NC7S00
TinyLogic HS 2-Input NAND
Gate
Description
The NC7S00 is a single 2−Input high performance CMOS NAND
Gate. Advanced Silicon Gate CMOS fabrication assures high speed
and low power circuit operation over a broad VCC range. ESD
protection diodes inherently guard both inputs and output with respect
to the VCC and GND rails. Three stages of gain between inputs and
output assures high noise immunity and reduced sensitivity to input
edge rate.
Features
•
•
•
•
•
•
•
•
•
Space Saving SC−74A and SC−88A 5−Lead Package
Ultra Small MicroPak™ Leadless Package
High Speed: tPD = 3.5 ns Typ
Low Quiescent Power: ICC < 1 mA
Balanced Output Drive: 2 mA IOL, −2 mA IOH
Broad VCC Operating Range: 2 V – 6 V
Balanced Propagation Delays
Specified for 3 V Operation
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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MARKING
DIAGRAMS
SIP6
CASE 127EB
A3KK
XYZ
Pin 1
SC−74A
CASE 318BQ
SC−88A
CASE 419A−02
7S00T
S00T
IEEE / IEC
A
B
&
A3, 7S00, S00 = Specific Device Code
KK
= 2−Digit Lot Run Traceability Code
XY
= 2−Digit Date Code Format
Z
= Assembly Plant Code
T
= Die Run Code
= Year Coding Scheme
= Plant Code Identifier
= Eight−Week Datacoding Scheme
Y
Figure 1. Logic Symbol
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2003
July, 2019 − Rev. 3
1
Publication Order Number:
NC7S00/D
NC7S00
Pin Configurations
A 1
5
VCC
B 2
GND 3
4
Y
A 1
6 VCC
B 2
5 NC
GND 3
Figure 2. SC−88A and SC−74A (Top
View)
4 Y
Figure 3. MicroPak (Top Through View)
PIN DESCRIPTIONS
FUNCTION TABLE (Y = AB)
Pin Names
Description
Output
Inputs
A, B
Inputs
A
B
Y
Y
Output
L
L
H
No Connect
L
H
H
H
L
H
H
H
L
NC
H = HIGH Logic Level
L = LOW Logic Level
ABSOLUTE MAXIMUM RATINGS
Symbol
VCC
IIK
Parameter
Min
Supply Voltage
DC Input Diode Current
VIN
DC Input Voltage
IOK
DC Output Diode Current
Max
Unit
−0.5
6.5
V
VIN ≤ −0.5 V
−
−20
mA
VIN ≥ VCC + 0.5 V
−
+20
−0.5
VCC + 0.5
V
VOUT < −0.5 V
−
−20
mA
VOUT > VCC + 0.5 V
−
+20
VOUT
DC Output Voltage
−0.5
VCC + 0.5
V
IOUT
DC Output Source or Sink Current
−
±12.5
mA
DC VCC or Ground Current per Output Pin
−
±25
mA
ICC or IGND
TSTG
Storage Temperature
−65
+150
°C
TJ
Junction Temperature
−
+150
°C
TL
Lead Temperature (Soldering, 10 Seconds)
−
+260
°C
PD
Power Dissipation in Still Air
SC−74A
−
225
mW
SC−88A
−
190
MicroPak
−
327
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
NC7S00
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
2.0
6.0
V
Input Voltage
0
VCC
V
Output Voltage
0
VCC
V
−40
+85
°C
VCC at 2.0 V
0
20
ns
VCC at 3.0 V
0
20
VCC at 4.5 V
0
10
VCC at 6.0 V
0
5
SC−74A
−
555
SC−88A
−
659
MicroPak
−
382
VCC
Supply Voltage
VIN
VOUT
TA
Operating Temperature
tr, tf
Input Rise and Fall Times
qJA
Conditions
Thermal Resistance
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
TA = +25°C
Min
Typ
Max
Min
Max
Unit
2.0
1.50
−
−
1.50
−
V
3.0 − 6.0
0.7 x VCC
−
−
0.7 x VCC
−
2.0
−
−
0.50
−
0.50
3.0 − 6.0
−
−
0.3 x VCC
−
0.3 x VCC
1.90
2.0
−
1.90
−
3.0
2.90
3.0
−
2.90
−
4.5
4.40
4.5
−
4.40
−
Symbol
Parameter
VCC (V)
VIH
HIGH Level Input Voltage
VIL
LOW Level Input Voltage
VOH
HIGH Level Output Voltage
2.0
Conditions
IOH = –20 mA, VIN = VIL
6.0
5.90
6.0
−
5.90
−
IOH = –1.3 mA
2.68
2.85
−
2.63
−
4.5
IOH = –2 mA
4.18
4.35
−
4.13
−
6.0
IOH = –2.6 mA
5.68
5.85
−
5.63
−
−
0.0
0.10
−
0.10
3.0
−
0.0
0.10
−
0.10
4.5
−
0.0
0.10
−
0.10
6.0
−
0.0
0.10
−
0.10
IOH = 1.3 mA
−
0.1
0.26
−
0.33
IOL = 2 mA
−
0.1
0.26
−
0.33
IOL = 2.6 mA
3.0
VOL
LOW Level Output Voltage
TA = −40 to +85°C
2.0
3.0
4.5
6.0
VIN = VIL
IOL = 20 mA, VIN = VIH
VIN = VIH
V
V
V
−
0.1
0.26
−
0.33
IIN
Input Leakage Current
6.0
VIN = VCC, GND
−
−
±0.1
−
±1.0
mA
ICC
Quiescent Supply Current
6.0
VIN = VCC, GND
−
−
1.0
−
10.0
mA
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3
NC7S00
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
Typ
Max
Min
Max
Unit
CL = 15 pF
−
3.5
15
−
−
ns
CL = 50 pF
−
19
100
−
125
3.0
−
10.5
27
−
35
4.5
−
7.5
20
−
25
6.0
−
6.5
17
−
21
Parameter
VCC (V)
tPLH, tPHL
Propagation Delay (Figure 4, 6)
5.0
2.0
tTLH, tTHL
Output Transition Time
(Figure 4, 6)
CIN
Input Capacitance
CPD
Power Dissipation Capacitance
(Figure 5)
TA = −40 to +85°C
Min
Symbol
Conditions
ns
5.0
CL = 15 pF
−
3.0
10
−
−
2.0
CL = 50 pF
−
25
125
−
155
3.0
−
16
35
−
45
4.5
−
11
25
−
31
6.0
−
9
21
−
26
Open
−
2
10
−
10
pF
−
6
−
−
−
pF
5.0
(Note 2)
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
VCC
OUTPUT
INPUT
CL
CL includes load and stray capacitance
Input PRR = 1.0 MHz, tW = 500 ns
Figure 4. AC Test Circuit
Figure 6. AC Waveforms
VCC
A
INPUT
Input = AC Waveform;
PRR = Variable; Duty Cycle = 50%.
Figure 5. ICCD Test Circuit
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4
NC7S00
DEVICE ORDERING INFORMATION
Top Mark
Packages
Shipping†
NC7S00M5X
7S00
SC−74A
3000 / Tape & Reel
NC7S00P5X
S00
SC−88A
3000 / Tape & Reel
NC7S00L6X
A3
SIP6, MicroPak
5000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NC7S00
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
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6
NC7S00
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5X
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
e
D
A
L
DETAIL A
TOP VIEW
A
SIDE VIEW
DETAIL A
C
c
SEATING
PLANE
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM
A
A1
b
c
D
E
E1
e
L
M
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
NC7S00
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
C
K
H
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
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8
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
NC7S00
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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9
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For additional information, please contact your local
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NC7S00/D
