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NB100LVEP222MNRG

NB100LVEP222MNRG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    VFQFN52

  • 描述:

    IC CLK BUFFER 1:15 1GHZ

  • 数据手册
  • 价格&库存
NB100LVEP222MNRG 数据手册
2.5 V/3.3 V 2:1:15 Differential ECL/PECL ÷1/÷2 Clock Driver NB100LVEP222 The NB100LVEP222 is a low skew 2:1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential configuration or single−ended (with VBB output reference bypassed and connected to the unused input of a pair). Either of two fully differential clock inputs may be selected. Each of the four output banks of 2, 3, 4, and 6 differential pairs may be independently configured to fanout 1X or 1/2X of the input frequency. When the output banks are configured with the B1 mode, data can also be distributed. The LVEP222 specifically guarantees low output to output skew. Optimal design, layout, and processing minimize skew within a device and from lot to lot. This device is an improved version of the MC100LVE222 with higher speed capability and reduced skew. The fsel pins and CLK_Sel pin are asynchronous control inputs. Any changes may cause indeterminate output states requiring an MR pulse to resynchronize any 1/2X outputs (See Figure 3). Unused output pairs should be left unterminated (open) to reduce power and switching noise. The NB100LVEP222, as with most ECL devices, can be operated from a positive VCC/VCC0 supply in LVPECL mode. This allows the LVEP222 to be used for high performance clock distribution in +2.5/3.3 V systems. In a PECL environment series or Thevenin line, terminations are typically used as they require no additional power supplies. For more information on using PECL, designers should refer to Application Note AN1406/D. For a SPICE model, refer to Application Note AN1560/D. The VBB pin, an internally generated voltage supply, is available to this device only. For single−ended LVPECL input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC/VCC0 via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. Single−ended CLK input operation is limited to a VCC/VCC0 ≥ 3.0 V in LVPECL mode, or VEE ≤ −3.0 V in NECL mode. Features • • • • • www.onsemi.com 1 52 QFN−52 MN SUFFIX CASE 485M MARKING DIAGRAM* 52 1 NB100 LVEP222 AWLYYWWG A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Device Package Shipping NB100LVEP222MNG QFN−52 (Pb−Free) 260 Units / Tray 20 ps Output−to−Output Skew 85 ps Part−to−Part Skew Selectable 1x or 1/2x Frequency Outputs LVPECL Mode Operating Range: VCC/VCC0 = 2.375 V to 3.8 V with VEE = 0 V NECL Mode Operating Range: VCC/VCC0 = 0 V with VEE = −2.375 V to −3.8 V Internal Input Pulldown Resistors • • Performance Upgrade to ON Semiconductor’s MC100LVE222 • VBB Output • These Devices are Pb−Free, Halogen Free and are RoHS Compliant © Semiconductor Components Industries, LLC, 2015 April, 2021− Rev. 14 1 Publication Order Number: NB100LVEP222/D CLK0*, CLK0** CLK1*, CLK1** CLK_Sel* MR* Qa0:1, Qa0:1 Qb0:2, Qb0:2 Qc0:3, Qc0:3 Qd0:5, Qd0:5 fseln* VBB VCC, VCC0 VEE*** NC Qa0 Qa1 Qa1 VCC0 Qb0 Qb0 Qb1 Qb1 Qb2 Qb2 50 49 48 47 46 45 44 43 42 41 VCC0 Qa0 51 VCC 1 39 VCC0 MR 2 38 Qc0 fsela 3 37 Qc0 fselb 4 36 Qc1 CLK0 5 35 Qc1 CLK0 6 34 Qc2 CLK_SEL 7 33 Qc2 CLK1 8 32 Qc3 CLK1 9 31 Qc3 VBB 10 30 VCC0 fselc 11 29 NC fseld 12 28 NC VEE 13 27 VCC0 16 17 18 19 20 21 22 23 24 25 Qd5 Qd4 Qd4 Qd3 Qd3 Qd2 Qd2 Qd1 Qd1 Qd0 26 15 Qd5 Qd0 14 VCC0 NB100LVEP222 Figure 1. QFN−52 Pinout (Top View) Table 1. PIN DESCRIPTION PIN Exposed Pad (EP) 40 VCC0 52 NB100LVEP222 Table 2. FUNCTION TABLE Function FUNCTION ECL Differential Input Clock ECL Differential Input Clock ECL Clock Select ECL Master Reset ECL Differential Outputs ECL Differential Outputs ECL Differential Outputs ECL Differential Outputs ECL 1 or 2 Select Reference Voltage Output Positive Supply, VCC = VCC0 Negative Supply No Connect * Pins will default LOW when left open. ** Pins will default HIGH when left open. *** The thermally conductive exposed pad on the bottom of the package is electrically connected to VEE internally. www.onsemi.com 