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MURF1620CT_08

MURF1620CT_08

  • 厂商:

    ONSEMI(安森美)

  • 封装:

  • 描述:

    MURF1620CT_08 - SWITCHMODE Power Rectifier - ON Semiconductor

  • 数据手册
  • 价格&库存
MURF1620CT_08 数据手册
MURF1620CT Preferred Device SWITCHMODEt Power Rectifier These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features http://onsemi.com • • • • • • • • Ultrafast 35 Nanosecond Recovery Times 150°C Operating Junction Temperature Epoxy Meets UL 94 V−0 @ 0.125 in High Temperature Glass Passivated Junction Low Leakage Specified @ 150°C Case Temperature Current Derating @ Both Case and Ambient Temperatures Electrically Isolated. No Isolation Hardware Required. Pb−Free Package is Available* ULTRAFAST RECTIFIER 16 AMPERES, 200 VOLTS 1 2 3 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 1.9 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • MARKING DIAGRAM Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds AYWW U1620G AKA MAXIMUM RATINGS (Per Leg) Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current Per Diode, (Rated VR), TC = 150°C Total Device Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 150°C Non−repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction and Storage Temperature RMS Isolation Voltage (t = 0.3 second, R.H. ≤ 30%, TA = 25°C) (Note 1) Per Figure 3 Symbol VRRM VRWM VR IF(AV) Value 200 Unit V 1 8 16 16 A 2 3 ISOLATED TO−220 CASE 221D STYLE 3 IFM A IFSM 100 A A Y WW U1620 G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity TJ, Tstg Viso1 − 65 to +150 °C V ORDERING INFORMATION Device MURF1620CT MURF1620CTG Package TO−220 TO−220 (Pb−Free) Shipping 50 Units/Rail 50 Units/Rail 4500 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Proper strike and creepage distance must be provided. Preferred devices are recommended choices for future use and best overall value. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2008 September, 2008 − Rev. 7 1 Publication Order Number: MURF1620CT/D MURF1620CT THERMAL CHARACTERISTICS (Per Leg) Rating Maximum Thermal Resistance, Junction−to−Case Lead Temperature for Soldering Purposes: 1/8″ from the Case for 5 seconds Symbol RqJC TL Symbol vF Value 4.2 260 Unit °C/W °C Unit V ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 2) (iF = 8.0 A, TC = 150°C) (iF = 8.0 A, TC = 25°C) Maximum Instantaneous Reverse Current (Note 2) (Rated DC Voltage, TC = 150°C) (Rated DC Voltage, TC = 25°C) Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) (IF = 0.5 A, iR = 1.0 A, IREC = 0.25 A) 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. Value 0.895 0.975 250 5.0 35 25 iR mA trr ns i F, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 50 20 10 5.0 2.0 1.0 0.3 TJ = 100°C 25°C 0.1 0.2 0.4 0.6 0.8 1.0 vF, INSTANTANEOUS VOLTAGE (VOLTS) 1.2 Figure 1. Typical Forward Voltage, Per Leg 10 k I R, REVERSE CURRENT ( mA) 1.0 k 400 100 40 10 2.0 1.0 0.4 0.1 0.04 0.01 0 20 40 60 80 100 120 140 VR, REVERSE VOLTAGE (VOLTS) 160 180 200 TJ = 100°C 25°C Figure 2. Typical Reverse Current, Per Leg* http://onsemi.com 2 MURF1620CT TEST CONDITION FOR ISOLATION TEST* FULLY ISOLATED PACKAGE LEADS HEATSINK 0.110, MIN Figure 3. Mounting Position * Measurement made between leads and heatsink with all leads shorted together. MOUNTING INFORMATION CLIP HEATSINK Clip−Mounted Figure 4. Typical Mounting Technique http://onsemi.com 3 MURF1620CT PACKAGE DIMENSIONS TO−220 FULLPAK CASE 221D−03 ISSUE J −T− F Q A 123 SEATING PLANE −B− C S U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH 3. 221D-01 THRU 221D-02 OBSOLETE, NEW STANDARD 221D-03. INCHES MIN MAX 0.617 0.635 0.392 0.419 0.177 0.193 0.024 0.039 0.116 0.129 0.100 BSC 0.118 0.135 0.018 0.025 0.503 0.541 0.048 0.058 0.200 BSC 0.122 0.138 0.099 0.117 0.092 0.113 0.239 0.271 MILLIMETERS MIN MAX 15.67 16.12 9.96 10.63 4.50 4.90 0.60 1.00 2.95 3.28 2.54 BSC 3.00 3.43 0.45 0.63 12.78 13.73 1.23 1.47 5.08 BSC 3.10 3.50 2.51 2.96 2.34 2.87 6.06 6.88 H K −Y− G N L D 3 PL M J R DIM A B C D F G H J K L N Q R S U 0.25 (0.010) B M Y STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 MURF1620CT/D
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