MURS240T3

MURS230T3G, NRVUS230T3G, MURS240T3G, NRVUS240T3G Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. www.onsemi.com ULTRAFAST RECTIFIERS 2 AMPERES, 300−400 VOLTS Features • • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.95 Volts Max @ 2.0 A, TJ = 150°C) NRVUS and SURS8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant SMB CASE 403A MARKING DIAGRAM Mechanical Characteristics: AYWW U2x G G • Case: Epoxy, Molded • Weight: 95 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Rating: ♦ Human Body Model = 3A (> 4 kV) ♦ Machine Model = C (> 400 V) A Y WW U2x G = = = = Assembly Location Year Work Week Device Code x = F for MURS230T3 = G for MURS240T3 = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† MURS230T3G SMB (Pb−Free) 2,500 / Tape & Reel NRVUS230T3G,NRVUS230VT3G SMB (Pb−Free) 2,500 / Tape & Reel MURS240T3G SMB (Pb−Free) 2,500 / Tape & Reel NRVUS240T3G, NRVUS240VT3G SMB (Pb−Free) 2,500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 October, 2016 − Rev. 9 1 Publication Order Number: MURS230T3/D MURS230T3G, NRVUS230T3G, MURS240T3G, NRVUS240T3G MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURS230T3G/NRVUS230T3G MURS240T3G/NRVUS240T3G VRRM VRWM VR Average Rectified Forward Current @ TL = 150°C @ TL = 125°C IF(AV) Non−Repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM Value Unit V 300 400 A 1.0 2.0 Operating Junction Temperature Range A 35 TJ −65 to +175 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction−to−Lead (TL = 25°C) Symbol Max Unit RqJL 13 °C/W Symbol Value Unit ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 2.0 A, TJ = 25°C) (iF = 2.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IR to 0.25 A) trr Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V) tfr V 1.30 1.05 mA 5.0 150 ns 65 50 ns 50 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. www.onsemi.com 2 MURS230T3G, NRVUS230T3G, MURS240T3G, NRVUS240T3G 10 10 7.0 7.0 5.0 5.0 3.0 3.0 100°C 175°C I , INSTANTANEOUS FORWARD CURRENT (AMPS) F I , INSTANTANEOUS FORWARD CURRENT (AMPS) F 175°C 2.0 TC = 25°C 1.0 0.7 0.5 0.3 0.2 TC = 25°C 1.0 0.7 0.5 0.3 0.2 0.1 0.1 0.07 0.07 0.05 0.05 0.03 0.03 0.02 0.02 0.01 100°C 2.0 0.01 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 0.3 0.5 0.7 vF, INSTANTANEOUS VOLTAGE (VOLTS) 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 vF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 2. Maximum Forward Voltage Figure 1. Typical Forward Voltage 100 1000 IR, REVERSE CURRENT (mA) IR, REVERSE CURRENT (mA) TJ = 175°C 10 TJ = 150°C 1 TJ = 100°C 0.1 0.01 TJ = 25°C 0.001 TJ = 175°C 100 TJ = 150°C TJ = 100°C 10 1 TJ = 25°C 0.1 0 50 100 150 200 250 300 350 400 0 50 100 150 200 250 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current* Figure 4. Maximum Reverse Current for MURS230T3G, NRVUS230T3G * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estim­ ated from these same curves if applied VR is sufficiently below rated VR. www.onsemi.com 3 300 MURS230T3G, NRVUS230T3G, MURS240T3G, NRVUS240T3G IR, REVERSE CURRENT (mA) 1000 TJ = 175°C 100 TJ = 150°C 10 TJ = 100°C 1 TJ = 25°C 0.1 0 50 100 150 200 250 350 300 400 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Maximum Reverse Current for MURS240T3G, NRVUS240T3G 35 30 30 NOTE: TYPICAL CAPACITANCE AT 0 V = 26 pF 20 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 25 15 10 5 25 20 15 10 5 0 0 4.0 8.0 12 16 20 24 28 32 36 40 0 16 20 24 28 32 36 VR, REVERSE VOLTAGE (VOLTS) 9 8 7 6 dc 5 4 3 2 SQUARE WAVE 0 90 12 Figure 7. Maximum Capacitance RATED VOLTAGE APPLIED RqJL = 13°C/W TJ = 175°C 80 8 VR, REVERSE VOLTAGE (VOLTS) 10 1 4 Figure 6. Typical Capacitance PF(AV) , AVERAGE POWER DISSIPATION (WATTS) 0 IF(AV) , AVERAGE FORWARD CURRENT (AMPS) NOTE: MAXIMUM CAPACITANCE AT 0 V = 30 pF 100 110 120 130 140 150 160 170 180 5 TJ = 175°C 4 3 SQUARE WAVE 2 dc 1 0 0 TC, CASE TEMPERATURE (°C) 0.5 1.0 1.5 2.0 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation Figure 8. Current Derating, Case www.onsemi.com 4 40 2.5 MURS230T3G, NRVUS230T3G, MURS240T3G, NRVUS240T3G PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE J HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED MIN 1.95 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.30 2.47 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.077 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.091 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.097 0.008 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ◊ N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MURS230T3/D MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE J SCALE 1:1 DATE 19 JUL 2012 SCALE 1:1 Polarity Band Non−Polarity Band HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED A L L1 c MIN 1.95 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.30 2.47 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.077 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.091 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.097 0.008 0.087 0.012 0.156 0.181 0.220 0.063 GENERIC MARKING DIAGRAM* A1 SOLDERING FOOTPRINT* 2.261 0.089 AYWW XXXXXG G AYWW XXXXXG G Polarity Band Non−Polarity Band XXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) 2.743 0.108 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ASB42669B SMB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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