NC7NZ34L8X

DATA SHEET www.onsemi.com TinyLogic UHS Triple Buffer MARKING DIAGRAMS NC7NZ34 Description The NC7NZ34 is a triple buffer from onsemi’s Ultra High Speed Series of TinyLogic in the space saving US8 package. The device is fabricated with advanced CMOS technology to achieve ultra high speed with high output drive while maintaining low static power dissipation over a very broad VCC operating range. The device is specified to operate over the 1.65 V to 5.5 V VCC range. The inputs and outputs are high impedance when VCC is 0 V. Inputs tolerate voltages up to 5.5 V independent of VCC operating voltage. UQFN8 1.6X1.6, 0.5P CASE 523AY P9KK XYZ US8 CASE 846AN NZ34 ALYW Features • • • • • • • • • Space Saving US8 Surface Mount Package MicroPak™ Pb−Free Leadless Package Ultra High Speed: tPD 2.4 ns Typ into 50 pF at 5 V VCC High Output Drive: ±24 mA at 3 V VCC Broad VCC Operating Range: 1.65 V to 5.5 V Power Down High Impedance Inputs / Outputs Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation Proprietary Noise / EMI Reduction Circuitry Implemented These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant P9, NZ34 KK, L XY, YW Z, A = Specific Device Code = 2−Digit Lot Run Traceability Code = 2−Digit Date Code Format = Assembly Plant Code ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. IEEE / IEC 1A 2A 3A (1) (7) (3) (5) (6) (2) 1Y 2Y 3Y Figure 1. Logic Symbol © Semiconductor Components Industries, LLC, 2005 June, 2022 − Rev. 4 1 Publication Order Number: NC7NZ34/D NC7NZ34 Connection Diagrams VCC 1Y 3A 2Y 8 7 6 5 1A 7 3Y 6 2A 5 VCC 8 1 2 3 4 1A 3Y 2A GND 1 1Y Figure 2. Connection Diagram (Top View) (Top View) 4 GND 2 3A 3 2Y Figure 4. Pad Assignments for MicroPak (Top Thru View) AAA Pin One AAA represents Product Code Top Mark − see ordering code NOTE: Orientation of Top Mark determines Pin One location. Read the Top Product Code Mark left to right, Pin One is the lower left pin (see diagram). Figure 3. Pin One Orientation Diagram PIN DESCRIPTIONS FUNCTION TABLE (Y = A) Name Description Input Output A1, A2, A3 Data Inputs A Y Y1, Y2, Y3 Output L L H H H = HIGH Logic Level L = LOW Logic Level www.onsemi.com 2 NC7NZ34 ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit VCC Supply Voltage −0.5 6.5 V VIN DC Input Voltage −0.5 6.5 V DC Output Voltage −0.5 6.5 V VOUT Parameter IIK DC Input Diode Current VIN < 0 V − −50 mA IOK DC Output Diode Current VOUT < 0 V − −50 mA IOUT DC Output Source / Sink Current − ±50 mA DC VCC / GND Current − ±100 mA −65 +150 °C ICC / IGND TSTG Storage Temperature TJ Junction Temperature under Bias − +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation in Still Air US8 − 500 mW MicroPak−8 − 539 mW Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT tr, tf Min Max Unit Supply Voltage Operating Parameter 1.65 5.5 V Supply Voltage Data Retention 1.5 5.5 Input Voltage 0 5.5 V Output Voltage 0 VCC V VCC = 1.8 V, 2.5 V ±0.2 V 0 20 ns/V VCC = 3.3 V ±0.3 V 0 10 Input Rise and Fall Time VCC = 5.5 V ±0.5 V TA Operating Temperature qJA Thermal Resistance 0 5 −40 +85 °C US8 − 250 °C/W MicroPak−8 − 232 °C/W Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float. www.onsemi.com 3 NC7NZ34 DC ELECTICAL CHARACTERISTICS TA = +25°C Symbol VIH VIL VOH VOL IIN Parameter HIGH Level Control Input Voltage LOW Level Control Input Voltage HIGH Level Control Output Voltage LOW Level Control Output Voltage Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current TA = −40 to +85°C Min Typ Max Min Max Unit 1.8 ±0.15 0.65 VCC − − 0.65 VCC − V 2.3 to 5.5 0.7 VCC − − 0.7 VCC − 1.8 ±0.15 − − 0.35 VCC − 0.35 VCC 2.3 to 5.5 − − 0.3 VCC − 0.3 VCC VCC (V) 1.65 Conditions VIN = VIH 1.55 1.65 − 1.55 − 2.3 IOH = −100 mA 2.2 2.3 − 2.2 − 3.0 2.9 3.0 − 2.9 − 4.5 4.4 4.5 − 4.4 − 1.65 IOH = −4 mA 1.29 1.52 − 1.29 − 2.3 IOH = −8 mA 1.9 2.14 − 1.9 − 3.0 IOH = −16 mA 2.4 2.75 − 2.4 − 3.0 IOH = −24 mA 2.3 2.62 − 2.3 − 4.5 IOH = −32 mA 3.8 4.13 − 3.8 − IOL = 100 mA − 0.0 0.1 − 0.1 2.3 − 0.0 0.1 − 0.1 3.0 − 0.0 0.1 − 0.1 4.5 − 0.0 0.1 − 0.1 1.65 VIN = VIL V V V 1.65 IOL = 4 mA − 0.08 0.24 − 0.24 2.3 IOL = 8 mA − 0.10 0.3 − 0.3 3.0 IOL = 16 mA − 0.16 0.4 − 0.4 3.0 IOL = 24 mA − 0.24 0.55 − 0.55 4.5 IOL = 32 mA − 0.25 0.55 − 0.55 0 ≤ VIN ≤ 5.5 V − − ±0.1 − ±1.0 mA VIN or VOUT = 5.5 V − − 1.0 − 10 mA VIN = 5.5 V, GND − − 1.0 − 10 mA 1.65 to 5.5 0.0 1.65 to 5.5 www.onsemi.com 4 NC7NZ34 AC ELECTRICAL CHARACTERISTICS TA = +25°C Symbol Parameter tPLH, tPHL Propagation Delay (Figure 5, 7) Typ Max Min Max Unit − 4.6 8.0 − 8.8 ns − 3.0 5.2 − 5.8 3.3 ±0.3 − 2.3 3.6 − 4.0 5.0 ±0.5 − 1.8 2.9 − 3.2 1.2 3.0 4.6 − 5.1 0.8 2.4 3.8 − 4.2 − 2.5 − − − pF − 9 − − − pF − 11 − − − 1.8 ±0.15 2.5 ±0.2 3.3 ±0.3 5.0 ±0.5 CIN Input Capacitance CPD Power Dissipation Capacitance (Figure 6) TA = −40 to +85°C Min VCC (V) Conditions CL = 15 pF, RL = 1 MW, CL = 50 pF, RL = 500 W, 0 (Note 2) 3.3 5.0 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. (See Figure 6). CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). AC ELECTRICAL CHARACTERISTICS TA = +25°C Symbol Parameter Conditions VCC (V) Typical Unit VOLP Quiet Output Dynamic Peak VOL CL = 50 pF, VIH = 5.0 V, VIL = 0 V 5.0 0.8 V VOLV Quiet Output Dynamic Valley VOL CL = 50 pF, VIH = 5.0 V, VIL = 0 V 5.0 −0.8 V AC Loading and Waveforms tr = 3 ns tf = 3 ns 90% VCC 50% INPUT INPUT 10% OUTPUT CL 50% tW tPLH RL OUTPUT CL includes load and stray capacitance Input PRR = 1.0 MHz, tW = 500 ns. VCC 90% 10% tPHL 50% GND VOH 50% VOL Figure 5. AC Test Circuit Figure 7. AC Waveforms VCC A INPUT Input = AC Waveform; tr = tf = 1.8 ns; PRR = 10 MHz; Duty Cycle = 50%. Figure 6. ICCD Test Circuit www.onsemi.com 5 NC7NZ34 ORDERING INFORMATION Top Mark Package Shipping† NC7NZ34K8X NZ34 8−Lead US8, JEDEC MO−187, Variation CA 3.1 mm Wide 3000 / Tape & Reel NC7NZ34K8X−L22236 NZ34 8−Lead US8, JEDEC MO−187, Variation CA 3.1 mm Wide 3000 / Tape & Reel NC7NZ34L8X P9 8−Lead MicroPak, 1.6 mm Wide (Pb−Free) 5000 / Tape & Reel NC7NZ34L8X−L22185 P9 8−Lead MicroPak, 1.6 mm Wide (Pb−Free) 5000 / Tape & Reel Part Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 3. Pb−Free package per JEDEC J−STD−020B. MicroPak is trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN8 1.6X1.6, 0.5P CASE 523AY ISSUE O 0.05 C A 1.60 DATE 31 AUG 2016 0.40 (6X) 1.60 B 0.45 (2X) 2X 1.60 TOP VIEW PIN#1 IDENT 0.05 1.61 C 0.50 RECOMMENDED LAND PATTERN 0.50±0.05 0.05 C 0.05 C 0.25 (8X) NOTES: SEATING PLANE 0.025±0.025 A. PACKAGE CONFORMS TO JEDEC MO−255 VARIATION UAAD. C B. DIMENSIONS ARE IN MILLIMETERS. SIDE VIEW C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. 1.60±0.05 (0.10) D. LAND PATTERN RECOMMENDATION IS EXISTING INDUSTRY LAND PATTERN. (0.20)3X DETAIL A 1 2 3 (0.20) (0.09) 4 8 1.60±0.05 0.30±0.05 0.30±0.05 (7X) 7 6 5 0.50 1.00±0.05 (0.15) 0.20±0.05 (8X) BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON13591G UQFN8 1.6X1.6, 0.5P 0.30±0.05 0.10 C 0.05 C A B DETAIL A SCALE : 2X Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS US8 CASE 846AN ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13778G US8 DATE 31 DEC 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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