NB2762ASNR2

NB2762A Low Power, Reduced EMI Clock Synthesizer The NB2762A is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. The NB2762A reduces ElectroMagnetic Interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The NB2762A allows significant system cost savings by reducing the number of circuit board layers, ferrite beads and shielding that are traditionally required to pass EMI regulations. The NB2762A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. The NB2762A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal's bandwidth is called `spread spectrum clock generation'. The NB2762A is targeted towards all portable devices with very low power requirements like MP3 players and digital still cameras. Features http://onsemi.com MARKING DIAGRAM* TSOP-6 (TSOT-23-6) SN SUFFIX CASE 318G 6 1 E04AYWG G 1 E04 A Y W G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. • • • • • • • • • • Generates an EMI Optimized Clocking Signal at the Output Integrated Loop Filter Components Operates with a 3.3 V / 2.5 V Supply Operating Current less than 3.0 mA Low Power CMOS Design Input Frequency Range: 6.0 MHz to 12 MHz for 2.5 V Input Frequency Range: 6.0 MHz to 13 MHz for 3.3 V Generates a 1X Low EMI Spread Spectrum clock of the Input Frequency Frequency Deviation -1.25% (TYP) @ 10 MHz Available in TSOP-6 Package (TSOT-23-6) Pb-Free Package is Available ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2006 1 December, 2006 - Rev. 3 Publication Order Number: NB2762A/D NB2762A PD VDD Modulation XIN/CLKIN XOUT Crystal Oscillator Frequency Divider Phase Detector Feedback Divider PLL Loop Filter VCO Output Divider ModOUT Figure 1. Block Diagram Table 1. KEY SPECIFICATIONS Description Supply Voltages Frequency Range Cycle-to-Cycle Jitter Output Duty Cycle Modulation Rate Equation Frequency Deviation For 2.5 V Supply For 3.3 V Supply VSS Specification VDD = 3.3 V / 2.5 V 6 MHz < CLKIN < 12 MHz 6 MHz < CLKIN < 13 MHz 200 ps (maximum) 45/55% (worst case) FIN/256 -1.25% (TYP) @ 10 MHz PD 1 6 VSS XOUT 2 NB2762A 5 ModOUT XIN/CLKIN 3 4 VDD Figure 2. Pin Configuration Table 2. PIN DESCRIPTION Pin # 1 2 3 4 5 6 Pin Name PD XOUT XIN/CLKIN VDD ModOUT VSS Type I O I P O P Description Powerdown control pin. Pull low to enable powerdown mode. Connect to VDD if not used. Crystal connection. If using an external reference, this pin must be left unconnected. Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. Power supply for the entire chip. Spread spectrum clock output. Ground connection. http://onsemi.com 2 NB2762A Figure 3. Modulation Profile Table 3. MAXIMUM RATINGS Symbol VDD, VIN TSTG TA Ts TJ TDV Description Voltage on any pin with respect to Ground Storage Temperature Operating Temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per MIL-STD-883, Method 3015) Rating 0.5 to +7.0 -65 to +125 0 to 70 260 150 2 Unit V °C °C °C °C kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 3 NB2762A Table 4. DC ELECTRICAL CHARACTERISTICS FOR 2.5 V SUPPLY (Test Conditions: All parameters are measured at room temperature 25°C) Symbol VIL VIH IIL IIH IXOL IXOH VOL VOH IDD ICC VDD tON ZOUT Input LOW Voltage Input HIGH Voltage Input LOW Current Input HIGH Current XOUT Output LOW Current (@ 0.5 V, VDD = 2.5 V) XOUT Output HIGH Current (@ 1.8 V, VDD = 2.5 V) Output LOW Voltage (VDD = 2.5 V, IOL = 8.0 mA) Output HIGH Voltage (VDD = 2.5 V, IOH = 8.0 mA) Static Supply Current (Note 1) Dynamic Supply Current (2.5 V, 10 MHz, and No Load) Operating Voltage Powerup Time (first locked cycle after powerup) (Note 2) Clock Output Impedance 50 