DATA SHEET
www.onsemi.com
TinyLogic UHS Triple
Inverter
MARKING
DIAGRAMS
NC7NZ04
US8
CASE 846AN
NZ04
ALYW
UQFN8 1.6X1.6, 0.5P
CASE 523AY
T3KK
XYZ
Desription
The NC7NZ04 is a triple inverter from onsemi’s Ultra−High Speed
(UHS) series of TinyLogic. The device is fabricated with advanced
CMOS technology to achieve ultra−high speed with high output drive
while maintaining low static power dissipation over a broad VCC
operating range. The device is specified to operate over the 1.65 V to
5.5 V VCC operating range. The inputs and output are high impedance
when VCC is 0 V. Inputs tolerate voltages up to 5.5 V, independent of
VCC operating voltage.
Features
• Ultra−High Speed: tPD = 2.4 ns (Typical) into 50 pF at 5 V VCC
• High Output Drive: ±24 mA at 3 V VCC
• Broad VCC Operating Range: 1.65 V to 5.5 V Power−Down,
•
•
•
•
High−Impedance Inputs / Outputs
Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
Proprietary Noise / EMI Reduction Circuitry
Space−Saving MicroPak™ and US8 Surface Mount Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
NZ04, T3
A
L
YW
KK
XY
Z
= Specific Device Code
= Assembly Site
= Wafer Lot Number
= Assembly Start Week
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code
= Assembly Plant Code
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
IEEC / IEC
1A
2A
3A
(1)
(7)
1
(3)
(5)
1
(6)
(2)
1
1Y
2Y
3Y
Figure 1. Logic Symbol
VCC
1Y
3A
2Y
8
7
6
5
1
2
3
4
1A
3Y
2A
GND
Figure 2. Connection Diagram
© Semiconductor Components Industries, LLC, 2001
June, 2022 − Rev. 4
1
Publication Order Number:
NC7NZ04/D
NC7NZ04
Pin Configurations
1A
7
(Top View)
3Y
6
2A
5
AAA
VCC 8
Pin One
NOTES:
1. AAA represents product code top mark (see ordering table).
2. Orientation of top mark determines pin one location. Reading
the top product code mark left to right, pin one is the lower left
pin.
4 GND
1
1Y
Figure 3. US8
2
3A
3
2Y
Figure 4. MicroPak (Top Through View)
PIN DEFINITIONS
FUNCTION TABLE
Pin # US8
Pin # MicroPak
Name
Description
Inputs
Output
1
7
1A
Input
A
Y
2
6
3Y
Output
L
H
3
5
2A
Input
H
L
4
4
GND
Ground
5
3
2Y
Output
6
2
3A
Input
7
1
1Y
Output
8
8
VCC
Supply Voltage
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
Max
Unit
VCC
Supply Voltage
−0.5
6.5
V
VIN
DC Input Voltage
−0.5
6.5
V
DC Output Voltage
−0.5
6.5
V
VOUT
IIK
DC Input Diode Current
VIN < 0 V
−
−50
mA
IOK
DC Output Diode Current
VOUT < 0 V
−
−50
mA
IOUT
DC Output Current
−
±50
mA
DC VCC or Ground Current
−
±50
mA
−65
+150
°C
−
+150
°C
ICC or IGND
TSTG
Storage Temperature Range
TJ
Junction Temperature Under Bias
TL
Junction Lead Temperature (Soldering, 10 Seconds)
−
+260
°C
PD
Power Dissipation in Still Air
US8
−
500
mW
MicroPak−8
−
539
Human Body Model, JEDEC: JESD22−A114
−
4000
Charge Device Model, JEDEC: JESD22−C101
−
2000
ESD
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
NC7NZ04
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN
VOUT
Min
Max
Unit
Supply Voltage Operating
Parameter
1.65
5.5
V
Supply Voltage Data Retention
1.5
5.5
Input Voltage
0
5.5
V
Output Voltage
0
VCC
V
−40
+85
°C
VCC at 1.8 V, 2.5 V ±0.2 V
0
20
ns/V
VCC at 3.3 V ±0.3 V
0
10
VCC at 5.0 V ±0.5 V
0
5
US8
−
250
MicroPak−8
−
232
TA
Operating Temperature
tr, tf
Input Rise and Fall Times
qJA
Conditions
Thermal Resistance
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
3. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
TA = 25°C
Symbol
Parameter
VCC
VIH
HIGH Level Input Voltage
VIL
VOH
VOL
IIN
LOW Level Input Voltage
HIGH Level Output
Voltage
LOW Level Output
Voltage
Input Leakage Current
IOFF
Power−Off Leakage
Current
ICC
Quiescent Supply Current
Min
Typ
Max
Min
Max
Unit
1.65 to 1.95
0.65 VCC
−
−
0.65 VCC
−
V
