MURS260T3

DATA SHEET www.onsemi.com Power Rectifiers, Ultra-Fast Recovery MURS260, SURS8260 ULTRAFAST RECTIFIERS 2 AMPERES 600 VOLTS Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features • • • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (1.20 Volts Max @ 2.0 A, TJ = 150°C) AEC−Q101 Qualified and PPAP Capable SURS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements These Devices are Pb−Free and are RoHS Compliant Mechanical Characteristics • Case: Epoxy, Molded • Weight: 95 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ♦ MARKING DIAGRAM AYWW U2JG G U2J A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION • Polarity: Polarity Band Indicates Cathode Lead • ESD Ratings: ♦ SMB CASE 403A Package Shipping† MURS260T3G SMB (Pb−Free) 2,500 / Tape & Reel SURS8260T3G SMB (Pb−Free) 2,500 / Tape & Reel SURS8260T3G−VF01 SMB (Pb−Free) 2,500 / Tape & Reel SURS8260T3G−GA01 SMB (Pb−Free) 2,500 / Tape & Reel Device Human Body Model = 3B (> 8 kV) Charged Device Model > 1000 V MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 600 V Average Rectified Forward Current IF(AV) 2.0 @ TL = 125°C A Non−Repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 35 A TJ *65 to +175 °C Operating Junction Temperature †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 April, 2023 − Rev. 7 1 Publication Order Number: MURS260T3/D MURS260, SURS8260 THERMAL CHARACTERISTICS Characteristic Symbol Thermal Resistance, Junction−to−Lead (TL = 25°C) Value RqJL Unit °C/W 13 ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 1) (iF = 2.0 A, TJ = 25°C) (iF = 2.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IR to 0.25 A) trr Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V) tfr Value Unit V 1.45 1.20 mA 5.0 150 ns 75 50 ns 50 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. 10 10 7.0 7.0 175°C 5.0 TC = 175°C 5.0 TC = 100°C 100°C 3.0 3.0 TC = 25°C TC = 25°C 2.0 IF , INSTANTANEOUS FORWARD CURRENT (AMPS) I , INSTANTANEOUS FORWARD CURRENT (AMPS) F 2.0 1.0 0.7 0.5 0.3 0.2 0.1 1.0 0.7 0.5 0.3 0.2 0.1 0.07 0.07 0.05 0.05 0.03 0.03 0.02 0.02 0.01 0.01 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 VF, INSTANTANEOUS VOLTAGE (VOLTS) VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage www.onsemi.com 2 2.1 2.3 MURS260, SURS8260 100 100 TJ = 175°C IR, REVERSE CURRENT (m A) IR, REVERSE CURRENT (m A) TJ = 175°C 10 TJ = 100°C 1.0 TJ = 25°C 0.1 0.01 10 TJ = 100°C 1.0 TJ = 25°C 0.1 0.01 0 100 300 200 400 500 600 700 0 100 VR, REVERSE VOLTAGE (VOLTS) 200 300 400 500 600 700 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current* Figure 4. Maximum Reverse Current * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied VR is sufficiently below rated VR. NOTE: TYPICAL CAPACITANCE AT 0 V = 24 pF 20 15 10 5.0 0 0 4.0 8.0 12 16 20 24 28 32 36 40 10 RATED VOLTAGE APPLIED RqJL = 13°C/W TJ = 175°C 9.0 8.0 7.0 6.0 5.0 4.0 DC 3.0 2.0 SQUARE WAVE 1.0 0 0 20 40 60 80 100 120 140 160 VR, REVERSE VOLTAGE (VOLTS) TC, CASE TEMPERATURE (°C) Figure 5. Typical Capacitance Figure 6. Current Derating, Case PF(AV) , AVERAGE POWER DISSIPATION (WATTS) C, CAPACITANCE (pF) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 25 5.0 SQUARE WAVE 4.0 3.0 DC TJ = 175°C 2.0 1.0 0 0 0.5 1.0 1.5 2.0 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 7. Power Dissipation www.onsemi.com 3 2.5 180 200 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE J SCALE 1:1 DATE 19 JUL 2012 SCALE 1:1 Polarity Band Non−Polarity Band HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED A L L1 c MIN 1.95 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.30 2.47 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.077 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.091 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.097 0.008 0.087 0.012 0.156 0.181 0.220 0.063 GENERIC MARKING DIAGRAM* A1 SOLDERING FOOTPRINT* 2.261 0.089 AYWW XXXXXG G AYWW XXXXXG G Polarity Band Non−Polarity Band XXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) 2.743 0.108 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ASB42669B SMB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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