NC7NZ04K8X

NC7NZ04 TinyLogic UHS Inverter Desription The NC7NZ04 is a triple inverter from ON Semiconductor’s Ultra−High Speed (UHS) series of TinyLogic. The device is fabricated with advanced CMOS technology to achieve ultra−high speed with high output drive while maintaining low static power dissipation over a broad VCC operating range. The device is specified to operate over the 1.65 V to 5.5 V VCC operating range. The inputs and output are high impedance when VCC is 0 V. Inputs tolerate voltages up to 5.5 V, independent of VCC operating voltage. www.onsemi.com MARKING DIAGRAMS Features • Ultra−High Speed: tPD 2.4 ns (Typical) into 50 pF at 5 V VCC • High Output Drive: ±24 mA at 3 V VCC • Broad VCC Operating Range: 1.65 V to 5.5 V Power−Down, • • • • High−Impedance Inputs / Outputs Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation Proprietary Noise / EMI Reduction Circuitry Space−Saving MicroPak™ and US8 Surface Mount Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant IEEC / IEC 1A 2A 3A (1) (7) 1 (3) (5) (6) (2) 1Y NZ04, T3 &2 &K $Y &Z US8 CASE 846AN &2&K NZ04 $Y&Z UQFN8 1.6X1.6, 0.5P CASE 523AY T3&K &2&Z = Specific Device Code = Date Code = Lot Run Traceability Code = ON Semiconductor Logo = Assembly Plant Code ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. 2Y 3Y Figure 1. Logic Symbol VCC 1Y 3A 2Y 8 7 6 5 1 2 3 4 1A 3Y 2A GND Figure 2. Connection Diagram © Semiconductor Components Industries, LLC, 2001 May, 2019 − Rev. 2 1 Publication Order Number: NC7NZ04/D NC7NZ04 Pin Configurations 1A 7 (Top View) 3Y 6 2A 5 AAA VCC 8 Pin One NOTES: 1. AAA represents product code top mark (see ordering table). 2. Orientation of top mark determines pin one location. Reading the top product code mark left to right, pin one is the lower left pin. 4 GND 1 1Y Figure 3. US8 2 3A 3 2Y Figure 4. MicroPak (Top Through View) PIN DEFINITIONS FUNCTION TABLE (Y = /A) Pin # US8 Pin # MicroPak Name Description Output 1 7 1A Input A Y 2 6 3Y Output L H 3 5 2A Input H L 4 4 GND Ground 5 3 2Y Output 6 2 3A Input 7 1 1Y Output 8 8 VCC Inputs Supply Voltage ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Unit VCC Supply Voltage −0.5 6.5 V VIN DC Input Voltage −0.5 6.5 V DC Output Voltage −0.5 6.5 V mA VOUT IIK IOK IOUT ICC or IGND TSTG DC Input Diode Current VIN < −0.5 V − −50 VIN > 6.0 V − +20 VOUT < −0.5 V − −50 VOUT > 6 V, VCC = GND − +20 DC Output Current − ±50 mA DC VCC or Ground Current − ±50 mA −65 +150 °C DC Output Diode Current Storage Temperature Range mA TJ Junction Temperature Under Bias − +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation at +85°C − 250 mW Human Body Model, JEDEC: JESD22−A114 − 4000 V Charge Device Model, JEDEC: JESD22−C101 − 2000 ESD Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 NC7NZ04 RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT Min Max Unit Supply Voltage Operating Parameter 1.65 5.50 V Supply Voltage Data Retention 1.5 5.5 Input Voltage 0 5.5 V Output Voltage 0 VCC V −40 +85 °C VCC at 1.8 V, 2.5 V ±0.2 V 0 20 ns/V VCC at 3.3 V ±0.3 V 0 10 VCC at 5.0 V ±0.5 V 0 5 US8 − 250 MicroPak − 287 TA Operating Temperature tr, tf Input Rise and Fall Times qJA Conditions Thermal Resistance °C/W Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 3. Unused inputs must be held HIGH or LOW. They may not float. DC ELECTICAL CHARACTERISTICS TA = 25°C Symbol Parameter VCC VIH HIGH Level Input Voltage VIL VOH VOL IIN LOW Level Input Voltage HIGH Level Output Voltage LOW Level Output