NC7SP86L6X

DATA SHEET www.onsemi.com TinyLogic ULP-A Exclusive-OR Gate MARKING DIAGRAMS SIP6 1.45X1.0 MicroPak CASE 127EB NC7SP86 The NC7SP86 is a single 2−input exclusive−OR gate in tiny footprint packages. The device is designed to operate for VCC = 0.9 V to 3.6 V. Features • • • • • • • CCKK XYZ Pin 1 CC KK XY Z = Specific Device Code = 2−Digit Lot Run Traceability Code = 2−Digit Date Code = Assembly Plant Code Designed for 0.9 V to 3.6 V VCC Operation 2.2 ns tPD at 3.3 V (Typ) Inputs/Outputs Over−Voltage Tolerant up to 3.6 V IOFF Supports Partial Power Down Protection Source/Sink 2.6 mA at 3.3 V Available in SC−88A and MicroPak™ Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant SC−88A CASE 419A−02 XXXMG G XXX = Specific Device Code M = Date Code G = Pb−Free Package ORDERING INFORMATION A 1 5 VCC B 2 GND 3 4 Y A 1 6 VCC B 2 5 NC GND 3 See detailed ordering, marking and shipping information on page 6 of this data sheet. 4 Y SC−88A MicroPak Figure 1. Pinout Diagrams (Top Views) A B =1 Y Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin SC88A MicroPak Input 1 A A A Output B Y 2 B B L L L 3 GND GND L H H 4 Y Y H L H 5 VCC N.C. H H L 6 − VCC N.C. = No Connect © Semiconductor Components Industries, LLC, 2021 November, 2021 − Rev. 0 1 Publication Order Number: NC7SP86/D NC7SP86 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +4.3 V VIN DC Input Voltage −0.5 to +4.3 V −0.5 to VCC + 0.5 −0.5 to +4.3 −0.5 to +4.3 V VIN < GND −50 mA VOUT < GND −50 mA VOUT Characteristics DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±50 mA DC Supply Current per Supply Pin or Ground Pin ±50 mA ICC or IGND TSTG −65 to +150 °C TL Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) SC−88A MicroPak 377 154 °C/W PD Power Dissipation in Still Air SC−88A MicroPak 332 812 mW Level 1 − MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 2000 1000 V ±100 mA VESD ILatchup Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Transition Rise and Fall Time VCC = 3.3 V ± 0.3 V Min Max Unit 0.9 3.6 V 0 3.6 V 0 0 0 VCC 3.6 3.6 −40 +85 °C 0 10 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 NC7SP86 DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol VIH VIL VOH VOL Parameter Condition High−Level Input Voltage Low−Level Input Voltage High−Level Output Voltage Low−Level Output Voltage TA = −405C to +855C Min Typ Max Min Max 0.9 − 0.5 Unit − − − V 1.1 to 1.3 0.65 x VCC − − 0.65 x VCC − 0.65 x VCC − − 0.65 x VCC − 1.65 to 1.95 0.65 x VCC 1.4 to 1.6 − − 0.65 x VCC − VCC (V) 2.3 to 2.7 1.6 − − 1.6 − 3.0 to 3.6 2.1 − − 2.1 − 0.9 − 0.5 − − − 1.1 to 1.3 − − 0.35 x VCC − 0.35 x VCC 1.4 to 1.6 − − 0.35 x VCC − 0.35 x VCC 1.65 to 1.95 − − 0.35 x VCC − 0.35 x VCC 2.3 to 2.7 − − 0.7 − 0.7 3.0 to 3.6 − − 0.9 − 0.9 0.9 − VCC − 0.1 − − − 1.1 to 1.3 VCC − 0.1 − − VCC − 0.1 − 1.4 to 1.6 VCC − 0.1 − − VCC − 0.1 − 1.65 to 1.95 VCC − 0.1 − − VCC − 0.1 − 2.3 to 2.7 VCC − 0.1 − − VCC − 0.1 − VIN = VIH or VIL IOH = −20 mA V V 3.0 to 3.6 VCC − 0.1 − − VCC − 0.1 − IOH = −0.5 mA 1.1 to 1.3 0.75 x VCC − − 0.70 x VCC − IOH = −1 mA 1.4 to 1.6 1.07 − − 0.99 − IOH = −1.5 mA 1.65 to 1.95 1.24 − − 1.22 − IOH = −2.1 mA 2.3 