NB7VQ572M
1.8V / 2.5V /3.3V Differential
4:1 Mux w/Input Equalizer
to 1:2 CML Clock/Data
Fanout / Translator
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Multi−Level Inputs w/ Internal Termination
MARKING
DIAGRAM
Description
The NB7VQ572M is a high performance differential 4:1 Clock /
Data input multiplexer and a 1:2 CML Clock / Data fanout buffer that
operates up to 7 GHz / 10 Gbps respectively with a 1.8 V, 2.5 V, or
3.3 V power supply.
Each INx / INx input pair incorporates a fixed Equalizer Receiver,
which when placed in series with a Data path, will enhance the
degraded signal transmitted across an FR4 backplane or cable
interconnect. For applications that do not require Equalization,
consider the NB7V572M, which is pin−compatible to the
NB7VQ572M.
The differential Clock / Data inputs have internal 50 W termination
resistors and will accept differential LVPECL, CML, or LVDS logic
levels. The NB7VQ572M incorporates a pair of Select pins that will
choose one of four differential inputs and will produce two identical
CML output copies of Clock or Data.
As such, the NB7VQ572M is ideal for SONET, GigE, Fiber
Channel, Backplane and other Clock/Data distribution applications.
The two differential CML outputs will swing 400 mV when externally
loaded and terminated with a 50 W resistor to VCC and are optimized
for low skew and minimal jitter.
The NB7VQ572M is offered in a low profile 5x5 mm 32−pin QFN
Pb−Free package. Application notes, models, and support
documentation are available at www.onsemi.com. The NB7VQ572M
is a member of the GigaComm™ family of high performance clock
products.
Features
•
•
•
•
•
•
•
•
October, 2010 − Rev. P0
1
32
QFN32
MN SUFFIX
CASE 488AM
NB7V
Q572M
AWLYYWWG
G
A
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of
this data sheet.
• Differential CML Outputs, 400 mV Peak−to−Peak,
Input Data Rate > 10 Gb/s Typical
Data Dependent Jitter < 10 ps
Maximum Input Clock Frequency > 6 GHz Typical
Random Clock Jitter < 0.8 ps RMS
Low Skew 1:2 CML Outputs, < 15 ps max
4:1 Multi−Level Mux Inputs, accepts LVPECL, CML,
LVDS
175 ps Typical Propagation Delay
45 ps Typical Rise and Fall Times
© Semiconductor Components Industries, LLC, 2010
1
Typical
• Operating Range: VCC = 1.71 V to 3.6 V with GND =
•
•
•
•
•
1
0V
Internal 50 W Input Termination Resistors
VREFAC Reference Output
QFN−32 Package, 5mm x 5mm, Pb−Free
−40°C to +85°C Ambient Operating Temperature
These are Pb−Free Devices
Publication Order Number:
NB7VQ572M/D
NB7VQ572M
Multilevel Inputs
LVPECL, LVDS, CML
IN0
50 W
VT0
EQ0
50 W
IN0
0
VREFAC0
IN1
CML OUTPUTS
Q0
50 W
VT1
EQ1
50 W
IN1
1
4:1 MUX
VREFAC1
IN2
50 W
VT2
50 W
IN2
Q0
EQ2
2
EQ3
3
Q1
Q1
VREFAC2
IN3
50 W
VT3
50 W
IN3
VREFAC3
SEL0
SEL1
IN3
VREFAC3
VT3
IN3
IN2
VREFAC2
VT2
IN2
Figure 1. Simplified Block Diagram
32
31
30
29
28
27
26
25
Table 1. INPUT SELECT FUNCTION TABLE
Exposed
Pad (EP)
SEL1*
SEL0*
Clock / Data Input Selected
0
0
IN0 Input Selected
IN0
1
24
GND
0
1
IN1 Input Selected
VT0
2
23
VCC
1
0
IN2 Input Selected
VREFAC0
3
22
Q1
1
1
IN3 Input Selected
IN0
4
21
Q1
IN1
5
20
VCC
VT1
6
19
NC
VREFAC1
7
18
SEL1
IN1
8
17
VCC
9
10
11
12
13
14
15
16
GND
VCC
Q0
Q0
VCC
NC
SEL0
VCC
NB7VQ572M
*Defaults HIGH when left open.
Figure 2. Pinout: QFN−32 (Top View)
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2
NB7VQ572M
Table 2. PIN DESCRIPTION
Pin Number
Pin Name
I/O
1, 4
5, 8
25, 28
29, 32
IN0, IN0
IN1, IN1
IN2, IN2
IN3, IN3
LVPECL, CML,
LVDS Input
Pin Description
2, 6
26, 30
VT0, VT1
VT2, VT3
15
18
SEL0
SEL1
LVTTL/LVCMOS
Input
14, 19
NC
−
No Connect
10, 13, 16
17, 20, 23
VCC
−
Positive Supply Voltage.