2 Input L H MR CLK_Sel fseln Active CLK0 ÷1 Reset CLK1 ÷2 NB100LVEP222 MR CLK0 CLK0 ÷1 CLK1 2 Qa0:1 Qa0:1 ÷2 CLK1 CLK_SEL VBB fsela 3 Qb0:2 Qb0:2 fselb 4 Qc0:3 Qc0:3 VCC/VCC0 VEE fselc 6 Qd0:5 Qd0:5 fseld Figure 2. Logic Diagram CLK MR Q (B2) Q (B1) Figure 3. Master Reset (MR) Timing Diagram www.onsemi.com 3 NB100LVEP222 Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor 37.5 kW ESD Protection Human Body Model Machine Model Charged Device Model > 2 kV > 200 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb−Free Pkg QFN−52 Level 2 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−O @ 0.125 in Transistor Count 821 Devices Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, refer to Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC/VCC0 PECL Mode Power Supply VEE = 0 V 6 V VEE NECL Mode Power Supply VCC/VCC0 = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC/VCC0 = 0 V 6 to 0 −6 to 0 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ±0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) (Note ) 0 lfpm 500 lfpm QFN−52 QFN−52 25 19.6 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) (Note ) 2S2P QFN−52 21 °C/W Tsol Wave Solder < 2 to 3 sec @ 248°C 265 °C VI ≤ VCC/VCC0 VI ≥ VEE Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 4 NB100LVEP222 Table 5. LVPECL DC CHARACTERISTICS VCC = VCC0 = 2.5 V; VEE = 0 V (Note 2) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit IEE Power Supply Current 100 125 150 104 130 156 112 140 168 mA VOH Output HIGH Voltage (Note 3) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV VOL Output LOW Voltage (Note 3) 555 680 900 555 680 900 555 680 900 mV VIH Input HIGH Voltage (Single−Ended) (Note 4) 1335 1620 1335 1620 1275 1620 mV VIL Input LOW Voltage (Single−Ended) (Note 4) 555 900 555 900 555 900 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 5) (Figure 5) 1.2 2.5 1.2 2.5 1.2 2.5 V 150 mA IIH Input HIGH Current IIL Input LOW Current 150 CLK CLK 0.5 −150 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 2. Input and output parameters vary 1:1 with VCC/VCC0. VEE can vary + 0.125 V to −1.3 V. 3. All loading with 50 W to VCC/VCC0 − 2.0 V. 4. Do not use VBB Pin #10 at VCC/VCC0 < 3.0 V (see AND8066/D). 5. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC/VCC0. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 6. LVPECL DC CHARACTERISTICS VCC = VCC0 = 3.3 V; VEE = 0.0 V (Note 6) −40°C 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit IEE Power Supply Current 100 125 150 104 130 156 112 140 168 mA VOH Output HIGH Voltage (Note 7) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output LOW Voltage (Note 7) 1355 1480 1700 1355 1480 1700 1355 1480 1700 mV VIH Input HIGH Voltage (Single−Ended) 2135 2420 2135 2420 2135 2420 mV VIL Input LOW Voltage (Single−Ended) 1355 1700 1355 1700 1355 1700 mV VBB Output Reference Voltage (Note 8) 1775 1975 1775 1975 1775 1975 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 9) (Figure 5) 1.2 3.3 1.2 3.3 1.2 3.3 V 150 mA Symbol Characteristic IIH Input HIGH Current IIL Input LOW Current 1875 150 CLK CLK 0.5 −150 1875 150 0.5 −150 0.5 −150 1875 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 6. Input and output parameters vary 1:1 with VCC/VCC0. VEE can vary + 0.925 V to −0.5 V. 7. All loading with 50 W to VCC/VCC0−2.0 V. 8. Single−Ended input operation is limited VCC/VCC0 ≥ 3.0 V in LVPECL mode. 9. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC/VCC0. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 5 NB100LVEP222 Table 7. LVNECL DC CHARACTERISTICS VCC = VCC0 = 0.0 V; VEE = −3.8 V to −2.375 V (Note 10) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 100 125 150 104 130 156 112 140 168 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 11) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV VOL Output LOW Voltage (Note 11) −1945 −1820 −1600 −1945 −1820 −1600 −1945 −1820 −1600 mV VIH Input HIGH Voltage (Single−Ended) −1165 −880 −1165 −880 −1165 −880 mV −1600 −1945 −1600 −1945 −1600 mV −1325 −1525 −1325 −1525 −1325 mV 0.0 V 150 mA VIL Input LOW Voltage (Single−Ended) −1945 VBB Output Reference Voltage (Note 12) −1525 VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 13) (Figure 5) IIH Input HIGH Current IIL Input LOW Current −1425 VEE + 1.2 0.0 VEE + 1.2 150 CLK CLK 0.5 −150 −1425 0.0 VEE + 1.2 150 0.5 −150 −1425 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 10. Input and output parameters vary 1:1 with VCC/VCC0. 