MURS230T3

MURS230T3, MURS240T3 Preferred Devices Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. http://onsemi.com Features • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.95 Volts Max @ 2.0 A, TJ = 150°C) Pb−Free Packages are Available ULTRAFAST RECTIFIERS 2 AMPERES, 300−400 VOLTS Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 95 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead SMB CASE 403A MARKING DIAGRAM MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURS230T3 MURS240T3 Average Rectified Forward Current @ TL = 150°C @ TL = 125°C Non−Repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction Temperature Range Symbol VRRM VRWM VR IF(AV) 1.0 2.0 IFSM 35 A Value Unit V 300 400 A AYWW U2x G G TJ −65 to +175 °C Assembly Location Year Work Week Device Code x = F for MURS230T3 = G for MURS240T3 G = Pb−Free Package (Note: Microdot may be in either location) A Y WW U2x = = = = THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction−to−Lead (TL = 25°C) Symbol RqJL Max 13 Unit °C/W ORDERING INFORMATION Device MURS230T3 MURS230T3G MURS240T3 MURS240T3G Package SMB SMB (Pb−Free) SMB SMB (Pb−Free) Shipping † 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2006 1 February, 2006 − Rev. 5 Publication Order Number: MURS230T3/D MURS230T3, MURS240T3 ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 2.0 A, TJ = 25°C) (iF = 2.0 A, TJ = 150°C) Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IR to 0.25 A) Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. Symbol vF 1.30 1.05 iR 5.0 150 trr 65 50 tfr 50 ns ns mA Value Unit V 10 7.0 5.0 10 7.0 5.0 3.0 I , INSTANTANEOUS FORWARD CURRENT (AMPS) F 2.0 175°C 100°C m I , INSTANTANEOUS FORWARD CURRENT ( A) F 3.0 2.0 175°C 100°C T C = 2 5° C 1.0 0.7 0.5 TC = 25°C 1.0 0.7 0.5 0.3 0.2 0.3 0.2 0.1 0.07 0.05 0.1 0.07 0.05 0.03 0.02 0.03 0.02 0.01 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 vF, INSTANTANEOUS VOLTAGE (VOLTS) 0.01 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 vF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage http://onsemi.com 2 MURS230T3, MURS240T3 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 0.08 0.04 0.02 0.008 0.004 0.002 0 50 100 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 0.08 0.04 0.02 0.008 0.004 0.002 0 50 100 IR, REVERSE CURRENT (mA) IR, REVERSE CURRENT ( mA) TJ = 175°C TJ = 175°C TJ = 100°C TJ = 100°C TJ = 25°C TJ = 25°C 150 200 250 300 350 400 150 200 250 300 350 400 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current* * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied VR is sufficiently below rated VR. 30 25 C, CAPACITANCE (pF) 20 15 10 5 0 0 4.0 8.0 12 16 20 24 28 32 36 40 VR, REVERSE VOLTAGE (VOLTS) NOTE: TYPICAL CAPACITANCE AT 0 V = 26 pF 35 30 C, CAPACITANCE (pF) 25 20 15 10 5 0 0 4 Figure 4. Maximum Reverse Current* NOTE: MAXIMUM CAPACITANCE AT 0 V = 30 pF 8 12 16 20 24 28 32 36 40 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance Figure 6. Maximum Capacitance PF(AV), AVERAGE POWER DISSIPATION (WATTS) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 10 9 8 7 6 5 4 3 2 1 0 80 90 100 110 120 130 140 150 160 170 180 TC, CASE TEMPERATURE (°C) SQUARE WAVE dc RATED VOLTAGE APPLIED RqJL = 13°C/W TJ = 175°C 5 TJ = 175°C 4 3 SQUARE WAVE dc 1 0 0 0.5 1.0 1.5 2.0 2.5 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 2 Figure 7. Current Derating, Case Figure 8. Power Dissipation http://onsemi.com 3 MURS230T3, MURS240T3 PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE F HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF b D DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 c A1 SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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