NC7SU04L6X

DATA SHEET www.onsemi.com TinyLogic HS Unbuffered Inverter MARKING DIAGRAMS SIP6 CASE 127EB NC7SU04 E5KK XYZ Pin 1 Description The NC7SU04 is a single special purpose CMOS Inverter. The inverter circuit is designed with a single unbuffered stage to facilitate use in crystal oscillator applications. It is not intended for use in logic inversion applications. Advanced Silicon Gate CMOS fabrication assures high speed and low power circuit operation over a broad VCC range. ESD protection diodes inherently guard both input and output with respect to the VCC and GND rails. SC−74A CASE 318BQ 7SU4MG G SOT23−5 CASE 527AH 7SU4 M SC−88A CASE 419A−02 SU4MG G Features • • • • • • • • • Space Saving SOT23−5, SC−74A and SC−88A 5−Lead Package Ultra Small MicroPak™ Leadless Package Unbuffered for Crystal Oscillator Applications Low Quiescent Power: ICC < 1 mA Balanced Output Drive: 2 mA IOL, −2 mA IOH Broad VCC Operating Range: 2 V – 6 V Balanced Propagation Delays Specified for 3 V Operation These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 = Specific Device Code = 2−Digit Lot Run Traceability Code = 2−Digit Date Code Format = Assembly Plant Code = Data Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. IEEE / IEC A E5, 7SU4, SU4 KK XY Z M G Y Figure 1. Logic Symbol ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2004 June, 2022 − Rev. 4 1 Publication Order Number: NC7SU04/D NC7SU04 Pin Configurations NC 1 5 NC 1 VCC A 2 A 2 GND 3 4 Y GND 3 Figure 2. SOT23−5, SC−88A and SC−74A (Top View) 6 VCC 5 NC 4 Y Figure 3. MicroPak (Top Through View) PIN DESCRIPTIONS FUNCTION TABLE (Y = A) Pin Name Description Inputs Output A Input A Y Y Output L H No Connect H L NC H = HIGH Logic Level L = LOW Logic Level ABSOLUTE MAXIMUM RATINGS Symbol VCC Parameter Supply Voltage IIK DC Input Diode Current VIN DC Input Voltage IOK DC Output Diode Current VIN < 0 V VIN > VCC VOUT DC Output Voltage IOUT DC Output Source or Sink Current ICC or IGND Min Max Unit −0.5 6.5 V − −20 mA − +20 −0.5 VCC + 0.5 V VOUT < 0 V − −20 mA VOUT > VCC − +20 −0.5 VCC + 0.5 V − ±12.5 mA − ±25 mA TSTG DC VCC or Ground Current per Output Pin Storage Temperature −65 +150 °C TJ Junction Temperature − +150 °C TL Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation in Still Air SC−74A / SOT23−5 − 390 mW SC−88A − 332 MicroPak−6 − 812 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 NC7SU04 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 2.0 6.0 V Input Voltage 0 VCC V Output Voltage 0 VCC V −40 +85 °C SC−74A / SOT23−5 − 320 °C/W SC−88A − 377 MicroPak−6 − 154 VCC Supply Voltage VIN VOUT TA Operating Temperature qJA Thermal Resistance Conditions Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float. DC ELECTICAL CHARACTERISTICS TA = +25°C TA = −40 to +85°C Min Typ Max Min Max Unit VIH HIGH Level Input Voltage 2.0 3.0 4.5 6.0 1.70 2.45 3.60 4.80 − − − − − − − − 1.70 2.45 3.60 4.80 − − − − V VIL LOW Level Input Voltage 2.0 3.0 4.5 6.0 − − − − − − − − 0.30 0.50 0.90 1.20 − − − − 0.30 0.50 0.90 1.20 V VOH HIGH Level Output Voltage 2.0 3.0 4.5 6.0 1.80 2.50 4.00 5.50 2.0 3.0 4.5 5.9 − − − − 1.80 2.50 4.00 5.50 − − − − V 2.68 4.18 5.68 2.82 4.33 5.76 − − − 2.63 4.13 5.63 − − − − − − − 0.00 0.00 0.01 0.04 0.20 0.50 0.50 0.50 − − − − 0.20 0.50 0.50 0.50 Symbol Parameter VCC (V) 3.0 4.5 6.0 VOL LOW Level Output Voltage 2.0 3.0 4.5 6.0 Conditions IOH = −20 mA VIN = VIL VIN = GND IOH = −1.3 mA IOH = −2.0 mA IOH = −2.6 mA IOL = 20 mA VIN = VIH 3.0 4.5 6.0 VIN = VCC IOL = 1.3 mA IOL = 2.0 mA IOL = 2.6 mA − − − 0.11 0.12 0.15 0.26 0.26 0.26 − − − 0.33 0.33 0.33 V V V IIN Input Leakage Current 6.0 VIN = VCC, GND − − ±0.1 − ±1.0 mA ICC Quiescent Supply Current 6.0 VIN = VCC, GND − − 1.0 − 10.0 mA www.onsemi.com 3 NC7SU04 AC ELECTRICAL CHARACTERISTICS TA = +25°C TA = −40 to +85°C Min Typ Max Min Max Unit CL = 15 pF − 3 15 − − ns 2.0 3.0 4.5 6.0 CL = 50 pF − − − − 17 9 7 6.5 100 27 20 17 − − − − 125 35 25 21 ns 5.0 CL = 15 pF − 4 10 − − ns 2.0 3.0 4.5 6.0 CL = 50 pF − − − − 25 16 12 10 125 35 25 21 − − − − 155 45 31 26 ns − 2 10 − 10 pF − 4 − − − pF Symbol Parameter VCC (V) tPLH, tPHL Propagation Delay (Figure 4, 6) 5.0 tTLH, tTHL Output Transition Time (Figure 4, 6) CIN Input Capacitance CPD Power Dissipation Capacitance (Figure 5) Conditions Open 5.0 (Note 2) 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). AC Loading and Waveforms VCC INPUT OUTPUT CL CL includes load and stray capacitance Input PRR = 1.0 MHz; tW = 500 ns Figure 4. AC Test Circuit Figure 6. AC Waveforms VCC A INPUT Input = AC Waveform; PRR = Variable; Duty Cycle = 50%. Figure 5. ICCD Test Circuit www.onsemi.com 4 NC7SU04 ORDERING INFORMATION Top Mark Package Description Shipping† NC7SU04M5X 7SU4 SC−74A 3000 / Tape & Reel NC7SU04M5X−L22090 7SU4 SOT23−5 3000 / Tape & Reel NC7SU04P5X SU4 SC−88A 3000 / Tape & Reel NC7SU04P5X−L22057 SU4 SC−88A 3000 / Tape & Reel NC7SU04L6X E5 SIP6, MicroPak 5000 / Tape & Reel NC7SU04L6X−L22175 E5 SIP6, MicroPak 5000 / Tape & Reel Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13590G SIP6 1.45X1.0 DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−74A CASE 318BQ ISSUE B 5 1 SCALE 2:1 5X DATE 18 JAN 2018 b 0.20 C A B E1 5 M 4 1 2 E 3 B 0.05 A1 e D A L DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIM A A1 b c D E E1 e L M TOP VIEW A SIDE VIEW DETAIL A C c SEATING PLANE END VIEW RECOMMENDED SOLDERING FOOTPRINT* MILLIMETERS MIN MAX 0.90 1.10 0.01 0.10 0.25 0.50 0.10 0.26 2.85 3.15 2.50 3.00 1.35 1.65 0.95 BSC 0.20 0.60 0_ 10 _ GENERIC MARKING DIAGRAM* 0.95 PITCH XXX MG G XXX M G 2.40 = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) 5X 1.00 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Some products may not follow the Generic Marking. 5X 0.70 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON66279G SC−74A Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L SCALE 2:1 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DATE 17 JAN 2013 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J GENERIC MARKING DIAGRAM* C K H XXXMG G SOLDER FOOTPRINT 0.50 0.0197 XXX = Specific Device Code M = Date Code G = Pb−Free Package 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. mm Ǔ ǒinches STYLE 1: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 2: PIN 1. ANODE 2. EMITTER 3. BASE 4. COLLECTOR 5. CATHODE STYLE 3: PIN 1. ANODE 1 2. N/C 3. ANODE 2 4. CATHODE 2 5. CATHODE 1 STYLE 4: PIN 1. SOURCE 1 2. DRAIN 1/2 3. SOURCE 1 4. GATE 1 5. GATE 2 STYLE 6: PIN 1. EMITTER 2 2. BASE 2 3. EMITTER 1 4. COLLECTOR 5. COLLECTOR 2/BASE 1 STYLE 7: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 8: PIN 1. CATHODE 2. COLLECTOR 3. N/C 4. BASE 5. EMITTER STYLE 9: PIN 1. ANODE 2. CATHODE 3. ANODE 4. ANODE 5. ANODE DOCUMENT NUMBER: DESCRIPTION: 98ASB42984B STYLE 5: PIN 1. CATHODE 2. COMMON ANODE 3. CATHODE 2 4. CATHODE 3 5. CATHODE 4 Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SC−88A (SC−70−5/SOT−353) PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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