DATA SHEET
www.onsemi.com
TinyLogic HS Inverter with
Schmitt Trigger Input
MARKING
DIAGRAMS
SIP6
CASE 127EB
NC7S14
Pin 1
Description
The NC7S14 is a single high performance CMOS Inverter with
Schmitt Trigger input. The circuit design provides hysteresis between
the positive−going and negative going input thresholds thereby
improving noise margins.
Advanced Silicon Gate CMOS fabrication assures high speed and
low power circuit operation over a broad VCC range. ESD protection
diodes inherently guard both input and output with respect to the VCC
and GND rails.
SC−74A
CASE 318BQ
SOT−23
CASE 527AH
Features
UUKK
XYZ
Space Saving SOT23−5, SC−74A and SC−88A 5−Lead Package
Ultra Small MicroPak Leadless Package
Schmitt Input Hysteresis: >1 V Typ
High Speed: tPD = 4.5 ns Typ
Low Quiescent Power: ICC < 1 mA
Balanced Output Drive: 2 mA IOL, −2 mA IOH
Broad VCC Operating Range: 2 V – 6 V
Balanced Propagation Delays
Specified for 3 V Operation
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
IEEE / IEC
1
A
September, 2022 − Rev. 7
UU, 7S14, S14
KK
XY
Z
M
7S14MG
G
S14MG
G
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code*
*Date Code orientation and/or position may
vary depending upon manufacturing location.
Y
ORDERING INFORMATION
Figure 1. Logic Symbol
Semiconductor Components Industries, LLC, 2004
SC−88A
CASE 419A−02
7S14MG
G
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
1
Publication Order Number:
NC7S14/D
NC7S14
Pin Configurations
NC 1
5
NC 1
VCC
A 2
A 2
GND 3
4
Y
GND 3
Figure 2. SOT23−5, SC−88A and SC−74A
(Top View)
6 VCC
5 NC
4 Y
Figure 3. MicroPak (Top Through View)
PIN DESCRIPTIONS
FUNCTION TABLE (Y = A)
Pin Name
Description
Input
Output
A
Input
A
Y
Y
Output
L
H
No Connect
H
L
NC
H = HIGH Logic Level
L = LOW Logic Level
ABSOLUTE MAXIMUM RATINGS
Symbol
VCC
Parameter
Supply Voltage
IIK
DC Input Diode Current
VIN
DC Input Voltage
IOK
DC Output Diode Current
VIN < 0 V
VIN > VCC
VOUT
DC Output Voltage
IOUT
DC Output Source or Sink Current
ICC or IGND
Min
Max
Unit
−0.5
6.5
V
−
−20
mA
−
+20
−0.5
VCC + 0.5
V
VOUT < 0 V
−
−20
mA
VOUT > VCC
−
+20
−0.5
VCC + 0.5
V
−
12.5
mA
−
25
mA
TSTG
DC VCC or Ground Current per Output Pin
Storage Temperature
−65
+150
C
TJ
Junction Temperature
−
+150
C
TL
Lead Temperature (Soldering, 10 Seconds)
−
+260
C
PD
Power Dissipation in Still Air
SC−74A / SOT23−5
−
390
mW
SC−88A
−
332
MicroPak−6
−
812
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
NC7S14
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
2.0
6.0
V
Input Voltage
0
VCC
V
Output Voltage
0
VCC
V
−40
+85
C
SC−74A / SOT23−5
−
320
C/W
SC−88A
−
377
MicroPak−6
−
154
VCC
Supply Voltage
VIN
VOUT
TA
Operating Temperature
qJA
Thermal Resistance
Conditions
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
TA = +25C
TA = −40 to +85C
Symbol
Parameter
VCC (V)
Min
Typ
Max
Min
Max
Unit
VP
Positive Threshold Voltage
2.0
3.0
4.5
6.0
−
−
−
−
1.29
1.90
2.73
3.56
1.5
2.2
3.15
4.2
−
−
−
−
1.6
2.2
3.15
4.2
V
VN
Negative Threshold Voltage
2.0
3.0
4.5
6.0
0.3
0.6
1.13
1.5
0.70
1.05
1.66
2.24
−
−
−
−
0.3
0.6
1.13
1.5
VH
Hysteresis Voltage
2.0
3.0
4.5
