NB7L572MNR4G

NB7L572 2.5V / 3.3V Differential 4:1 Mux Input to 1:2 LVPECL Clock/Data Fanout / Translator http://onsemi.com Multi−Level Inputs w/ Internal Termination The NB7L572 is a high performance differential 4:1 Clock/Data input multiplexer and a 1:2 LVPECL Clock/Data fanout buffer. The INx/INx inputs includes internal 50 W termination resistors and will accept differential LVPECL, CML, or LVDS logic levels. The NB7L572 incorporates a pair of Select pins that will choose one of four differential inputs and will produce two identical LVPECL output copies of Clock or Data operating up to 7 GHz or 10 Gb/s, respectively. As such, NB7L572 is ideal for SONET, GigE, Fiber Channel, Backplane and other Clock/Data distribution applications. The NB7L572 INx/INx inputs, outputs and core logic are powered by a 2.5 V $5% V or 3.3 V $10% power supply. The two differential LVPECL outputs will swing 750 mV when externally terminated with a 50 W resistor to VCC – 2 V, and are optimized for low skew and minimal jitter. The NB7L572 is offered in a low profile 5x5 mm 32-pin QFN Pb-free package. Application notes, models, and support documentation are available at www.onsemi.com. The NB7L572 is a member of the GigaComm™ family of high performance clock products. Input Data Rate > 10.7 Gb/s Typical Data Dependent Jitter < 15 ps Maximum Input Clock Frequency > 7 GHz Typical Random Clock Jitter < 0.8 ps RMS Low Skew 1:2 LVPECL Outputs, < 15 ps max 4:1 Multi−Level Mux Inputs, Accepts LVPECL, CML LVDS 150 ps Typical Propagation Delay 45 ps Typical Rise and Fall Times Differential LVPECL Outputs, 750 mV Peak-to-Peak, Typical Operating Range: VCC = 2.375 V to 3.6 V Internal 50 W Input Termination Resistors VREFAC Reference Output −40°C to +85°C Ambient Operating Temperature These are Pb−Free Devices © Semiconductor Components Industries, LLC, 2012 June, 2012 − Rev. 2 32 1 1 32 NB7L 572 AWLYYWWG QFN32 MN SUFFIX CASE 488AM A WL YY WW G = Assembly Site = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. IN0 50W VT0 50W IN0 VREFAC0 Features • • • • • • • • • • • • • • MARKING DIAGRAM* 1 0 IN1 50W VT1 50W IN1 1 VREFAC1 IN2 50W VT2 50W IN2 2 Q0 Q0 Q1 Q1 3 VREFAC2 IN3 50W VT3 50W IN3 VREFAC3 SEL0 SEL1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Publication Order Number: NB7L572/D IN3 VREFAC3 VT3 IN3 IN2 VREFAC2 VT2 IN2 32 31 30 29 28 27 26 25 NB7L572 Exposed Pad (EP) IN0 1 24 GND VT0 2 23 VCC VREFAC0 3 22 Q1 IN0 4 21 Q1 IN1 5 20 VCC VT1 6 19 NC VREFAC1 7 18 SEL1 IN1 8 17 VCC 9 10 11 12 13 14 15 16 GND VCC Q0 Q0 VCC NC SEL0 VCC NB7L572 Figure 1. Pinout Configuration (Top View) Table 1. INPUT SELECT FUNCTION TABLE SEL1* SEL0* Clock / Data Input Selected 0 0 IN0 Input Selected 0 1 IN1 Input Selected 1 0 IN2 Input Selected 1 1 IN3 Input Selected *Defaults HIGH when left open. http://onsemi.com 2 NB7L572 Table 2. PIN DESCRIPTION Pin Name I/O 1, 4 5, 8 25, 28 29, 32 IN0, IN0 IN1, IN1 IN2, IN2 IN3, IN3 LVPECL, CML, LVDS Input Description 2, 6 26, 30 VT0, VT1 VT2, VT3 15 18 SEL0 SEL1 LVTTL/LVCMOS Input 14, 19 NC − No Connect 10, 13, 16 17, 20, 23 VCC − Positive Supply Voltage. All VCC pins must be connected to the positive power supply for correct DC and AC operation. 