MURHB840CTT4

MURHB840CT Power Rectifier D2PAK Power Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. http://onsemi.com Features • • • • • • • • • • Package Designed for Power Surface Mount Applications Ultrafast 28 Nanosecond Recovery Times 175°C Operating Junction Temperature Epoxy Meets UL 94 V−0 @ 0.125 in High Temperature Glass Passivated Junction High Voltage Capability Low Leakage Specified @ 150°C Case Temperature Short Heat Sink Tab Manufactured − Not Sheared! Similar in Size to Industrial Standard TO−220 Package Pb−Free Packages are Available ULTRAFAST RECTIFIER 8.0 AMPERES, 400 VOLTS 1 4 3 4 1 Mechanical Characteristics: 3 • Case: Epoxy, Molded, Epoxy Meets UL 94, V−0 • Weight: 1.7 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • D2PAK CASE 418B STYLE 3 MARKING DIAGRAM Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (>400 V) Human Body Model, 3B (>8000 V) AY WW UH840G AKA A Y WW UH840 G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION Device Package Shipping† MURHB840CT D2PAK 50 Units/Rail MURHB840CTG D2PAK 50 Units/Rail (Pb−Free) MURHB840CTT4 D2PAK 800/Tape & Reel MURHB840CTT4G D2PAK 800/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 August, 2011 − Rev. 5 1 Publication Order Number: MURHB840CT/D MURHB840CT MAXIMUM RATINGS Rating Symbol Value Units Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 400 V Average Rectified Forward Current (Rated VR, TC = 120°C) Total Device IF(AV) 4.0 8.0 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 120°C) IFM 8.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 100 A Controlled Avalanche Energy WAVAL 20 mJ Operating Junction and Storage Temperature Range TJ, Tstg −65 to +175 °C Symbol Value Unit Maximum Thermal Resistance, Junction−to−Case RqJC 3.0 °C/W Maximum Thermal Resistance, Junction−to−Ambient RqJA 50 °C/W THERMAL CHARACTERISTICS (Per Leg) Rating Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (Per Leg) Symbol Max Unit Maximum Instantaneous Forward Voltage (Note 1) Characteristic (iF = 4.0 A, TC = 150°C) (iF = 4.0 A, TC = 25°C) vF 1.9 2.2 V Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TC = 150°C) (Rated DC Voltage, TC = 25°C) iR 500 10 mA (IF = 1.0 A, di/dt = 50 A/ms) trr 28 ns Maximum Reverse Recovery Time 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0% http://onsemi.com 2 1000 500 100 IR, REVERSE CURRENT (A) μ 50 TJ = 150°C 20 10 100°C 5 25°C 2 1 0.5 0.2 0.1 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 50 20 10 100°C 5 25°C 2 1 0.5 0.2 0.1 2.4 TJ = 150°C 200 100 0 50 100 150 200 250 300 350 400 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current, Per Leg 10 1000 RATED VR APPLIED RqJC = 3°C/W 6 C, CAPACITANCE (pF) 8 DC 4 SQUARE WAVE 100 10 2 0 110 120 130 140 150 160 TC, CASE TEMPERATURE (°C) 170 180 1 0.01 Figure 3. Current Derating, Case PF(AV) , AVERAGE POWER DISSIPATION (WATTS) I F, AVERAGE POWER DISSIPATION (WATTS) i F, INSTANTANEOUS FORWARD CURRENT (AMP) MURHB840CT 0.1 1 10 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Typical Capacitance, Per Leg 20 18 TJ = 175°C SQUARE WAVE 16 DC 14 12 10 8 6 4 2 0 1 2 3 4 5 6 7 8 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 9 Figure 5. Forward Power Dissipation, Per Leg http://onsemi.com 3 10 100 MURHB840CT PACKAGE DIMENSIONS D2PAK 3 CASE 418B−04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. C E V W −B− 4 1 2 A S 3 −T− SEATING PLANE K J G D W H 3 PL 0.13 (0.005) M T B M INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE VARIABLE CONFIGURATION ZONE N R P U L M DIM A B C D E F G H J K L M N P R S V L M L M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MURHB840CT ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MURHB840CT/D