NC7S32
TinyLogic HS 2-Input OR
Gate
Description
The NC7S32 is a single 2−Input high performance CMOS OR Gate.
Advanced Silicon Gate CMOS fabrication assures high speed and low
power circuit operation over a broad VCC range. ESD protection
diodes inherently guard both inputs and output with respect to the VCC
and GND rails. Three stages of gain between inputs and outputs
assures high noise immunity and reduced sensitivity to input edge rate.
www.onsemi.com
MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
•
SIP6
CASE 127EB
Space Saving SC−74A and SC−88A 5−Lead Package
Ultra Small MicroPak™ Leadless Package
High Speed: tPD = 3.5 ns Typ
Low Quiescent Power: ICC < 1 mA
Balanced Output Drive: 2 mA IOL, −2 mA IOH
Broad VCC Operating Range: 2 V – 6 V
Balanced Propagation Delays
Specified for 3 V Operation
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
TTKK
XYZ
Pin 1
SC−74A
CASE 318BQ
SC−88A
CASE 419AC−01
7S32T
S32T
IEEE / IEC
A
B
≥1
Y
TT, 7S32, S32
KK
XY
Z
T
Figure 1. Logic Symbol
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Die Run Code
= Year Coding Scheme
= Plant Code Identifier
= Eight−Week Datacoding Scheme
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2003
July, 2019 − Rev. 4
1
Publication Order Number:
NC7S32/D
NC7S32
Pin Configurations
A 1
5
VCC
B 2
GND 3
4
Y
A 1
6 VCC
B 2
5 NC
GND 3
Figure 2. SC−88A and SC−74A (Top View)
4 Y
Figure 3. MicroPak (Top Through View)
PIN DESCRIPTIONS
FUNCTION TABLE (Y = A + B)
Pin Name
Description
Output
Inputs
A, B
Inputs
A
B
Y
Y
Output
L
L
L
No Connect
L
H
H
H
L
H
H
H
H
NC
H = HIGH Logic Level
L = LOW Logic Level
ABSOLUTE MAXIMUM RATINGS
Symbol
VCC
IIK
Parameter
Supply Voltage
DC Input Diode Current
VIN
DC Input Voltage
IOK
DC Output Diode Current
Min
Max
Unit
−0.5
6.5
V
mA
VIN ≤ −0.5 V
−
−20
VIN ≥ VCC + 0.5 V
−
+20
−0.5
VCC + 0.5
V
VOUT < −0.5 V
−
−20
mA
VOUT > VCC + 0.5 V
−
+20
−0.5
VCC + 0.5
V
VOUT
DC Output Voltage
IOUT
DC Output Source or Sink Current
−
±12.5
mA
DC VCC or Ground Current per Output Pin
−
±25
mA
ICC or IGND
TSTG
Storage Temperature
−65
+150
°C
TJ
Junction Temperature
−
+150
°C
TL
Lead Temperature (Soldering, 10 Seconds)
−
+260
°C
PD
Power Dissipation in Still Air
SC−74A
−
225
mW
SC−88A−5
−
190
MicroPak
−
327
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
www.onsemi.com
2
NC7S32
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
2.0
6.0
V
Input Voltage
0
VCC
V
Output Voltage
0
VCC
V
−40
+85
°C
VCC at 2.0 V
0
20
ns
VCC at 3.0 V
0
20
VCC at 4.5 V
0
10
VCC at 6.0 V
0
5
SC−74A
−
555
SC−88A−5
−
659
MicroPak
−
382
VCC
Supply Voltage
VIN
VOUT
TA
Operating Temperature
tr, tf
Input Rise and Fall Times
qJA
Conditions
Thermal Resistance
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
TA = +25°C
Symbol
Parameter
VCC (V)
Conditions
TA = −40 to +85°C
Min
Typ
Max
Min
Max
Unit
VIH
HIGH Level Input Voltage
2.0
3.0 − 6.0
1.50
0.7 VCC
−
−
−
−
1.50
0.7 VCC
−
−