11, 12
21, 22
Q0, Q0
Q1, Q1
CML Output
9, 24
GND
3
7
27
31
VREFAC0
VREFAC1
VREFAC2
VREFAC3
−
Output Voltage Reference for Capacitor−Coupled Inputs
−
EP
−
The Exposed Pad (EP) on the QFN−32 package bottom is thermally connected to the
die for improved heat transfer out of package. The exposed pad must be attached to
a heat−sinking conduit. The pad is electrically connected to the die, and must be
electrically connected to GND.
Noninverted, Inverted, Differential Clock or Data Inputs
Internal 100 W Center−tapped Termination Pin for INx / INx
Input Select pins, default HIGH when left open through a 94 kW pullup resistor. Input
logic threshold is VCC/2. See Select Function, Table 1.
Inverted, Non−inverted Differential Outputs.
Negative Supply Voltage
1. In the differential configuration when the input termination pins (VT0, VT1, VT2, VT3) are connected to a common termination voltage or left
open, and if no signal is applied on INx/INx input, then the device will be susceptible to self−oscillation.
2. All VCC, and GND pins must be externally connected to a power supply for proper operation.
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3
NB7VQ572M
Table 3. ATTRIBUTES
Characteristics
Value
ESD Protection
Human Body Model
Machine Model
> 2 kV
> 200 V
RPU − SELx Input Pullup Resistor
28 kW
Moisture Sensitivity (Note 3)
QFN−32
Flammability Rating
Oxygen Index: 28 to 34
Level 1
UL 94 V−0 @ 0.125 in
Transistor Count
252
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply
GND = 0 V
4.0
V
VIN
Positive Input Voltage
GND = 0 V
−0.5 to VCC +0.5
V
VINPP
Differential Input Voltage |IN − IN|
1.89
V
Iout
Output Current Through RT (50 W Resistor)
$40
mA
IIN
Input current Through RT (50 W Resistor)
$40
mA
IVREFAC
VREFAC Sink or Source Current
$1.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient) (Note 4)
QFN−32
QFN−32
31
27
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case) (Note 4)
QFN−32
12
°C/W
Tsol
Wave Solder
265
°C
0 lfpm
500 lfpm
v 20 sec
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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4
NB7VQ572M
Table 5. DC CHARACTERISTICS CML OUTPUT VCC = 1.71 V to 3.6 V , GND = 0 V, TA = −40°C to +85°C (Note 5)
Symbol
Characteristic
Min
Typ
Max
Unit
3.0
2.375
1.71
3.3
2.5
1.8
3.6
2.625
1.89
V
130
120
100
160
145
120
VCC − 30
3270
2470
1770
VCC − 5
3295
2495
1795
VCC
3300
2500
1800
mV
VCC − 550
2675
1875
VCC − 450
2825
2025
1325
VCC − 350
2975
2175
1475
mV
VCC = 3.3 V
VCC − 625
2675
VCC − 475
2825
VCC − 325
2975
mV
VCC = 2.5 V
VCC − 600
1900
VCC – 475
2025
VCC − 350
2150
VCC =1.8 V
VCC − 550
1250
VCC – 450
1350
VCC − 350
1450
POWER SUPPLY
VCC
Power Supply Voltage
ICC
Power Supply Current for VCC (Inputs and Outputs Open)
VCC = 3.3 V
VCC = 2.5 V
VCC = 1.8 V
VCC = 3.3 V
VCC = 2.5 V
VCC = 1.8 V
mA
CML OUTPUTS (Note 6)
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VOL
VCC = 3.3 V
VCC = 2.5 V
VCC = 1.8 V
VCC = 3.3 V
VCC = 2.5 V
VCC =1.8 V
Output LOW Voltage
DIFFERENTIAL CLOCK INPUTS DRIVEN SINGLE−ENDED (Figures 7 and 8) (Note 7)
VIH
Single−ended Input HIGH Voltage
Vth + 100
VCC
mV
VIL
Single−ended Input LOW Voltage
GND
Vth − 100
mV
Vth
Input Threshold Reference Voltage Range (Note 8)
1100
VCC − 100
mV
VISE
Single−ended Input Voltage (VIH − VIL)
200
1200
mV
VREFAC
VREFAC
Output Reference Voltage (100 mA Load)
VCC = 3.3 V
VCC = 2.5 V
VCC = 1.8 V
VCC − 800
VCC − 750
1050
VCC − 625
VCC − 575
VCC − 525
VCC − 500
VCC − 450
VCC − 400
mV
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (Figures 9 and 10) (Note 9)
VIHD
Differential Input HIGH Voltage (IN, IN)
1200
VCC
mV
VILD
Differential Input LOW Voltage (IN, IN)
0
VIHD − 100
mV
VID
Differential Input Voltage (IN, IN) (VIHD − VILD)
100
1200
mV
VCMR
Input Common Mode Range (Differential Configuration,
Note 10) (Figure 11)
1150
VCC − 50
mV
IIH
Input HIGH Current IN / IN (VTIN/VTIN Open)
−150
150
mA
IIL
Input LOW Current IN / IN (VTIN/VTIN Open)
−150
150
mA
V
CONTROL INPUT (SELx Pin)
VIH
Input HIGH Voltage for Control Pin
VCC x 0.65
VCC
VIL
Input LOW Voltage for Control Pin
GND
VCC x 0.35
V
IIH
Input HIGH Current
−150
150
mA
IIL
Input LOW Current
−150
150
mA
TERMINATION RESISTORS
RTIN
Internal Input Termination Resistor (Measured from INx to VTx)
45
50
55
W
RTOUT
Internal Output Termination Resistor
45
50
55
W
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and Output parameters vary 1:1 with VCC.