6.0
0.3
0.4
0.6
0.8
0.59
0.85
1.08
1.31
1.0
1.3
1.4
1.7
0.3
0.4
0.6
0.8
1.0
1.3
1.4
1.7
V
HIGH Level Output Voltage
2.0
3.0
4.5
6.0
1.90
2.90
4.40
5.90
2.0
3.0
4.5
6.0
−
−
−
−
1.90
2.90
4.40
5.90
−
−
−
−
V
2.68
4.18
5.68
2.87
4.37
5.86
−
−
−
2.63
4.13
5.63
−
−
−
−
−
−
−
0.0
0.0
0.0
0.0
0.10
0.10
0.10
0.10
−
−
−
−
0.10
0.10
0.10
0.10
VOH
3.0
4.5
6.0
VOL
LOW Level Output Voltage
2.0
3.0
4.5
6.0
Conditions
IOH = −20 mA
VIN = VIH or VIL
VIN = VIH or VIL
IOH = −1.3 mA
IOH = −2.0 mA
IOH = −2.6 mA
IOL = 20 mA
VIN = VIH or VIL
V
3.0
4.5
6.0
VIN = VIH or VIL
IOL = 1.3 mA
IOL = 2.0 mA
IOL = 2.6 mA
−
−
−
0.1
0.1
0.1
0.26
0.26
0.26
−
−
−
0.33
0.33
0.33
V
V
V
IIN
Input Leakage Current
6.0
VIN = VCC, GND
−
−
0.1
−
1.0
mA
ICC
Quiescent Supply Current
6.0
VIN = VCC, GND
−
−
1.0
−
10.0
mA
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3
NC7S14
AC ELECTRICAL CHARACTERISTICS
TA = +25C
TA = −40 to +85C
Min
Typ
Max
Min
Max
Unit
CL = 15 pF
−
4.5
21
−
−
ns
2.0
3.0
4.5
6.0
CL = 50 pF
−
−
−
−
20
12
8.5
7.5
100
27
20
17
−
−
−
−
125
35
25
21
ns
5.0
CL = 15 pF
−
3
8
−
−
ns
2.0
3.0
4.5
6.0
CL = 50 pF
−
−
−
−
25
16
11
9
125
35
25
21
−
−
−
−
145
45
30
24
ns
−
2
10
−
10
pF
−
7
−
−
−
pF
Symbol
Parameter
VCC (V)
tPLH,
tPHL
Propagation Delay (Figure 4, 6)
5.0
tTLH,
tTHL
Output Transition Time
(Figure 4, 6)
CIN
Input Capacitance
CPD
Power Dissipation Capacitance
(Figure 5)
Conditions
Open
5.0
(Note 2)
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
VCC
INPUT
OUTPUT
CL
CL includes load and stray capacitance
Input PRR = 1.0 MHz; tW = 500 ns
Figure 6. AC Waveforms
Figure 4. AC Test Circuit
VCC
A
INPUT
Input = AC Waveforms;
PRR = Variable; Duty Cycle = 50%.
Figure 5. ICCD Test Circuit
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4
NC7S14
ORDERING INFORMATION
Top Mark
Package Description
Shipping†
NC7S14M5X
7S14
SC−74A
3000 / Tape & Reel
NC7S14M5X−L22090
7S14
SOT23−5
3000 / Tape & Reel
NC7S14P5X
S14
SC−88A
3000 / Tape & Reel
NC7S14P5X−L22057
S14
SC−88A
3000 / Tape & Reel
NC7S14L6X
UU
SIP6, MicroPak
5000 / Tape & Reel
NC7S14L6X−L22175
UU
SIP6, MicroPak
5000 / Tape & Reel
Part Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
SCALE 2:1
5X
DATE 18 JAN 2018
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
e
D
A
L
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM
A
A1
b
c
D
E
E1
e
L
M
TOP VIEW
A
SIDE VIEW
DETAIL A
C
c
SEATING
PLANE
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
GENERIC
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
G
2.40
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
5X
1.00
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DATE 17 JAN 2013
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
GENERIC MARKING
DIAGRAM*
C
K
H
XXXMG
G
SOLDER FOOTPRINT
0.50
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23, 5 Lead
CASE 527AH
ISSUE A
DATE 09 JUN 2021
q
q
q
q
q
q1
q2
GENERIC
MARKING DIAGRAM*
XXXM
XXX = Specific Device Code
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34320E
SOT−23, 5 LEAD
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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