to 2.7 1.95 − − 1.87 − IOH = −2.6 mA 3.0 to 3.6 2.61 − − 2.55 − VIN = VIH or VIL V 0.9 − 0.1 − − − 1.1 to 1.3 − − 0.1 − 0.1 1.4 to 1.6 − − 0.1 − 0.1 1.65 to 1.95 − − 0.1 − 0.1 2.3 to 2.7 − − 0.1 − 0.1 3.0 to 3.6 − − 0.1 − 0.1 IOL = 0.5 mA 1.1 to 1.3 − − 0.3 x VCC − 0.3 x VCC IOL = 1 mA 1.4 to 1.6 − − 0.31 − 0.37 IOL = 1.5 mA 1.65 to 1.95 − − 0.31 − 0.35 IOL = 2.1 mA 2.3 to 2.7 − − 0.31 − 0.33 IOL = 2.6 mA 3.0 to 3.6 − − 0.31 − 0.33 Input Leakage Current VIN = 0 V to 3.6 V 0.9 to 3.6 − − ±0.1 − ±0.5 mA IOFF Power Off Leakage Current VIN = 0 V to 3.6 V or VOUT = 0 V to 3.6 V 0 − − 0.5 − 0.5 mA ICC Quiescent Supply Current VIN = VCC or GND 0.9 to 3.6 − − 0.9 − 0.9 mA IIN IOL = 20 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NC7SP86 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS TA = 25°C Symbol Parameter tPLH, tPHL Propagation Delay, (A or B) to Y (Figures 3 and 4) tPLH, tPHL Propagation Delay, (A or B) to Y (Figures 3 and 4) tPLH, tPHL Propagation Delay, (A or B) to Y (Figures 3 and 4) Condition VCC (V) Min Typ RL = 1 MW, CL = 10 pF TA = −405C to +855C Max Min Max Unit ns 0.9 − 44.8 − − − 1.10 to 1.30 − 12.3 24.7 − 32.9 1.40 to 1.60 − 6.3 13.9 − 15.6 1.65 to 1.95 − 4.3 11.1 − 13.6 2.3 to 2.7 − 2.9 8.0 − 9.0 3.0 to 3.6 − 2.2 6.7 − 7.9 0.9 − 46.3 − − − 1.10 to 1.30 − 12.8 26.0 − 35.9 1.40 to 1.60 − 6.7 14.8 − 17.5 1.65 to 1.95 − 4.7 11.8 − 14.1 2.3 to 2.7 − 3.2 8.4 − 9.2 3.0 to 3.6 − 2.4 7.1 − 8.0 0.9 − 50.6 − − − 1.10 to 1.30 − 14.4 30.0 − 45.0 1.40 to 1.60 − 8.0 17.5 − 19.5 1.65 to 1.95 − 5.8 13.5 − 15.5 2.3 to 2.7 − 3.9 10.0 − 11.0 3.0 to 3.6 − 3.0 8.0 − 9.9 RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 30 pF ns ns CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Test Condition Typical (TA = 25°C) Unit Input Capacitance VCC = 0 V 2.0 pF COUT Output Capacitance VCC = 0 V 4.0 pF CPD Power Dissipation Capacitance (Note 5) f = 10 MHz, VCC = 0.9 to 3.6 V, VIN = 0 V or VCC 6.0 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD  VCC2  fin + ICC  VCC. www.onsemi.com 4 NC7SP86 OPEN 2 x VCC GND R1 INPUT OUTPUT DUT RL RT Test Switch Position tPLH / tPHL Open tPLZ / tPZL 2 x VCC tPHZ / tPZH GND CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH tPHL Vmo OUTPUT tPZH VOH Vmo ~VCC tPHZ VOH VOH − VY Vmo OUTPUT VOL ~0 V VCC, V Vmi, V Vmo, V VY, V 0.9 VCC / 2 VCC / 2 0.1 1.1 to 1.3 VCC / 2 VCC / 2 0.1 1.4 to 1.6 VCC / 2 VCC / 2 0.1 1.65 to 1.95 VCC / 2 VCC / 2 0.15 2.3 to 2.7 VCC / 2 VCC / 2 0.15 3.0 to 3.6 1.5 1.5 0.3 Figure 4. Switching Waveforms www.onsemi.com 5 NC7SP86 ORDERING INFORMATION Package Marking Pin 1 Orientation (See below) Shipping† NC7SP86P5X SC−88A P86 Q4 3000 / Tape & Reel NC7SP86L6X MicroPak L4 Q4 5000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Pin 1 Orientation in Tape and Reel MicroPak is a trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. www.onsemi.com 6 NC7SP86 PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O www.onsemi.com 7 NC7SP86 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J C K H SOLDER FOOTPRINT 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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