6. CML outputs loaded with 50 W to VCC for proper operation.
7. Vth, VIH, VIL, and VISE parameters must be complied with simultaneously.
8. Vth is applied to the complementary input when operating in single−ended mode.
9. VIHD, VILD, VID and VCMR parameters must be complied with simultaneously.
10. VCMR min varies 1:1 with GND, VCMR max varies 1:1 with VCC. The VCMR range is referenced to the most positive side of the differential
input signal.
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NB7VQ572M
Table 6. AC CHARACTERISTICS VCC = 1.71 V to 3.6 V, GND = 0 V, TA = −40°C to +85°C (Note 11)
Symbol
Min
Typ
fMAX
Maximum Input Clock Frequency
Characteristic
VOUT w 200 mV
6
7
GHz
fDATAMAX
Maximum Operating Data Rate
NRZ, (PRBS23)
10
11
Gbps
fSEL
Maximum Toggle Frequency, SELx
4
10
MHz
VOUTPP
Output Voltage Amplitude (@ VINPPmin) (Note 12) (Figure 12)
fin ≤ 5 GHz
250
400
tPLH,
tPHL
Propagation Delay to Differential
Outputs Measured at Differential
Crosspoint
100
175
7
tPD Tempco
Differential Propagation Delay Temperature Coefficient
50
tskew
Output − Output skew (within device) (Note 13)
Device − Device skew (tpdmax − tpdmin)
0
30
15
100
tDC
Output Clock Duty Cycle (Reference Duty Cycle = 50%)
50
55
FN
Phase Noise, fin = 1 GHz
tŐFN
tJITTER
@ 1 GHz INx/INx to Qx/Qx
@ 50 MHz SELx to Qx
fIN v 5 GHz
45
10 kHz
100 kHz
1 MHz
10 MHz
20 MHz
40 MHz
Max
Unit
mV
250
20
ps
ns
Dfs/°C
ps
%
−134
−136
−149
−149
−149
−149
dBc
Integrated Phase Jitter (Figure TBD) fin = 1 GHz, 12 kHz − 20 MHz
Offset (RMS)
35
fs
Random Clock Jitter, RJ (Note 14)
Deterministic Jitter, DJ (Note 15)
0.2
fin ≤ 6 GHz
fin ≤ 10 Gbps (12” FR4)
Crosstalk Induced Jitter (Adjacent Channel) (Note 17)
VINPP
Input Voltage Swing (Differential Configuration) (Note 16)
100
tr,, tf
Output Rise/Falltimes @ 1 GHz; (20% − 80%), VIN = 400 mV Qx, Qx
25
45
0.8
ps RMS
10
ps pk−pk
0.7
ps RMS
1200
mV
65
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11. Measured using a 150 mVpk−pk source, 50% duty cycle clock source. All output loading with external 50 W to VCC. Input edge rates
40 ps (20% − 80%).
12. Output voltage swing is a single−ended measurement operating in differential mode.
13. Skew is measured between outputs under identical transitions and conditions. Duty cycle skew is defined only for differential operation when
the delays are measured from crosspoint of the inputs to the crosspoint of the outputs.
14. Additive RMS jitter with 50% duty cycle clock signal.
15. Additive Peak−to−Peak data dependent jitter with input NRZ data at PRBS23.
16. Input voltage swing is a single−ended measurement operating in differential mode.
17. Crosstalk is measured at the output while applying two similar clock frequencies that are asynchronous with respect to each other at the
inputs.