V
VIL
LOW Level Input Voltage
2.0
3.0 − 6.0
−
−
−
−
0.50
0.3 VCC
−
−
0.50
0.3 VCC
V
VOH
HIGH Level Output Voltage
1.90
2.90
4.40
5.90
2.0
3.0
4.5
6.0
−
−
−
−
1.90
2.90
4.40
5.90
−
−
−
−
V
2.68
4.18
5.68
2.85
4.35
5.85
−
−
−
2.63
4.13
5.63
−
−
−
−
−
−
−
0.0
0.0
0.0
0.0
0.10
0.10
0.10
0.10
−
−
−
−
0.10
0.10
0.10
0.10
2.0
3.0
4.5
6.0
3.0
4.5
6.0
VOL
LOW Level Output Voltage
2.0
3.0
4.5
6.0
IOH = −20 mA
VIN = VIH
VIN = VIH
IOH = −1.3 mA
IOH = −2.0 mA
IOH = −2.6 mA
IOL = 20 mA
VIN = VIL
3.0
4.5
6.0
VIN = VIL
IOL = 1.3 mA
IOL = 2.0 mA
IOL = 2.6 mA
−
−
−
0.1
0.1
0.1
0.26
0.26
0.26
−
−
−
0.33
0.33
0.33
V
V
V
IIN
Input Leakage Current
6.0
VIN = VCC, GND
−
−
±0.1
−
±1.0
mA
ICC
Quiescent Supply Current
6.0
VIN = VCC, GND
−
−
1.0
−
10.0
mA
www.onsemi.com
3
NC7S32
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
TA = −40 to +85°C
Min
Typ
Max
Min
Max
Unit
CL = 15 pF
−
3.5
15
−
−
ns
2.0
3.0
4.5
6.0
CL = 50 pF
−
−
−
−
20
12
8
7
100
27
20
17
−
−
−
−
125
35
25
21
ns
5.0
CL = 15 pF
−
3.0
10
−
−
ns
2.0
3.0
4.5
6.0
CL = 50 pF
−
−
−
−
25
16
11
9
125
35
25
21
−
−
−
−
155
45
30
26
ns
−
2
10
−
10
pF
−
6
−
−
−
pF
Symbol
Parameter
VCC (V)
tPLH,
tPHL
Propagation Delay (Figure 4, 6)
5.0
tTLH,
tTHL
Output Transition Time
(Figure 4, 6)
CIN
Input Capacitance
CPD
Power Dissipation Capacitance
(Figure 5)
Conditions
Open
5.0
(Note 2)
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
VCC
INPUT
OUTPUT
CL
CL includes load and stray capacitance
Input PRR = 1.0 MHz; tW = 500 ns
Figure 4. AC Test Circuit
Figure 6. AC Waveforms
VCC
A
INPUT
Input = AC Waveforms;
PRR = Variable; Duty Cycle = 50%.
Figure 5. ICCD Test Circuit
www.onsemi.com
4
NC7S32
ORDERING INFORMATION
Top Mark
Package Description
Shipping†
NC7S32M5X
7S32
SC−74A
3000 / Tape & Reel
NC7S32P5X
S32
SC−88A
3000 / Tape & Reel
NC7S32L6X
TT
SIP6, MicroPak
5000 / Tape & Reel
Part Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5
NC7S32
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
www.onsemi.com
6
NC7S32
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5X
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
e
D
A
L
DETAIL A
TOP VIEW
A
SIDE VIEW
DETAIL A
C
c
SEATING
PLANE
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM
A
A1
b
c
D
E
E1
e
L
M
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
NC7S32
PACKAGE DIMENSIONS
SC−88A (SC−70 5 Lead), 1.25x2
CASE 419AC−01
ISSUE A
SYMBOL
MIN
A
0.80
D
e
e
E1 E
MAX
1.10
A1
0.00
0.10
A2
0.80
1.00
b
0.15
0.30
c
0.10
0.18
D
1.80
2.00
2.20
E
1.80
2.10
2.40
E1
1.15
1.25
1.35
0.65 BSC
e
0.26
L
L1
0.36
0.46
0.42 REF
0.15 BSC
L2
TOP VIEW
NOM
θ
0º
8º
θ1
4º
10º
q1
A2 A
q
q1
b
L
L1
A1
SIDE VIEW
c
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
www.onsemi.com
8
L2
NC7S32
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
◊
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
www.onsemi.com
9
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NC7S32/D
