C V ORDERING INFORMATION Device MURF1620CT MURF1620CTG Package TO−220 TO−220 (Pb−Free) Shipping 50 Units/Rail 50 Units/Rail 4500 3500 1500 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. UL Recognized mounting method is per Figure 4 2. Proper strike and creepage distance must be provided. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 Preferred devices are recommended choices for future use and best overall value. April, 2006 − Rev. 5 1 Publication Order Number: MURF1620CT/D MURF1620CT THERMAL CHARACTERISTICS (Per Leg) Rating Maximum Thermal Resistance, Junction−to−Case Lead Temperature for Soldering Purposes: 1/8″ from the Case for 5 seconds Symbol RqJC TL Symbol vF Value 4.2 260 Unit °C/W °C Unit V ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 3) (iF = 8.0 A, TC = 150°C) (iF = 8.0 A, TC = 25°C) Maximum Instantaneous Reverse Current (Note 3) (Rated DC Voltage, TC = 150°C) (Rated DC Voltage, TC = 25°C) Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) (IF = 0.5 A, iR = 1.0 A, IREC = 0.25 A) 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. Value 0.895 0.975 250 5.0 35 25 iR mA trr ns i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 100 50 20 10 5.0 TJ = 100°C 25°C 2.0 1.0 0.3 0.4 0.1 0.2 0.6 0.8 1.0 vF, INSTANTANEOUS VOLTAGE (VOLTS) 1.2 Figure 1. Typical Forward Voltage, Per Leg 10 k I R, REVERSE CURRENT ( m A) 1.0 k 400 100 40 10 2.0 1.0 0.4 0.1 0.04 0.01 0 20 40 60 80 100 120 140 VR, REVERSE VOLTAGE (VOLTS) 160 180 200 TJ = 100°C 25°C Figure 2. Typical Reverse Current, Per Leg* http://onsemi.com 2 MURF1620CT TEST CONDITIONS FOR ISOLATION TESTS* MOUNTED FULLY ISOLATED PACKAGE MOUNTED FULLY ISOLATED PACKAGE MOUNTED FULLY ISOLATED PACKAGE CLIP CLIP LEADS 0.099″ MIN LEADS 0.099″ MIN LEADS HEATSINK 0.110, MIN HEATSINK HEATSINK Figure 3. Clip Mounting Position for Isolation Test Number 1 Figure 4. Clip Mounting Position for Isolation Test Number 2 Figure 5. Screw Mounting Position for Isolation Test Number 3 * Measurement made between leads and heatsink with all leads shorted together. MOUNTING INFORMATION** 4−40 SCREW CLIP PLAIN WASHER HEATSINK COMPRESSION WASHER NUT HEATSINK 6a. Screw−Mounted Figure 6. Typical Mounting Techniques 6b. Clip−Mounted Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions. Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions. **For more information about mounting power semiconductors see Application Note AN1040. http://onsemi.com 3 MURF1620CT PACKAGE DIMENSIONS TO−220 FULLPAK TRANSISTOR CASE 221D−03 ISSUE G −T− F Q A 123 SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH 3. 221D−01 THRU 221D−02 OBSOLETE, NEW STANDARD 221D−03. DIM A B C D F G H J K L N Q R S U INCHES MIN MAX 0.625 0.635 0.408 0.418 0.180 0.190 0.026 0.031 0.116 0.119 0.100 BSC 0.125 0.135 0.018 0.025 0.530 0.540 0.048 0.053 0.200 BSC 0.124 0.128 0.099 0.103 0.101 0.113 0.238 0.258 MILLIMETERS MIN MAX 15.88 16.12 10.37 10.63 4.57 4.83 0.65 0.78 2.95 3.02 2.54 BSC 3.18 3.43 0.45 0.63 13.47 13.73 1.23 1.36 5.08 BSC 3.15 3.25 2.51 2.62 2.57 2.87 6.06 6.56 − B− C S U H K −Y− G N L D 3 PL M J R 0.25 (0.010) B M Y STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 MURF1620CT/D