Voltage Input Leakage Current IOFF Power−Off Leakage Current ICC Quiescent Supply Current Min Typ Max Min Max Unit 1.80 ±0.15 0.65 VCC − − 0.65 VCC − V 2.30 to 5.50 0.70 VCC − − 0.70 VCC − 1.80 ±0.15 − − 0.35 VCC − 0.35 VCC 2.30 to 5.50 − − 0.30 VCC − 0.30 VCC 1.55 1.65 − 1.55 − 2.20 2.30 − 2.20 − 3.00 2.90 3.00 − 2.90 − 4.50 4.40 4.50 − 4.40 − 1.65 2.30 Conditions TA = −40 to 85°C VIN = VIL, IOH = −100 mA 1.65 IOH = −4 mA 1.29 1.52 − 1.29 − 2.30 IOH = −8 mA 1.90 2.15 − 1.90 − 3.00 IOH = −16 mA 2.40 2.80 − 2.40 − 3.00 IOH = −24 mA 2.30 2.68 − 2.30 − 4.50 IOH = −32 mA 3.80 4.20 − 3.80 − 1.65 VIN = VIL, IOH = −100 mA − 0.00 0.10 − 0.10 − 0.00 0.10 − 0.10 3.00 − 0.00 0.10 − 0.10 4.50 − 0.00 0.10 − 0.10 2.30 V V V 1.65 IOH = 4 mA − 0.80 0.24 − 0.24 2.30 IOH = 8 mA − 0.10 0.30 − 0.30 3.00 IOH = 16 mA − 0.15 0.40 − 0.40 3.00 IOH = 24 mA − 0.22 0.55 − 0.55 4.50 IOH = 32 mA − 0.22 0.55 − 0.55 1.65 to 5.5 0 VIN 5.5 V − − ±1 − ±1 mA VIN or VOUT = 5.5 V − − 1 − 10 mA VIN = 5.5 V, GND − − 1 − 10 mA 0 1.65 to 5.50 www.onsemi.com 3 NC7NZ04 AC ELECTRICAL CHARACTERISTICS TA = 25°C Symbol tPLH, tPHL Parameter VCC Propagation Delay (Figure 5, 6) Conditions Typ Max Min Max Unit − 4.4 9.5 − 10.0 ns − 2.9 5.1 − 5.6 3.30 ±0.30 − 2.1 3.4 − 3.8 5.00 ±0.50 − 1.8 2.8 − 3.1 − 2.9 4.5 − 5.0 − 2.4 3.6 − 4.0 0 − 2.5 − − − pF 3.30 − 9 − − − pF 5.00 − 11 − − − 1.80 ±0.15 2.50 ±0.20 3.30 ±0.30 5.00 ±0.50 CIN Input Capacitance CPD Power Dissipation Capacitance (Note 4) (Figure 7) TA = −40 to 85°C Min CL = 15 pF, RL = 1 MW CL = 50 pF, RL = 500 W 4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output lading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). DYNAMIC SWITCHING CHARACTERISTICS TA = 25°C Symbol Parameter Conditions VOLP Quiet Output Dynamic Peak VOL VOLV Quiet Output Dynamic Valley VOL CL = 50 pF, VIH = 5.0 V, VIL = 0 V VCC Typ Unit 5.0 0.8 V 5.0 −0.8 V tr = 3 ns VCC 90% 50% INPUT INPUT OUTPUT CL 10% RL NOTE: 5. CL includes load and stray capacitance; inputs PRR = 1.0 MHz, tW = 500 ns. 50% 10% tW tPHL OUTPUT tf = 3 ns VCC 90% tPLH 50% GND VOH 50% VOL Figure 5. AC Test Circuit Figure 6. AC Waveforms VCC A INPUT NOTE: 6. Input = AC Waveform; tr = tf = 1.8 ns; PRR = 10 MHz; Duty Cycle = 50%. Figure 7. ICCD Test Circuit www.onsemi.com 4 NC7NZ04 DEVICE ORDERING INFORMATION Top Mark Packages Shipping† NC7NZ04K8X NZ04 8−Lead US8, JEDEC MO−187, Variation CA 3.1 mm Wide 3000 / Tape & Reel NC7NZ04L8X T3 8−Lead MicroPak, 1.6 mm Wide 5000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN8 1.6X1.6, 0.5P CASE 523AY ISSUE O 0.05 C A 1.60 DATE 31 AUG 2016 0.40 (6X) 1.60 B 0.45 (2X) 2X 1.60 TOP VIEW PIN#1 IDENT 0.05 1.61 C 0.50 RECOMMENDED LAND PATTERN 0.50±0.05 0.05 C 0.05 C 0.25 (8X) NOTES: SEATING PLANE 0.025±0.025 A. PACKAGE CONFORMS TO JEDEC MO−255 VARIATION UAAD. C B. DIMENSIONS ARE IN MILLIMETERS. SIDE VIEW C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. 1.60±0.05 (0.10) D. LAND PATTERN RECOMMENDATION IS EXISTING INDUSTRY LAND PATTERN. (0.20)3X DETAIL A 1 2 3 (0.20) (0.09) 4 8 1.60±0.05 0.30±0.05 0.30±0.05 (7X) 7 6 5 0.50 1.00±0.05 (0.15) 0.20±0.05 (8X) BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON13591G UQFN8 1.6X1.6, 0.5P 0.30±0.05 0.10 C 0.05 C A B DETAIL A SCALE : 2X Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS US8 CASE 846AN ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13778G US8 DATE 31 DEC 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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