MURHB860CT

MURHB860CT Preferred Device MEGAHERTZt Power Rectifier D2PAK Power Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features http://onsemi.com • • • • • • • • • • Package Designed for Power Surface Mount Applications Ultrafast 35 Nanosecond Recovery Times 175°C Operating Junction Temperature Epoxy Meets UL 94 V−0 @ 0.125 in High Temperature Glass Passivated Junction High Voltage Capability to 600 V Low Leakage Specified @ 150°C Case Temperature Short Heat Sink Tab Manufactured − Not Sheared! Similar in Size to Industry Standard TO−220 Package Pb−Free Packages are Available ULTRAFAST RECTIFIER 8.0 AMPERES, 600 VOLTS 1 4 3 4 1 3 D2PAK CASE 418B STYLE 3 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 1.7 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds MAXIMUM RATINGS (Per Leg) Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 120°C) Total Device Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 120°C) Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction and Storage Temperature Range Symbol VRRM VRWM VR IF(AV) IFM IFSM Value 600 Unit V MARKING DIAGRAM Leads are Readily Solderable AY WW UH860G AKA A Y WW UH860 G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity 4.0 8.0 8.0 100 A ORDERING INFORMATION A A Device MURHB860CT MURHB860CTG Package D2PAK D2PAK (Pb−Free) D2PAK D2PAK (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. Shipping† 50 Units/Rail 50 Units/Rail 800/Tape & Reel 800/Tape & Reel TJ, Tstg −65 to +175 °C MURHB860CTT4 MURHB860CTT4G Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2006 1 February, 2006 − Rev. 2 Publication Order Number: MURHB860CT/D MURHB860CT THERMAL CHARACTERISTICS (Per Leg) Rating Maximum Thermal Resistance, Junction−to−Case Maximum Thermal Resistance, Junction−to−Ambient Symbol RqJC RqJA Value 3.0 50 Unit °C/W °C/W ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 4.0 A, TC = 150°C) (iF = 4.0 A, TC = 25°C) Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TC = 150°C) (Rated DC Voltage, TC = 25°C) Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0% Symbol vF Max 2.5 2.8 500 10 35 Unit V iR mA trr ns http://onsemi.com 2 MURHB860CT PACKAGE DIMENSIONS D2PAK 3 CASE 418B−04 ISSUE J C E −B− 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. INCHES DIM MIN MAX A 0.340 0.380 B 0.380 0.405 C 0.160 0.190 D 0.020 0.035 E 0.045 0.055 F 0.310 0.350 G 0.100 BSC H 0.080 0.110 J 0.018 0.025 K 0.090 0.110 L 0.052 0.072 M 0.280 0.320 N 0.197 REF P 0.079 REF R 0.039 REF S 0.575 0.625 V 0.045 0.055 STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 V W A 1 2 3 S −T− SEATING PLANE K G D 3 PL 0.13 (0.005) H M W J TB M VARIABLE CONFIGURATION ZONE L M R N U L P L M M F VIEW W−W 1 F VIEW W−W 2 F VIEW W−W 3 SOLDERING FOOTPRINT* 8.38 0.33 10.66 0.42 1.016 0.04 5.08 0.20 3.05 0.12 17.02 0.67 SCALE 3:1z mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 3 MURHB860CT MEGAHERTZ is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 MURHB860CT/D