11. All loading with 50 W to VCC/VCC0 − 2.0 V. 12. Single−Ended input operation is limited VEE ≤ −3.0 V in NECL mode. 13. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC/VCC0. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 6 NB100LVEP222 Table 8. AC CHARACTERISTICS VCC = VCC0 = 2.375 to 3.8 V; VEE = 0.0 V or VCC = VCC0 = 0.0 V; VEE = −2.375 to −3.8 V (Note 14) −40°C Symbol Characteristic Min Typ 25°C Max 85°C Min Typ Max 500 525 425 600 650 650 700 700 875 900 1000 1200 Min Typ Max 500 500 400 600 650 600 850 700 975 900 1150 1200 Unit VOpp Differential Output Voltage (Figure 4) fout = 50 MHz fout = 0.8 GHz fout = 1.0 GHz 500 550 500 600 650 650 tPLH tPHL Propagation Delay (Differential Configuration) CLKx−QX MR−QXX 650 700 800 900 900 1200 tskew Within−Device Skew (Note 15) (÷1 Mode) − Qa[0:1] − Qb[0:2] − Qc[0:3] − Qd[0:5] 10 10 20 10 40 40 60 40 10 10 20 10 40 40 60 40 10 10 20 10 40 40 60 40 − QaN, QbN, QdN − All Outputs 10 20 40 60 10 20 40 60 10 20 40 60 − Qa[0:1] − Qb[0:2] − Qc[0:3] − Qd[0:5] 15 15 20 15 70 70 70 70 10 10 20 10 40 40 50 40 15 10 15 15 70 40 70 70 − QaN, QbN, QdN − All Outputs 15 20 70 70 10 20 40 50 15 15 70 70 Device−to−Device Skew (Differential Configuration) (Note 16) 85 300 85 300 85 300 ps Random Clock Jitter (Figure 4) (RMS) 1 5 1 4 1 5 ps tskew tskew tJITTER Within−Device Skew (Note 15) (÷2 Mode) mV ps ps ps VPP Input Swing (Differential Configuration) (Note 17) (Figure 5) 150 800 1200 150 800 1200 150 800 1200 mV DCO Output Duty Cycle 49.5 50 50.5 49.5 50 50.5 49.5 50 50.5 % Output Rise/Fall Time 20%−80% 100 200 300 100 200 300 150 250 350 ps tr/tf NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 14. Measured with LVPECL 750 mV source, 50% duty cycle clock source. All outputs loaded with 50 W to VCC/VCC0 − 2.0 V. 15. Skew is measured between outputs under identical transitions and operating conditions. 16. Device−to−Device skew for identical transitions at identical VCC/VCC0 levels. 17. VPP is the differential configuration input voltage swing required to maintain AC characteristics including tPD and device−to−device skew. www.onsemi.com 7 NB100LVEP222 10 9.0 800 8.0 Q AMP (÷ 2) 700 7.0 6.0 600 Q AMP (÷ 1) 5.0 500 4.0 400 3.0 RMS JITTER 2.0 300 200 RMS JITTER (ps) VOPP, OUTPUT VOLTAGE (mV) 900 1.0 0.1 0.5 1.0 INPUT FREQUENCY (GHz) 0 2.0 1.5 Figure 4. Output Voltage (VOPP) versus Input Frequency and Random Clock Jitter (tJITTER) @ 255C VCC/VCC0(LVPECL) VPP VIH(DIFF) VIHCMR VIL(DIFF) VEE Figure 5. LVPECL Differential Input Levels Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 6. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) www.onsemi.com 8 NB100LVEP222 Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1642/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN52 8x8, 0.5P CASE 485M−01 ISSUE C 1 52 D SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ PIN ONE REFERENCE DATE 16 FEB 2010 B DIM A A1 A2 A3 b D D2 E E2 e K L E 2X 0.15 C 2X 0.15 C A2 0.10 C GENERIC MARKING DIAGRAM A 0.08 C SEATING PLANE A3 A1 1 REF C XXXXXXXXX XXXXXXXXX AWLYYWWG D2 14 52 X L 26 27 13 XXXXXXXXX A WL YY WW G E2 39 1 52 X K MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.60 0.80 0.20 REF 0.18 0.30 8.00 BSC 6.50 6.80 8.00 BSC 6.50 6.80 0.50 BSC 0.20 --0.30 0.50 52 40 e 52 X b = Device Code = Assembly Site = Wafer Lot = Year = Work Week = Pb−Free Package RECOMMENDED SOLDERING FOOTPRINT NOTE 3 0.10 C A B 8.30 0.05 C 52X 0.62 6.75 6.75 PKG OUTLINE DOCUMENT NUMBER: DESCRIPTION: 98AON12057D 52 PIN QFN, 8X8, 0.5P 0.50 PITCH 8.30 52X 0.30 DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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