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6
NB7VQ572M
OUTPUT VOLTAGE AMPLITUDE
(mV)
550
500
Q AMP (mV)
450
400
350
300
250
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
fin, CLOCK INPUT FREQUENCY (GHz)
8.0
Figure 3. Clock Output Voltage Amplitude (VOUTPP) vs. Input Frequency (fin) at Ambient Temperature (Typical)
600
EYE HEIGHT (mV)
500
400
300
200
100
0
0
1.0
2.0
3.0 4.0
5.0 6.0 7.0
8.0 9.0
10 11
fDATA, DATA RATE (Gbps)
Figure 4. Inside Eye Height vs. Input Data Rate (Gbps) at Ambient Temperature (typical), FR4 = 12”
VTx
Q
Driver
FR4 − 12 Inch Backplane
NB7VQ572M
INx
INx
Q
DJ1
DJ2
DJ3
Figure 5. Typical NB7VQ572M Equalizer Application and Interconnect with PRBS23 Pattern at 10 Gbps
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7
NB7VQ572M
VCC
IN
VIH
Vth
VIL
INx
50 W
IN
Vth
VTx
50 W
Figure 7. Differential Input Driven Single−Ended
INx
Figure 6. Input Structure
VCC
VIHmax
Vthmax
Vth
VILmax
IN
VIH
Vth
VIL
IN
IN
VIHmin
Vthmin
VILmin
VEE
Figure 8. Vth Diagram
Figure 9. Differential Inputs Driven Differentially
VCC
VIHDmax
VILDmax
VCMmax
IN
IN
IN
VID = |VIHD(IN) − VILD(IN)|
VCMR
VIHD
VIHDtyp
VILDtyp
IN
VILD
VID = VIHD − VILD
VIHDmin
VCMmin
VILDmin
VEE
Figure 11. VCMR Diagram
Figure 10. Differential Inputs Driven Differentially
IN
VINPP = VIH(IN) − VIL(IN)
IN
SELx
VCC / 2
tpd
Q
VOUTPP = VOH(Q) − VOL(Q)
Q
VCC / 2
tpd
Qx
Qx
tPHL
tPLH
Figure 13. SELx to Qx Timing Diagram
Figure 12. AC Reference Measurement
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NB7VQ572M
VCC
VCC
VCC
Zo = 50 W
LVPECL
Driver
VCC
NB7VQ572M
IN
Zo = 50 W
50 W
VT = VCC − 2
50 W
LVDS
Driver
50 W
Zo = 50 W
VT = OPEN
50 W
Zo = 50 W
IN
CLKx
IN
CLKx
GND
GND
GND
Figure 14. LVPECL Interface
GND
Figure 15. LVDS Interface
VCC
VCC
Zo = 50 W
NB7VQ572M
IN
VCC
NB7VQ572M
IN
VCC
Zo = 50 W
NB7VQ572M
IN
50 W
CML
Driver
50 W
Differential
Driver
VT = VCC
50 W
Zo = 50 W
50 W
Zo = 50 W
IN
GND
VT = VREFAC*
IN
GND
GND
GND
Figure 17. Capacitor−Coupled Differential
Interface (VT Connected to VREFAC)
Figure 16. Standard 50 W Load CML Interface
*VREFAC bypassed to ground with a 0.01 mF capacitor.
NB7VQ572M
RECEIVER
VCC
VCC (Receiver)
50 W
50 W
Q
50 W
50 W
Q
16 mA
GND
Figure 18. Typical CML Output Structure and Termination
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NB7VQ572M
DEVICE ORDERING INFORMATION
Package
Shipping†
NB7VQ572MMNG
QFN−32
(Pb−free)
74 Units / Rail
NB7VQ572MMNR4G
QFN−32
(Pb−free)
1000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
GigaComm is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN32 5x5, 0.5P
CASE 488AM
ISSUE A
1 32
SCALE 2:1
A
D
PIN ONE
LOCATION
ÉÉ
ÉÉ
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
B
DATE 23 OCT 2013
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
0.15 C
0.15 C
EXPOSED Cu
A
DETAIL B
0.10 C
(A3)
A1
0.08 C
DETAIL A
9
32X
L
ALTERNATE
CONSTRUCTION
GENERIC
MARKING DIAGRAM*
K
D2
1
XXXXXXXX
XXXXXXXX
AWLYYWWG
G
17
8
MOLD CMPD
DETAIL B
SEATING
PLANE
C
SIDE VIEW
NOTE 4
ÉÉ
ÉÉ
ÇÇ
TOP VIEW
MILLIMETERS
MIN
MAX
0.80
1.00
−−−
0.05
0.20 REF
0.18
0.30
5.00 BSC
2.95
3.25
5.00 BSC
2.95
3.25
0.50 BSC
0.20
−−−
0.30
0.50
−−−
0.15
E2
1
32
25
e
e/2
32X
b
0.10
M
C A B
0.05
M
C
BOTTOM VIEW
XXXXX = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer
to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
5.30
32X
0.63
3.35
3.35 5.30
0.50
PITCH
32X
0.30
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON20032D
QFN32 5x5 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
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