MURS360BT3

MURS360BT3 Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features http://onsemi.com • • • • • • • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction This is a Pb−Free Device ULTRAFAST RECTIFIERS 3 AMPERES 600 VOLTS Mechanical Characteristics Case: Epoxy, Molded Epoxy Meets UL 94 V−O @ 0.125 in Weight: 95 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Rating: Human Body Model (HBM) 3B Machine Model (MM) C SMB CASE 403A MARKING DIAGRAM AYWW B36BG G MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current Non−Repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction Temperature Symbol VRRM VRWM VR IF(AV) IFSM Value 600 Unit V B36B = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) 3.0 @ TL = 105°C 100 A A ORDERING INFORMATION TJ *65 to +175 °C Device MURS360BT3G Package SMB (Pb−Free) Shipping† 2500/Tape & Reel Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 May, 2011 − Rev. 2 1 Publication Order Number: MURS360BT3/D MURS360BT3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) 1. Mounted with minimum recommended pad size, PC Board FR4. Symbol RqJL RqJA Value 14 125 Unit °C/W ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 2) (iF = 3.0 A, TJ = 25°C) (iF = 3.0 A, TJ = 150°C) Maximum Instantaneous Reverse Current (Note 2) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IR to 0.25 A) Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V) 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. Symbol vF Typ − 0.83 − 95 Max 1.25 1.05 3.0 150 75 50 50 Unit V iR mA trr ns tfr ns TYPICAL CHARACTERISTICS IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) 10 150°C 1 10 150°C 1 125°C 25°C 125°C 25°C 0.1 0.1 0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Forward Voltage Ir, REVERSE CURRENT (mA) 150°C 0.01 125°C 0.001 0.0001 25°C Ir, REVERSE CURRENT (mA) 0.1 1 Figure 2. Maximum Forward Voltage 0.1 0.01 0.001 150°C 125°C 0.00001 0.000001 0.0001 0.00001 25°C 0 100 200 300 400 500 600 0 100 200 300 400 500 600 Vr, REVERSE VOLTAGE (V) Vr, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current http://onsemi.com 2 Figure 4. Maximum Reverse Current MURS360BT3 TYPICAL CHARACTERISTICS 70 60 C, CAPACITANCE (pF) 50 40 30 20 10 0 0 20 40 60 80 100 TJ = 25°C f = 1 MHz IF(AV), AVERAGE FORWARD CURRENT (A) 5 4 Square 3 2 1 0 dc 65 75 85 95 105 115 125 135 145 155 Vr, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C) Figure 5. Typical Capacitance IF(AV), AVERAGE FORWARD CURRENT (A) 3 RqJA = 71°C/W dc 2 dc 1 Square Wave RqJA = 120°C/W No Heatsink PF(AV), AVERAGE POWER DISSIPATION (W) 4 Figure 6. Current Derating, Lead TJ = 150°C 3 Square Wave dc 2 1 0 0 25 50 75 100 125 150 0 0 1 2 3 4 TA, AMBIENT TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (A) Figure 7. Current Derating, Ambient 4 PF(AV), AVERAGE POWER DISSIPATION (W) TJ = 150°C 3 Figure 8. Typical Forward Power Dissipation Square Wave dc 2 1 0 0 1 2 3 4 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 9. Maximum Forward Power Dissipation http://onsemi.com 3 MURS360BT3 100 50% Duty Cycle 10 R(t) (°C/W) 20% 10% 5% 2% 1 1% 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (s) 1 10 100 1000 Figure 10. Thermal Response, Junction−to−Ambient http://onsemi.com 4 MURS360BT3 PACKAGE DIMENSIONS SMB DO−214AA CASE 403A−03 ISSUE H HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.20 2.28 0.10 0.19 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.087 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.090 0.007 0.087 0.012 0.156 0.181 0.220 0.063 b D POLARITY INDICATOR OPTIONAL AS NEEDED A L L1 c A1 SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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