TinyLogic HST 2-Input
NAND Gate
NC7ST00
Description
The NC7ST00 is a single 2−Input high performance CMOS NAND
Gate, with TTL−compatible inputs. Advanced Silicon Gate CMOS
fabrication assures high speed and low power circuit operation. ESD
protection diodes inherently guard both inputs and output with respect
to the VCC and GND rails. High gain circuitry offers high noise
immunity and reduced sensitivity to input edge rate. The
TTL−compatible inputs facilitate TTL to NMOS / CMOS interfacing.
Device performance is similar to MM74HCT but with 1/2 the output
current drive of HC / HCT.
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MARKING
DIAGRAMS
Pin 1
Features
•
•
•
•
•
•
•
E3KK
XYZ
SIP6
CASE 127EB
Space Saving SC−74A and SC−88A 5−Lead Package
Ultra Small MicroPak™ Leadless Package
High Speed: tPD < 7 ns Typ, VCC = 5 V, CL = 15 pF
Low Quiescent Power: ICC < 1 mA Typ, VCC = 5.5 V
Balanced Output Drive: 2 mA IOL, −2 mA IOH
TTL−compatible Inputs
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
8S00MG
G
SC−74A
CASE 318BQ
SC−88A
CASE 419A−02
T00MG
G
IEEE / IEC
A
B
&
Y
E3, 8S00, T00
KK
XY
Z
M
G
Figure 1. Logic Symbol
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
January, 2021 − Rev. 3
1
Publication Order Number:
NC7ST00/D
NC7ST00
Pin Configurations
A 1
5
VCC
B 2
GND 3
4
Y
A 1
6 VCC
B 2
5 NC
GND 3
Figure 2. SC−88A and SC−74A (Top View)
4 Y
Figure 3. MicroPak (Top Through View)
PIN DESCRIPTIONS
FUNCTION TABLE (Y = AB)
Pin Names
Description
Output
Inputs
A, B
Inputs
A
B
Y
Y
Output
L
L
H
No Connect
L
H
H
H
L
H
H
H
L
NC
H = HIGH Logic Level
L = LOW Logic Level
ABSOLUTE MAXIMUM RATINGS
Symbol
VCC
IIK
Parameter
Supply Voltage
DC Input Diode Current
VIN
DC Input Voltage
IOK
DC Output Diode Current
Min
Max
Unit
−0.5
6.5
V
mA
VIN < 0 V
−
−20
VIN > VCC
−
+20
−0.5
VCC + 0.5
V
VOUT < 0 V
−
−20
mA
VOUT > VCC
−
+20
−0.5
VCC + 0.5
V
VOUT
Output Voltage
IOUT
DC Output Source or Sink Current
−
±12.5
mA
DC VCC or Ground Current per Supply Pin
−
±25
mA
ICC or IGND
TSTG
Storage Temperature
−65
+150
°C
TJ
Junction Temperature
−
+150
°C
TL
Lead Temperature (Soldering, 10 Seconds)
−
+260
°C
PD
Power Dissipation in Still Air
SC−74A
−
390
mW
SC−88A
−
332
MicroPak−6
−
812
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
NC7ST00
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
4.5
5.5
V
Input Voltage
0
VCC
V
Output Voltage
0
VCC
V
−40
+85
°C
VCC
Supply Voltage
VIN
VOUT
Conditions
TA
Operating Temperature
tr, tf
Input Rise and Fall Time
VCC = 5.0 V
0
10
ns/V
qJA
Thermal Resistance
SC−74A
−
320
°C/W
SC−88A
−
377
MicroPak−6
−
154
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
TA = +25°C
Symbol
Parameter
VCC (V)
Conditions
TA = −40 to +85°C
Min
Typ
Max
Min
Max
Unit
VIH
HIGH Level Input Voltage
4.5 − 5.5
2.0
−
−
2.0
−
V
VIL
LOW Level Input Voltage
4.5 − 5.5
−
−
0.8
−
0.8
V
VOH
HIGH Level Output Voltage
4.5
4.5
IOH = –20 mA
IOH = –2 mA
VIN = VIH or VIL
4.4
4.18
4.5
4.35
−
4.4
4.13
−
V
VOL
LOW Level Output Voltage
4.5
4.5
IOL = 20 mA
IOL = 2 mA
VIN = VIH or VIL
−
0
0.10
0.1
0.26
−
0.1
0.33
V
Input Leakage Current
5.5
0 ≤ VIN ≤ 5.5 V
−
−
±0.1
−
±1.0
mA
ICC
Quiescent Supply Current
5.5
VIN = VCC or GND
−
−
1.0
−
10.0
mA
ICCT
ICC per Input
5.5
One Input VIN = 0.5 V or
2.4 V, Other Input VCC or
GND
−
−
2.0
−
2.9
mA
IIN
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
Parameter
VCC (V)
tPLH, tPHL
Propagation Delay (Figure 4, 6)
5.0
4.5
Conditions
CL = 15 pF
CL = 50 pF
5.5
tTLH, tTHL
Output Transition Time
(Figure 4, 6)
CIN
Input Capacitance
Power Dissipation Capacitance
(Figure 5)
Typ
Max
Min
Max
Unit
−
3.4
12
−
−
ns
−
6.3
17
−
−
−
6.0
16
−
20
−
11.5
27
−
31
−
4.1
14
−
18
−
11.2
26
−
30
ns
5.0
CL = 15 pF
−
4
10
−
−
4.5
CL = 50 pF
−
11
25
−
31
−
10
21
−
26
−
2
10
−
−
pF
−
6
−
−
−
pF
5.5
CPD
TA = −40 to +85°C
Min
Open
5.0
(Note 2)
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current. Current consumption
(ICCD) at no output loading and operating at 50% duty cycle. (See Figure 5). CPD is related to ICCD dynamic operating current by the
expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
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3
NC7ST00
AC Loading and Waveforms
VCC
OUTPUT
INPUT
CL
CL includes load and stray capacitance
Input PRR = 1.0 MHz, tW = 500 ns
Figure 4. AC Test Circuit
Figure 6. AC Waveforms
VCC
A
INPUT
Input = AC Waveform;
PRR = Variable; Duty Cycle = 50%.
Figure 5. ICCD Test Circuit
ORDERING INFORMATION
Top Mark
Packages
Shipping†
NC7ST00M5X
8S00
SC−74A
3000 / Tape & Reel
NC7ST00P5X
T00
SC−88A
3000 / Tape & Reel
NC7ST00L6X
E3
SIP6, MicroPak
5000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
SCALE 2:1
5X
DATE 18 JAN 2018
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
e
D
A
L
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM
A
A1
b
c
D
E
E1
e
L
M
TOP VIEW
A
SIDE VIEW
DETAIL A
C
c
SEATING
PLANE
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
GENERIC
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
G
2.40
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
5X
1.00
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DATE 17 JAN 2013
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
GENERIC MARKING
DIAGRAM*
C
K
H
XXXMG
G
SOLDER FOOTPRINT
0.50
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
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and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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