11, 12 21, 22 Q0, Q0 Q1, Q1 LVPECL Output 9, 24 GND 3 7 27 31 VREFAC0 VREFAC1 VREFAC2 VREFAC3 − Output Voltage Reference for Capacitor−Coupled Inputs − EP − The Exposed Pad (EP) on the QFN−32 package bottom is thermally connected to the die for improved heat transfer out of package. The exposed pad must be attached to a heat−sinking conduit. The pad is electrically connected to the die, and must be electrically connected to GND. Non−inverted, Inverted, Differential Clock or Data Inputs. Internal 100 W Center−tapped Termination Pin for INx / INx Input Select pins, default HIGH when left open through a 28k−W pull−up resistor. Input logic threshold is VCC/2. See Select Function, Table 1. Inverted, Non−inverted Differential Outputs. Negative Supply Voltage, connected to Ground 1. In the differential configuration when the input termination pins (VT0, VT1, VT2, VT3) are connected to a common termination voltage or left open, and if no signal is applied on INx / INx input, then the device will be susceptible to self−oscillation. 2. All VCC, and GND pins must be externally connected to a power supply for proper operation. http://onsemi.com 3 NB7L572 Table 3. ATTRIBUTES Characteristic ESD Protection Value Human Body Model Machine Model > 4 kV > 150 V QFN32 Level 1 Input Pullup Resistor (RPU) 28 kW Moisture Sensitivity (Note 3) Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 205 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 3. For additional information, see Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC Positive Power Supply GND = 0 V −0.5 to +4.0 V VIN Positive Input Voltage GND = 0 V −0.5 to VCC +0.5 V VINPP Differential Input Voltage |IN – IN| 1.89 V Iout LVPECL Output Current 50 100 mA mA IIN Input Current Through RT (50 W Resistor) $40 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) (Note 4) QFN−32 QFN−32 31 27 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) (Note 4) QFN−32 12 °C/W Tsol Wave Solder 265 °C Continuous Surge 0 lfpm 500 lfpm v 20 sec Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 4. JEDEC standard multilayer board – 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad. http://onsemi.com 4 NB7L572 Table 5. DC CHARACTERISTICS POSITIVE LVPECL OUTPUT VCC = 2.375 V to 3.6 V, GND = 0 V, TA = −40°C to +85°C (Note 6) Characteristic Symbol Min Typ Max Unit 2.375 3.0 2.5 3.3 2.625 3.6 V 90 110 mA POWER SUPPLY VCC Power Supply Voltage VCC = 2.5V VCC = 3.3 V ICC Power Supply Current for VCC (Inputs and Outputs Open) LVPECL OUTPUTS VOH Output HIGH Voltage (Note 6) VOL Output LOW Voltage (Note 6) VCC = 2.5 V VCC = 3.3 V VCC – 1145 1355 2155 VCC – 900 1600 2400 VCC – 825 1675 2475 mV VCC = 2.5 V VCC = 3.3 V VCC – 2000 500 1300 VCC – 1700 800 1600 VCC – 1500 1000 1800 mV DIFFERENTIAL CLOCK INPUTS DRIVEN SINGLE−ENDED (Figures 4 & 6) (Note 7) VIH Single−Ended Input HIGH Voltage Vth + 100 VCC mV VIL Single−Ended Input LOW Voltage GND Vth – 100 mV Vth Input Threshold Reference Voltage Range (Note 8) 1100 VCC – 100 mV VISE Single−Ended Input Voltage (VIH – VIL) 200 2400 mV VCC – 1000 mV VREFAC VREF−AC