2.30 to 5.50
0.70 VCC
−
−
0.70 VCC
−
1.65 to 1.95
−
−
0.35 VCC
−
0.35 VCC
2.30 to 5.50
−
−
0.30 VCC
−
0.30 VCC
1.55
1.65
−
1.55
−
2.20
2.30
−
2.20
−
3.00
2.90
3.00
−
2.90
−
4.50
4.40
4.50
−
4.40
−
1.65
2.30
Conditions
TA = −40 to 85°C
VIN = VIH or VIL,
IOH = −100 mA
1.65
IOH = −4 mA
1.29
1.52
−
1.29
−
2.30
IOH = −8 mA
1.90
2.15
−
1.90
−
3.00
IOH = −16 mA
2.40
2.80
−
2.40
−
3.00
IOH = −24 mA
2.30
2.68
−
2.30
−
4.50
IOH = −32 mA
3.80
4.20
−
3.80
−
1.65
VIN = VIH or VIL,
IOH = −100 mA
−
0.00
0.10
−
0.10
−
0.00
0.10
−
0.10
3.00
−
0.00
0.10
−
0.10
4.50
−
0.00
0.10
−
0.10
2.30
V
V
V
1.65
IOH = 4 mA
−
0.80
0.24
−
0.24
2.30
IOH = 8 mA
−
0.10
0.30
−
0.30
3.00
IOH = 16 mA
−
0.15
0.40
−
0.40
3.00
IOH = 24 mA
−
0.22
0.55
−
0.55
4.50
IOH = 32 mA
−
0.22
0.55
−
0.55
VIN = 5.5 V, GND
−
−
±1
−
±1
mA
VIN or VOUT = 5.5 V
−
−
1
−
10
mA
VIN = 5.5 V, GND
−
−
1
−
10
mA
1.65 to 5.5
0
1.65 to 5.50
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3
NC7NZ04
AC ELECTRICAL CHARACTERISTICS
TA = 25°C
Symbol
tPLH, tPHL
Parameter
VCC
Propagation Delay
(Figure 5, 6)
Conditions
Typ
Max
Min
Max
Unit
−
4.4
9.5
−
10.0
ns
−
2.9
5.1
−
5.6
3.30 ±0.30
−
2.1
3.4
−
3.8
5.00 ±0.50
−
1.8
2.8
−
3.1
−
2.9
4.5
−
5.0
−
2.4
3.6
−
4.0
0
−
2.5
−
−
−
pF
3.30
−
9
−
−
−
pF
5.00
−
11
−
−
−
1.80 ±0.15
2.50 ±0.20
3.30 ±0.30
5.00 ±0.50
CIN
Input Capacitance
CPD
Power Dissipation Capacitance
(Note 4) (Figure 7)
TA = −40 to 85°C
Min
CL = 15 pF,
RL = 1 MW
CL = 50 pF,
RL = 500 W
4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output lading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
DYNAMIC SWITCHING CHARACTERISTICS
TA = 25°C
Symbol
Parameter
Conditions
VOLP
Quiet Output Dynamic Peak VOL
VOLV
Quiet Output Dynamic Valley VOL
CL = 50 pF, VIH = 5.0 V, VIL = 0 V
VCC
Typ
Unit
5.0
0.8
V
5.0
−0.8
V
tr = 3 ns
VCC
90%
50%
INPUT
INPUT
OUTPUT
CL
10%
RL
NOTE:
5. CL includes load and stray capacitance;
inputs PRR = 1.0 MHz, tW = 500 ns.
50%
10%
tW
tPHL
OUTPUT
tf = 3 ns
VCC
90%
tPLH
50%
GND
VOH
50%
VOL
Figure 5. AC Test Circuit
Figure 6. AC Waveforms
VCC
A
INPUT
NOTE:
6. Input = AC Waveform; tr = tf = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%.
Figure 7. ICCD Test Circuit
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4
NC7NZ04
DEVICE ORDERING INFORMATION
Top Mark
Packages
Shipping†
NC7NZ04K8X
NZ04
8−Lead US8, JEDEC MO−187, Variation CA 3.1 mm Wide
3000 / Tape & Reel
NC7NZ04K8X−L22236
NZ04
8−Lead US8, JEDEC MO−187, Variation CA 3.1 mm Wide
3000 / Tape & Reel
NC7NZ04L8X
T3
8−Lead MicroPak, 1.6 mm Wide
5000 / Tape & Reel
NC7NZ04L8X−L22185
T3
8−Lead MicroPak, 1.6 mm Wide
5000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other
countries.
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UQFN8 1.6X1.6, 0.5P
CASE 523AY
ISSUE O
0.05
C
A
1.60
DATE 31 AUG 2016
0.40
(6X)
1.60
B
0.45
(2X)
2X
1.60
TOP VIEW
PIN#1 IDENT
0.05
1.61
C
0.50
RECOMMENDED
LAND PATTERN
0.50±0.05
0.05
C
0.05
C
0.25
(8X)
NOTES:
SEATING
PLANE
0.025±0.025
A. PACKAGE CONFORMS TO JEDEC MO−255
VARIATION UAAD.
C
B. DIMENSIONS ARE IN MILLIMETERS.
SIDE VIEW
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
1.60±0.05
(0.10)
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
(0.20)3X
DETAIL A
1
2
3
(0.20)
(0.09)
4
8
1.60±0.05
0.30±0.05
0.30±0.05 (7X)
7
6
5
0.50
1.00±0.05
(0.15)
0.20±0.05 (8X)
BOTTOM VIEW
DOCUMENT NUMBER:
DESCRIPTION:
98AON13591G
UQFN8 1.6X1.6, 0.5P
0.30±0.05
0.10
C
0.05
C
A
B
DETAIL A
SCALE : 2X
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
US8
CASE 846AN
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13778G
US8
DATE 31 DEC 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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