2.375 2.0 2.5 2.625 5.0 1.8 10 3.0 3.0 0.6 Description Min GND - 0.3 2.0 Typ Max 0.8 VDD + 0.3 -35 35 Unit V V mA mA mA mA V V mA mA V mS W NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. PD pin is pulled low. 2. VDD and XIN/CLKIN input are stable, PD pin is made high from low. Table 5. AC ELECTRICAL CHARACTERISTICS FOR 2.5 V SUPPLY Symbol CLKIN ModOUT fd tLH (Note 3) tHL (Note 3) tJC tD Input Frequency Output Frequency Frequency Deviation Input Frequency = 6.0 MHz Input Frequency = 12 MHz 0.7 0.5 1.1 0.8 Description Min 6.0 6.0 Typ Max 12 12 ±1.75 ±0.95 1.4 1.0 200 45 50 55 Unit MHz MHz % ns ns ps % Output Rise Time (measured at 0.7 V to 1.7 V) Output Fall Time (measured at 1.7 V to 0.7 V) Jitter (Cycle-to-Cycle) Output Duty Cycle NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. tLH and tHL are measured at capacitive load of 15 pF. http://onsemi.com 4 NB2762A Table 6. DC ELECTRICAL CHARACTERISTICS FOR 3.3 V SUPPLY (Test Conditions: All parameters are measured at room temperature 25°C) Symbol VIL VIH IIL IIH IXOL IXOH VOL VOH IDD ICC VDD tON ZOUT Input LOW Voltage Input HIGH Voltage Input LOW Current Input HIGH Current XOUT Output LOW Current (@ 0.4 V, VDD = 3.3 V) XOUT Output HIGH Current (@ 2.5 V, VDD = 3.3 V) Output LOW Voltage (VDD = 3.3 V, IOL = 8.0 mA) Output HIGH Voltage (VDD = 3.3 V, IOH = 8.0 mA) Static Supply Current (Note 4) Dynamic Supply Current (3.3 V, 10 MHz, and No Load) Operating Voltage Powerup Time (first locked cycle after powerup) (Note 5) Clock Output Impedance 45 2.7 3.0 3.3 3.6 5.0 2.5 10 3.0 3.0 0.4 Description Min GND - 0.3 2.0 Typ Max 0.8 VDD + 0.3 -35 35 Unit V V mA mA mA mA V V mA mA V mS W NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. PD pin is pulled low. 5. VDD and XIN/CLKIN input are stable, PD pin is made high from low. Table 7. AC ELECTRICAL CHARACTERISTICS FOR 3.3 V SUPPLY Symbol CLKIN ModOUT fd tLH (Note 6) tHL (Note 6) tJC tD Input Frequency Output Frequency Frequency Deviation Input Frequency = 6.0 MHz Input Frequency = 13 MHz 0.5 0.4 1.0 0.9 Description Min 6.0 6.0 Typ Max 13 13 ±1.75 ±0.89 1.4 1.2 200 45 50 55 Unit MHz MHz % ns ns ps % Output Rise Time (measured at 0.8 V to 2.0 V) Output Fall Time (measured at 2.0 V to 0.8 V) Jitter (Cycle-to-Cycle) Output Duty Cycle NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. tLH and tHL are measured at capacitive load of 15 pF. http://onsemi.com 5 NB2762A XIN Crystal XOUT R1 = 510 W C1 = 27 pF C2 = 27 pF Figure 4. Typical Crystal Oscillator Circuit Table 8. TYPICAL CRYSTAL SPECIFICATIONS Fundamental AT Cut Parallel Resonant Crystal Nominal Frequency Frequency Tolerance Operating Temperature Range Storage Temperature Load Capacitance Shunt Capacitance ESR 8.0 MHz ±50 ppm or better at 25°C -25°C to +85°C -40°C to +85°C 18 pF 7 pF Maximum 25 W http://onsemi.com 6 NB2762A ORDERING INFORMATION Device NB2762ASNR2 NB2762ASNR2G Marking E04 E04 Temperature Range 0°C - 70°C 0°C - 70°C Package TSOP-6 (TSOT-23-6) TSOP-6 (TSOT-23-6) (Pb-Free) Shipping† 2500 Tape & Reel 2500 Tape & Reel Availability Now Contact Sales Representative †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 NB2762A PACKAGE DIMENSIONS TSOP-6 CASE 318G-02 ISSUE S D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° INCHES NOM 0.039 0.002 0.014 0.007 0.118 0.059 0.037 0.016 0.108 - 6 5 1 2 4 HE E 3 b e q 0.05 (0.002) A1 A L c DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. This product utilizes US Patent #6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, Dated 11-11-2003. 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