VCC – 1500 Output Reference Voltage (100 mA Load) VCC – 1200 DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (Figures 5 & 7) (Note 9) VIHD Differential Input HIGH Voltage (IN, IN) 1200 VCC mV VILD Differential Input LOW Voltage (IN, IN) 0 VIHD – 100 mV VID Differential Input Voltage (IN, IN) (VIHD – VILD) 100 1200 mV VCMR Input Common Mode Range (Differential Configuration, Note 10) (Figure 8) 800 VCC – 50 mV IIH Input HIGH Current IN/IN (VT IN/VT IN Open) −150 150 mA IIL Input LOW Current IN/IN (VT IN/VT IN Open) −150 150 mA V CONTROL INPUT (SELx Pin) VIH Input HIGH Voltage for Control Pin 2.0 VCC VIL Input LOW Voltage for Control Pin GND 0.8 V IIH Input HIGH Current 40 mA IIL Input LOW Current 0 mA 55 W −215 TERMINATION RESISTORS RTIN Internal Input Termination Resistor (Measured from INx to VTx) 45 50 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and Output parameters vary 1:1 with VCC. 6. LVPECL outputs loaded with 50 W to VCC − 2V for proper operation. 7. Vth, VIH, VIL,, and VISE parameters must be complied with simultaneously. 8. Vth is applied to the complementary input when operating in single−ended mode. 9. VIHD, VILD, VID and VCMR parameters must be complied with simultaneously. 10. VCMR min varies 1:1 with GND, VCMR max varies 1:1 with VCC. The VCMR range is referenced to the most positive side of the differential input signal. http://onsemi.com 5 NB7L572 Table 6. AC CHARACTERISTICS VCC = 2.375 V to 3.6 V, GND = 0 V, TA = −40°C to +85°C (Note 11) Min Typ fMAX Maximum Input Clock Frequency VOUT w 400 mV Characteristic 7 8 GHz fDATAMAX Maximum Operating Data Rate NRZ, (PRBS23) 10 11 Gbps VOUTPP Output Voltage Amplitude (@ VINPPmin) (Figure 2 & 9) (Note 12) 550 400 750 500 mV tPLH, tPHL Propagation Delay to Differential Outputs Measured at Differential Cross−Point 125 300 150 tPD Tempco Differential Propagation Delay Temperature Coefficient tskew Output – Output skew (within device) (Note 13) Device – Device skew (tpd max – tpd min) tDC Output Clock Duty Cycle (Reference Duty Cycle = 50%) tJITTER Additive Random Clock Jitter, RJ(RMS) (Note 14) Data Dependent Jitter, DDJ (Note 15) VINPP Input Voltage Swing (Differential Configuration) (Note 16) 100 tr,, tf Output Rise/Fall Times @ 1 GHz; (20% − 80%), VIN = 800 mV Q, Q 25 Symbol fin ≤ 5 GHz fin ≤ 7 GHz @ 1 GHz INx/INx to Qx/Qx (Figure 9) @ 50 MHz SELx to Qx (Figure 10) Max 175 1000 115 45 fin v 7.0 GHz fin v 10 Gbps Unit ps fs/°C 0 10 50 ps 50 55 % 0.5 6 0.8 15 ps rms ps pk−pk 1200 mV 65 ps 45 OUTPUT VOLTAGE AMPLITUDE (mV) NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 11. Measured using a 100 mVpk−pk source, 50% duty cycle clock source. All output loading with external 50 W to VCC − 2 V. Input edge rates 40 ps (20% − 80%). 12. Output voltage swing is a single−ended measurement operating in differential mode. 13. Skew is measured between outputs under identical transitions and conditions. Duty cycle skew is defined only for differential operation when the delays are measured from cross−point of the inputs to the cross−point of the outputs. 14. Additive RMS jitter with 50% duty cycle clock signal. 15. Additive Peak−to−Peak data dependent jitter with input NRZ data at K28.5. 16. Input voltage swing is a single−ended measurement operating in differential mode. 800 VCC 750 700 INx 50 W VTx 650 50 W INx 600 0 1 2 3 4 5 6 7 8 fin, CLOCK INPUT FREQUENCY (GHz) Figure 3. Input Structure Figure 2. CLOCK Output Voltage Amplitude (VOUTPP) / RMS Jitter vs. Input Frequency (fin) at Ambient Temperature (typical) http://onsemi.com 6 NB7L572 IN VIH Vth IN VIL IN IN Vth Figure 4. Differential Input Driven Single−Ended VCC Vthmax Figure 5. Differential Inputs Driven Differentially VIHmax VILmax Vth VIH Vth VIL IN IN IN VIHmin Vthmin VIHD VILD VILmin GND Figure 6. Vth Diagram VCC Figure 7. Differential Inputs Driven Differentially VIHDmax VCMmax VCMR VID = |VIHD(IN) − VILD(IN)| IN VILDmax IN Q VILDtyp tPHL VILDmin GND VOUTPP = VOH(Q) − VOL(Q) Q VIHDmin VCMmin VINPP = VIH(IN) − VIL(IN) IN VIHDtyp VID = VIHD − VILD IN tPLH Figure 8. VCMR Diagram SELx Figure 9. AC Reference Measurement VCC/2 VCC/2 tPHL tPLH Qx Qx Figure 10. SELx to Qx Timing Diagram http://onsemi.com 7 NB7L572 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 11. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) http://onsemi.com 8 NB7L572 VCC VCC VCC VCC NB7L572 LVPECL Driver IN ZO = 50 W 50 W VT = VCC − 2 V ZO = 50 W LVDS Driver 50 W ZO = 50 W VEE NB7L572 ZO = 50 W VEE VEE VCC VCC 50 W VT = Open IN Figure 12. LVPECL Interface IN 50 W IN VCC VCC NB7L572 CML Driver NB7L572 IN ZO = 50 W 50 W VT = VCC ZO = 50 W Differential Driver 50 W ZO = 50 W IN 50 W VT = VREFAC* ZO = 50 W IN VEE VEE Figure 13. LVDS Interface 50 W IN VEE VEE Figure 15. Capacitor−Coupled Differential Interface (VT Connected to VREFAC) Figure 14. Standard 50 W Load CML Interface VEE *VREFAC bypassed to ground with a 0.01 mF capacitor VCC VCC ZO = 50 W Single− Ended Driver VT = VREFAC* NB7L572 IN 50 W 50 W IN (open) GND GND Figure 16. Capacitor−Coupled Single−Ended Interface (VT Connected to External VREFAC) http://onsemi.com 9 NB7L572 ORDERING INFORMATION Package Shipping† NB7L572MNG QFN32 (Pb−Free) 79 Units / Rail NB7L572MNR4G QFN32 (Pb−Free) 1000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN32 5x5, 0.5P CASE 488AM ISSUE A 1 32 SCALE 2:1 A D PIN ONE LOCATION ÉÉ ÉÉ NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L B DATE 23 OCT 2013 L1 DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E DIM A A1 A3 b D D2 E E2 e K L L1 0.15 C 0.15 C EXPOSED Cu A DETAIL B 0.10 C (A3) A1 0.08 C DETAIL A 9 32X L ALTERNATE CONSTRUCTION GENERIC MARKING DIAGRAM* K D2 1 XXXXXXXX XXXXXXXX AWLYYWWG G 17 8 MOLD CMPD DETAIL B SEATING PLANE C SIDE VIEW NOTE 4 ÉÉ ÉÉ ÇÇ TOP VIEW MILLIMETERS MIN MAX 0.80 1.00 −−− 0.05 0.20 REF 0.18 0.30 5.00 BSC 2.95 3.25 5.00 BSC 2.95 3.25 0.50 BSC 0.20 −−− 0.30 0.50 −−− 0.15 E2 1 32 25 e e/2 32X b 0.10 M C A B 0.05 M C BOTTOM VIEW XXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. NOTE 3 RECOMMENDED SOLDERING FOOTPRINT* 5.30 32X 0.63 3.35 3.35 5.30 0.50 PITCH 32X 0.30 DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON20032D QFN32 5x5 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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